참고문헌 (30)

1. Andricacos, P. C., Uzoh, C., Dukovic, J. O., Horkans, J., Deligianni, H.. Damascene copper electroplating for chip interconnections. IBM journal of research and development, vol.42, no.5, 567-574.

   상세보기

2. Andricacos, Panos C.. Copper On-Chip Interconnections: A Breakthrough in Electrodeposition to Make Better Chips. The electrochemical society interface, vol.8, no.1, 32-37.

   상세보기

3. Havemann, R.H., Hutchby, J.A.. High-performance interconnects: an integration overview. Proceedings of the IEEE, vol.89, no.5, 586-601.

   상세보기

4. Moffat, T. P., Bonevich, J. E., Huber, W. H., Stanishevsky, A., Kelly, D. R., Stafford, G. R., Josell, D.. Superconformal Electrodeposition of Copper in 500-90 nm Features. Journal of the Electrochemical Society : JES, vol.147, no.12, 4524-.

   상세보기

5. West, Alan C., Mayer, Steven, Reid, Jonathan. A Superfilling Model that Predicts Bump Formation. Electrochemical and solid-state letters, vol.4, no.7, C50-.

   상세보기

6. Josell, D., Wheeler, D., Witt, C., Moffat, T. P.. Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers. Electrochemical and solid-state letters, vol.6, no.10, C143-.

   상세보기

7. Gabrielli, C., Moçotéguy, P., Perrot, H., Nieto-Sanz, D., Zdunek, A.. A model for copper deposition in the damascene process. Electrochimica acta, vol.51, no.8, 1462-1472.

   상세보기

8. Vereecken, P. M., Binstead, R. A., Deligianni, H., Andricacos, P. C.. The chemistry of additives in damascene copper plating. IBM journal of research and development, vol.49, no.1, 3-18.

   상세보기

9. Liu, Suli, Zhang, Zengsong, Bao, Jianchun, Lan, Yaqian, Tu, Wenwen, Han, Min, Dai, Zhihui. Controllable Synthesis of Tetragonal and Cubic Phase Cu₂Se Nanowires Assembled by Small Nanocubes and Their Electrocatalytic Performance for Oxygen Reduction Reaction. The journal of physical chemistry. C, Nanomaterials and Interfaces, vol.117, no.29, 15164-15173.

   상세보기

10. Hasegawa, Madoka, Negishi, Yoshinori, Nakanishi, Takuya, Osaka, Tetsuya. Effects of Additives on Copper Electrodeposition in Submicrometer Trenches. Journal of the Electrochemical Society : JES, vol.152, no.4, C221-.

    상세보기

11. Hasegawa, Madoka, Okinaka, Yutaka, Shacham-Diamand, Yosi, Osaka, Tetsuya. Void-Free Trench-Filling by Electroless Copper Deposition Using the Combination of Accelerating and Inhibiting Additives. Electrochemical and solid-state letters, vol.9, no.8, C138-.

    상세보기

12. Cho, Sung Ki, Kim, Myung Jun, Koo, Hyo-Chol, Kwon, Oh Joong, Kim, Jae Jeong. Low-resistivity Cu film electrodeposited with 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonate for the application to the interconnection of electronic devices. Thin solid films, vol.520, no.6, 2136-2141.

    상세보기

13. Lee, Jinhan, Lee, Jungju, Bae, Jonghak, Bang, Wonbae, Hong, Kimin, Lee, M. H., Pyo, Sung G., Kim, Sibum, Kim, Jin-Gyu. An Approach to the Development of Organic Additives for Electrodeposition of Narrow Copper Interconnects. Journal of the Electrochemical Society : JES, vol.153, no.7, C521-.

    상세보기

14. Josell, D., Wheeler, D., Huber, W. H., Moffat, T. P.. Superconformal Electrodeposition in Submicron Features. Physical review letters, vol.87, no.1, 016102-.

    상세보기

15. Moffat, T. P., Wheeler, D., Huber, W. H., Josell, D.. Superconformal Electrodeposition of Copper. Electrochemical and solid-state letters, vol.4, no.4, C26-.

    상세보기

16. Wheeler, D., Josell, D., Moffat, T. P.. Modeling Superconformal Electrodeposition Using The Level Set Method. Journal of the Electrochemical Society : JES, vol.150, no.5, C302-.

    상세보기

17. Moffat, T. P., Wheeler, D., Edelstein, M. D., Josell, D.. Superconformal film growth: Mechanism and quantification. IBM journal of research and development, vol.49, no.1, 19-36.

    상세보기

18. Solid State Technol. Reid J. D. 14 53 2010 

19. MANU, R, JAYAKRISHNAN, SOBHA. Influence of polymer additive molecular weight on surface and microstructural characteristics of electrodeposited copper. Bulletin of materials science, vol.34, no.2, 347-356.

    상세보기

20. Stoychev, D., Tsvetanov, C.. Behaviour of poly(ethylene glycol) during electrodeposition of bright copper coatings in sulfuric acid electrolytes. Journal of applied electrochemistry, vol.26, no.7,

    상세보기

21. Kelly, James J., West, Alan C.. Copper Deposition in the Presence of Polyethylene Glycol : II. Electrochemical Impedance Spectroscopy. Journal of the Electrochemical Society : JES, vol.145, no.10, 3477-3481.

    상세보기

22. Tan, Min, Harb, John N.. Additive Behavior during Copper Electrodeposition in Solutions Containing Cl[sup −], PEG, and SPS. Journal of the Electrochemical Society : JES, vol.150, no.6, C420-.

    상세보기

23. Tench, Dennis, Ogden, Cameron. A New Voltammetric Stripping Method Applied to the Determination of the Brightener Concentration in Copper Pyrophosphate Plating Baths. Journal of the Electrochemical Society : JES, vol.125, no.2, 194-198.

    상세보기

24. Patterson, A. L.. The Scherrer Formula for X-Ray Particle Size Determination. Physical review, vol.56, no.10, 978-982.

    상세보기

25. Kim, Jae Jeong, Kim, Soo-Kil, Kim, Yong Shik. Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization. Journal of electroanalytical chemistry, vol.542, 61-66.

    상세보기

26. Bonou, L, Eyraud, M, Denoyel, R, Massiani, Y. Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements. Electrochimica acta, vol.47, no.26, 4139-4148.

    상세보기

27. C. H.Tseng C. M.Liu H. W.Lin Y. C.Chu C.Chen D. R.Lyu K. N.Chen K. N.Tu ICEP‐IAAC 2015-2015 International Conference on Electronic Packaging and iMAPS All Asia Conference of ICEP 2015 p. 523. 

28. Suh, Hoyoung, Keum, Dongyeon, Kim, Jin-Gyu, Song, Kyung, Ko, Young-Dong, Chung, Jin-Seok, Hong, Kimin. Electroplating of Copper-Nickel Thin Films and Narrow Trenches. Electrochemical and solid-state letters, vol.14, no.12, H483-.

    상세보기

29. Rossnagel, S. M., Kuan, T. S.. Alteration of Cu conductivity in the size effect regime. Journal of vacuum science & technology. processing, measurement, and phenomena : an official journal of the American Vacuum Society. B, Microelectronics and nanometer structures, vol.22, no.1, 240-.

    상세보기

30. Josell, Daniel, Brongersma, Sywert H., T？kei, Zsolt. Size-Dependent Resistivity in Nanoscale Interconnects. Annual review of materials research, vol.39, 231-254.

    상세보기

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