최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기대한금속 . 재료학회지 = Korean journal of metals and materials, v.58 no.3, 2020년, pp.175 - 181
Cho, Byung-Kyu , Hong, Seung-Chan , Kim, Byung-Sam , Cheon, Jae-Kyung
In recent automobile trends, the functions of opening and closing the vehicle door are accomplished by touch sensor and smart-phone NFC (Near Field Communication) systems. These convenience features are incorporated into the outdoor handle. However, this function can’t be used when chrome plat...
Eroglu 155 1993
Martin, B.Cao, Tracy, C.J., Mayer, J.W., Hendrickson, L.E.. A comparative study of Hillock formation in aluminum films. Thin solid films, vol.271, no.1, 64-68.
Rossnagel 12 1988
Metzner 222 2003
Laugier, M. Intrinsic stress in thin films of vacuum evaporated LiF and ZnS using an improved cantilevered plate technique. Vacuum, vol.31, no.3, 155-157.
Cammarata, R. C., Trimble, T. M., Srolovitz, D. J.. Surface stress model for intrinsic stresses in thin films. Journal of materials research, vol.15, no.11, 2468-2474.
Hoffman, R.W.. Stresses in thin films: The relevance of grain boundaries and impurities. Thin solid films, vol.34, no.2, 185-190.
Freund, L. B., Chason, Eric. Model for stress generated upon contact of neighboring islands on the surface of a substrate. Journal of applied physics, vol.89, no.9, 4866-4873.
Abermann, R.. Measurements of the intrinsic stress in thin metal films. Vacuum, vol.41, no.4, 1279-1282.
Floro, Jerrold A., Chason, Eric, Cammarata, Robert C., Srolovitz, David J.. Physical Origins of Intrinsic Stresses in Volmer-Weber Thin Films. MRS bulletin, vol.27, no.1, 19-25.
Saedi, Amirmehdi, Rost, Marcel J.. Thermodynamics of deposition flux-dependent intrinsic film stress. Nature communications, vol.7, 10733-.
Chason, E., Sheldon, B. W., Freund, L. B., Floro, J. A., Hearne, S. J.. Origin of Compressive Residual Stress in Polycrystalline Thin Films. Physical review letters, vol.88, no.15, 156103-.
Koch, R.. Stress in Evaporated and Sputtered Thin Films A Comparison. Surface & coatings technology, vol.204, no.12, 1973-1982.
Tello, Juan S., Bower, Allan F., Chason, Eric, Sheldon, Brian W.. Kinetic Model of Stress Evolution during Coalescence and Growth of Polycrystalline Thin Films. Physical review letters, vol.98, no.21, 216104-.
Pao, Chun-Wei, Foiles, Stephen M., Webb, Edmund B., Srolovitz, David J., Floro, Jerrold A.. Thin Film Compressive Stresses due to Adatom Insertion into Grain Boundaries. Physical review letters, vol.99, no.3, 036102-.
González-González, A., Polop, C., Vasco, E.. Postcoalescence Evolution of Growth Stress in Polycrystalline Films. Physical review letters, vol.110, no.5, 056101-.
Yu 141913 2014
Leib, J., Mönig, R., Thompson, C. V.. Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films. Physical review letters, vol.102, no.25, 256101-.
Guo, F., Martyniuk, M., Silva, D., Liu, Y., Brookshire, K., Faraone, L.. Effect of thermal annealing on stress relaxation and crystallisation of ion beam sputtered amorphous Si1-xGex thin films. Materials & Design, vol.156, 389-397.
Kang, Cheng-Wei, Huang, Han. Deformation, failure and removal mechanisms of thin film structures in abrasive machining. Advances in manufacturing, vol.5, no.1, 1-19.
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
오픈액세스 학술지에 출판된 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.