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NTIS 바로가기IEEE transactions on components, packaging, and manufacturing technology, v.11 no.7, 2021년, pp.1122 - 1136
Shin, Taein (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Park, Shinyoung (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Kim, Seongguk (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Kim, Subin (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Son, Kyungjune (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Park, Hyunwook (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Lho, Daehwan (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Cho, Kyungjun (SK Hynix, Icheon, South Korea) , Park, Gapyeol (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) , Gong, Kyubong (SK Hynix, Icheon, South Korea) , Jung, Seongtaek (Korea Advanced Institute o) , Kim, Joungho
In this article, we modeled, analyzed, and evaluated a large-scale memristor crossbar array in a neuromorphic system for a deep neural network (DNN) considering signal integrity (SI). Since hardware-based DNN using a memristor crossbar array operates in an analog way, it has serious reliability prob...
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IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers A 1.42 TOPS/W deep convolutional neural network recognition processor for intelligent IoE systems sim 0 264
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Cho, Kyungjun, Kim, Youngwoo, Lee, Hyunsuk, Kim, Heegon, Choi, Sumin, Song, Jinwook, Kim, Subin, Park, Junyong, Lee, Seongsoo, Kim, Joungho. Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface. IEEE transactions on components, packaging, and manufacturing technology, vol.8, no.9, 1658-1671.
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