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Sensors and actuators. A, Physical, v.89 no.1/2, 2001년, pp.43 - 48
Lee, Duck-Jung (Electronic Materials and Devices Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongryang, Seoul 130-650, South Korea) , Lee, Yun-Hi (Electronic Materials and Devices Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongryang, Seoul 130-650, South Korea) , Jang, Jin (Department of Physics, Kyunghee University, Seoul, South Korea) , Ju, Byeong-Kwon (Electronic Materials and Devices Research Center, Korea Institute of Science and Technology, P.O. Box 131, Cheongryang, Seoul 130-650, South Korea)
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AbstractIn this work, we have developed a new high vacuum packaging method using a glass-to-glass bonding with an intermediate amorphous silicon (a-Si) film for the application to microelectronic devices such as field emission display and plasma display panel. The glass-to-glass electrostatic bondin...
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