최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Solid state technology, v.40 no.7, 1997년, pp.217 - 222
Hendrickson, R.A. (Brooks Automation IncChelmsfordUSA)
Getting the most productivity/square foot of cleanroom space is a common goal for today's semiconductor fabs. A cost-effective fab line must use the appropriate number and type of process tools to balance wafer flow and meet production volume requirements. In addition to uptime, footprint, and operating cost, cluster tool throughput is an important factor in a tool's productivity index. Total cluster tool throughput depends on the interplay among the factory interface cycle (vent, cassette exchange, pumpdown), process cycle, and pipeline crossover cycle. These cycles and their relationship to each other need to be better understood. This article discusses a Throughput Predictor Model for quick simulation of various tool scenarios with a wide range of variables.(Author abstract)
※ AI-Helper는 부적절한 답변을 할 수 있습니다.