Goh, C Y
,
Rahman, M N Y
,
Razlan, Z M
,
Bakar, S A
,
Wan, W K
,
Zunaidi, I
,
Harun, A
,
Hashim, M S M
,
Faizi, M K
,
Ibrahim, I
,
Kamarrudin, N S
,
Azmi, M S Muhamad
AbstractFever is happened when the human having infection or other illness which the body temperature is higher than normal body temperature. The heat load released during the fever cause the uncomfortable condition to the human. Thermoelectric is used in the design of heat exchanger to provide cool...
AbstractFever is happened when the human having infection or other illness which the body temperature is higher than normal body temperature. The heat load released during the fever cause the uncomfortable condition to the human. Thermoelectric is used in the design of heat exchanger to provide cooling by using electricity which reliefs the fever uncomfortable. The thermal comfort zone for human and the analysis of the heat load from the human head surface are determined. The analysis focuses on the fever teenagers aged range from 15 to 25. The range of the thermal comfort zone is from 20 °C to 25 °C whereas the range for the total heat load from the head surface is from 10.56 W to 16.39 W. The findings from the analysis will be used in the design of heat exchanger that suites the requirement from the analysis result. The fluid flow effect of the working fluid and thermal effect of the heat exchanger are simulated by ANSYS Fluent. In addition, the different types of Peltier plate and fluid as well as the different materials of heat exchanger and tube have applied into heat exchanger design model for observing the effect of the fluid flow in heat exchanger. Using ANSYS Fluent, the temperature contours are compared and found that the combination of alumina Al2O3 nanofluid, copper heat exchanger have better performance due to high heat transfer rate while the tube materials show no effect. The best performance of cooling in the design of the heat exchanger is proposed. These design criteria include the selection of the material of heat exchanger, tube and fluid as well as the selection of the device such as Peltier plate, battery, cooler fan and pump.
AbstractFever is happened when the human having infection or other illness which the body temperature is higher than normal body temperature. The heat load released during the fever cause the uncomfortable condition to the human. Thermoelectric is used in the design of heat exchanger to provide cooling by using electricity which reliefs the fever uncomfortable. The thermal comfort zone for human and the analysis of the heat load from the human head surface are determined. The analysis focuses on the fever teenagers aged range from 15 to 25. The range of the thermal comfort zone is from 20 °C to 25 °C whereas the range for the total heat load from the head surface is from 10.56 W to 16.39 W. The findings from the analysis will be used in the design of heat exchanger that suites the requirement from the analysis result. The fluid flow effect of the working fluid and thermal effect of the heat exchanger are simulated by ANSYS Fluent. In addition, the different types of Peltier plate and fluid as well as the different materials of heat exchanger and tube have applied into heat exchanger design model for observing the effect of the fluid flow in heat exchanger. Using ANSYS Fluent, the temperature contours are compared and found that the combination of alumina Al2O3 nanofluid, copper heat exchanger have better performance due to high heat transfer rate while the tube materials show no effect. The best performance of cooling in the design of the heat exchanger is proposed. These design criteria include the selection of the material of heat exchanger, tube and fluid as well as the selection of the device such as Peltier plate, battery, cooler fan and pump.
참고문헌 (5)
J. Therm. Biol. Baldry 76 8 2018 10.1016/j.jtherbio.2018.06.008 Thermal modelling of controlled scalp hypothermia using a thermoelectric cooling cap
Int. Commun. Heat Mass Transf. Ho 103 1 2019 10.1016/j.icheatmasstransfer.2019.02.001 Experimental study of cooling performance of water-based alumina nanofluid in a minichannel heat sink with MEPCM layer embedded in its ceiling
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