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NTIS 바로가기International journal of advanced manufacturing technology, v.106 no.7/8, 2020년, pp.3139 - 3151
Kim, Mincheol , Bang, Sangmin , Kim, Dong-Hyeon , Lee, Hyun-Taek , Kim, Geon-Hee , Ahn, Sung-Hoon
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Science BR Lawn 263 5150 1114 1994 10.1126/science.263.5150.1114 Lawn BR, Padture NP, Cait H, Guiberteau F (1994) Making ceramics “ductile”. Science 263(5150):1114-1116
Int J Mach Tools Manuf A Beaucamp 115 29 2017 10.1016/j.ijmachtools.2016.11.006 Beaucamp A et al (2017) Brittle-ductile transition in shape adaptive grinding (SAG) of SiC aspheric optics. Int J Mach Tools Manuf 115:29-37
10.1007/s40684-019-00103-7 Yan G, You K, Fang F (2019) Three-Linear-Axis Grinding of Small Aperture Aspheric Surfaces. Int J Precis Eng Manuf Green Technol:1-12
Trans Opt Soc L Rayleigh 19 1 38 1917 10.1088/1475-4878/19/1/302 Rayleigh L (1917) Polish. Trans Opt Soc 19(1):38
J Soc Glass Technol F Preston 11 214 1927 Preston F (1927) The theory and design of plate glass polishing machines. J Soc Glass Technol 11:214
J Mater Process Technol HY Tam 192 276 2007 10.1016/j.jmatprotec.2007.04.091 Tam HY, Cheng H, Wang Y (2007) Removal rate and surface roughness in the lapping and polishing of RB-SiC optical components. J Mater Process Technol 192:276-280
Adv Manuf Technol H Cheng XXII 65 2008 Cheng H et al (2008) Mechanisms for grinding and polishing of silicon carbide with loose abrasive sub-aperture tools. Adv Manuf Technol XXII:65
CIRP Ann Manuf Technol F Klocke 58 1 491 2009 10.1016/j.cirp.2009.03.120 Klocke F, Zunke R (2009) Removal mechanisms in polishing of silicon based advanced ceramics. CIRP Ann Manuf Technol 58(1):491-494
Int J Adv Manuf Technol M Tsai 80 9-12 1511 2015 10.1007/s00170-015-7023-4 Tsai M et al (2015) Investigation of increased removal rate during polishing of single-crystal silicon carbide. Int J Adv Manuf Technol 80(9-12):1511-1520
Appl Sci J-K Ho 6 3 89 2016 10.3390/app6030089 Ho J-K et al (2016) Investigation of polishing pads impregnated with Fe and Al2O3 particles for single-crystal silicon carbide wafers. Appl Sci 6(3):89
J Mater Sci Technol G Liu 26 2 125 2010 10.1016/S1005-0302(10)60020-5 Liu G et al (2010) Removal behaviors of different SiC ceramics during polishing. J Mater Sci Technol 26(2):125-130
ECS J Solid State Sci Technol A Kubota 4 12 P468 2015 10.1149/2.0271512jss Kubota A et al (2015) Abrasive-free polishing of single-crystal 4H-SiC with silica glass plates. ECS J Solid State Sci Technol 4(12):P468-P475
10.4028/www.scientific.net/KEM.625.437 Li ZL et al (2015) A study of computer controlled ultra-precision polishing of silicon carbide reflecting lenses for enhancing surface roughness. In: Key Engineering Materials. Trans Tech Publ
Adv Mech Eng Y Gu 9 11 168781401772909 2017 10.1177/1687814017729090 Gu Y et al (2017) Investigation of silicon carbide ceramic polishing by simulation and experiment. Adv Mech Eng 9(11):1687814017729090
CIRP Ann Manuf Technol B Lauwers 63 2 561 2014 10.1016/j.cirp.2014.05.003 Lauwers B et al (2014) Hybrid processes in manufacturing. CIRP Ann Manuf Technol 63(2):561-583
Kozak J, Rajurkar KP (2000) Hybrid machining process evaluation and development. In: Proceedings of 2nd international conference on machining and measurements of sculptured surfaces, Keynote Paper, Krakow
Int J Mach Tools Manuf S Sun 50 8 663 2010 10.1016/j.ijmachtools.2010.04.008 Sun S, Brandt M, Dargusch M (2010) Thermally enhanced machining of hard-to-machine materials-a review. Int J Mach Tools Manuf 50(8):663-680
Phys Procedia C Brecher 12 599 2011 10.1016/j.phpro.2011.03.076 Brecher C et al (2011) Laser-assisted milling of advanced materials. Phys Procedia 12:599-606
Int J Heat Mass Transf D-H Kim 71 264 2014 10.1016/j.ijheatmasstransfer.2013.12.021 Kim D-H, Lee C-M (2014) A study of cutting force and preheating-temperature prediction for laser-assisted milling of Inconel 718 and AISI 1045 steel. Int J Heat Mass Transf 71:264-274
J Mater Process Technol N Kobayashi 201 1-3 531 2008 10.1016/j.jmatprotec.2007.11.220 Kobayashi N et al (2008) Precision treatment of silicon wafer edge utilizing ultrasonically assisted polishing technique. J Mater Process Technol 201(1-3):531-535
Int J Mach Tools Manuf F-J Shiou 48 7-8 721 2008 10.1016/j.ijmachtools.2008.01.001 Shiou F-J, Ciou H-S (2008) Ultra-precision surface finish of the hardened stainless mold steel using vibration-assisted ball polishing process. Int J Mach Tools Manuf 48(7-8):721-732
CIRP Ann Manuf Technol H Suzuki 59 1 347 2010 10.1016/j.cirp.2010.03.117 Suzuki H et al (2010) Ultraprecision finishing of micro-aspheric surface by ultrasonic two-axis vibration assisted polishing. CIRP Ann Manuf Technol 59(1):347-350
10.4028/www.scientific.net/AMR.797.450 Lin WM et al (2013) Polishing Characteristics of a Low Frequency Vibration Assisted Polishing Method. In: Advanced Materials Research. Trans Tech Publ
Mater Manuf Process H Cheng 20 6 917 2005 10.1081/AMP-200060417 Cheng H et al (2005) Magnetorheological finishing of SiC aspheric mirrors. Mater Manuf Process 20(6):917-931
J Adv Mech Des Syst Manuf H Yamaguchi 3 1 35 2009 10.1299/jamdsm.3.35 Yamaguchi H et al (2009) Study of finishing of wafers by magnetic field-assisted finishing. J Adv Mech Des Syst Manuf 3(1):35-46
CIRP Ann Manuf Technol K Yamamura 60 1 571 2011 10.1016/j.cirp.2011.03.072 Yamamura K et al (2011) Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface. CIRP Ann Manuf Technol 60(1):571-574
Proc JSPE Semest Meet N Takahashi 2017S 519 2017 Takahashi N et al (2017) Study on laser assisted polishing of SiC. Proc JSPE Semest Meet 2017S:519-520
Mater Sci Eng A X Yang 707 159 2017 10.1016/j.msea.2017.09.043 Yang X et al (2017) Effects of artificial defect on the material residual strength of SiC ceramics after thermal-shock. Mater Sci Eng A 707:159-163
J Eur Ceram Soc P Shukla 37 9 3027 2017 10.1016/j.jeurceramsoc.2017.03.005 Shukla P et al (2017) Surface property modifications of silicon carbide ceramic following laser shock peening. J Eur Ceram Soc 37(9):3027-3038
ECS J Solid State Sci Technol C Wang 6 4 P105 2017 10.1149/2.0041704jss Wang C et al (2017) The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP). ECS J Solid State Sci Technol 6(4):P105-P112
10.1007/s00170-018-1743-1 Zhang X et al (2018) Study on the grinding behavior of laser-structured grinding in silicon nitride ceramic. Int J Adv Manuf Technol:1-11
Dahotre NB, Harimkar S (2008) Laser fabrication and machining of materials. Springer Science & Business Media
CIRP J Manuf Sci Technol A Stournaras 2 1 61 2009 10.1016/j.cirpj.2009.08.005 Stournaras A et al (2009) An investigation of quality in CO2 laser cutting of aluminum. CIRP J Manuf Sci Technol 2(1):61-69
G Chryssolouris 1 2013 Handbook of manufacturing engineering and technology Process of laser machining Chryssolouris G, Stavropoulos P, Salonitis K (2013) Process of laser machining, Handbook of manufacturing engineering and technology, pp 1-25
Int J Mach Tools Manuf S Agarwal 48 6 698 2008 10.1016/j.ijmachtools.2007.10.013 Agarwal S, Rao PV (2008) Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding. Int J Mach Tools Manuf 48(6):698-710
J Non-Cryst Solids T Suratwala 352 52-54 5601 2006 10.1016/j.jnoncrysol.2006.09.012 Suratwala T et al (2006) Sub-surface mechanical damage distributions during grinding of fused silica. J Non-Cryst Solids 352(52-54):5601-5617
Proc R Soc Lond A WH Bragg 88 605 428 1913 10.1098/rspa.1913.0040 Bragg WH, Bragg WL (1913) The reflection of X-rays by crystals. Proc R Soc Lond A 88(605):428-438
Mater Manuf Process M Islam 8 6 611 1993 10.1080/10426919308934870 Islam M, Campbell G (1993) Laser machining of ceramics: a review. Mater Manuf Process 8(6):611-630
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