$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[해외논문] Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

IEEE transactions on components, packaging, and manufacturing technology, v.11 no.7, 2021년, pp.1122 - 1136  

Shin, Taein (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Park, Shinyoung (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Kim, Seongguk (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Kim, Subin (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Son, Kyungjune (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Park, Hyunwook (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Lho, Daehwan (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Cho, Kyungjun (SK Hynix, Icheon, South Korea) ,  Park, Gapyeol (Korea Advanced Institute of Science and Technology, Daejeon, South Korea) ,  Gong, Kyubong (SK Hynix, Icheon, South Korea) ,  Jung, Seongtaek (Korea Advanced Institute o) ,  Kim, Joungho

Abstract AI-Helper 아이콘AI-Helper

In this article, we modeled, analyzed, and evaluated a large-scale memristor crossbar array in a neuromorphic system for a deep neural network (DNN) considering signal integrity (SI). Since hardware-based DNN using a memristor crossbar array operates in an analog way, it has serious reliability prob...

참고문헌 (29)

  1. 10.1109/EPEPS47316.2019.193227 

  2. Lee, Wooryong, Kim, Jingook. Accuracy Investigation of a Neuromorphic Machine Learning System Due to Electromagnetic Noises Using PEEC Model. IEEE transactions on components, packaging, and manufacturing technology, vol.9, no.10, 2066-2078.

  3. Elfadel, I.M., Deutsch, A., Smith, H.H., Rubin, B.J., Kopcsay, G.V.. A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis. IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society, vol.27, no.1, 71-78.

  4. Yu, S., Petranovic, D.M., Krishnan, S., Lee, Kwyro, Yang, C.Y.. Loop-based inductance extraction and modeling for multiconductor on-chip interconnects. IEEE transactions on electron devices, vol.53, no.1, 135-145.

  5. Proc Int Symp on Physical and Failure Analysis of Integrated Circuits Moore’s law: A CMOS scaling perspective tyagi 2007 10 

  6. Proc Int Interconnect Technol Conf Low-K interconnect stack with thick metal 9 redistribution layer and Cu die bump for 45 nm high volume manufacturing ingerly 2008 216 

  7. Mutual resistance in spicelink bracken 2000 

  8. Zysman, G.I., Johnson, A.K.. Coupled Transmission Line Networks in an Inhomogeneous Dielectric Medium. IEEE transactions on microwave theory and techniques, vol.17, no.10, 753-759.

  9. Cho, Kyungjun, Kim, Youngwoo, Lee, Hyunsuk, Song, Jinwook, Park, Junyong, Lee, Seongsoo, Kim, Subin, Park, Gapyeol, Son, Kyungjune, Kim, Joungho. Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via. IEEE transactions on components, packaging, and manufacturing technology, vol.9, no.1, 107-121.

  10. Nanotechnology On the variability of HfO? RRAM: From numerical simulation to compact modeling guan 2012 2012 815 

  11. Truong, Son Ngoc, Min, Kyeong-Sik. New Memristor-Based Crossbar Array Architecture with 50-% Area Reduction and 48-% Power Saving for Matrix-Vector Multiplication of Analog Neuromorphic Computing. Journal of semiconductor technology and science, vol.14, no.3, 356-363.

  12. Sze, Vivienne, Chen, Yu-Hsin, Yang, Tien-Ju, Emer, Joel S.. Efficient Processing of Deep Neural Networks: A Tutorial and Survey. Proceedings of the IEEE, vol.105, no.12, 2295-2329.

  13. 10.1109/SIBCON.2015.7147235 

  14. IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers A 0.62 mW ultra-low-power convolutional-neural-network face-recognition processor and a CIS integrated with always-on Haar-like face detector bong 0 248 

  15. Jain, Shubham, Sengupta, Abhronil, Roy, Kaushik, Raghunathan, Anand. RxNN: A Framework for Evaluating Deep Neural Networks on Resistive Crossbars. IEEE transactions on computer-aided design of integrated circuits and systems : a publication of the IEEE Circuits and Systems Society, vol.40, no.2, 326-338.

  16. 10.1109/EMCSI38923.2020.9191621 

  17. Sung, Changhyuck, Hwang, Hyunsang, Yoo, In Kyeong. Perspective: A review on memristive hardware for neuromorphic computation. Journal of applied physics, vol.124, no.15, 151903-.

  18. 10.7873/DATE.2015.0620 

  19. Son, Kyungjune, Cho, Kyungjun, Kim, Subin, Park, Shinyoung, Jung, Daniel H., Park, Junyong, Park, Gapyeol, Kim, Seongguk, Shin, Taein, Kim, Youngwoo, Kim, Joungho. Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing. IEEE transactions on components, packaging, and manufacturing technology, vol.10, no.5, 858-869.

  20. IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers A 1.42 TOPS/W deep convolutional neural network recognition processor for intelligent IoE systems sim 0 264 

  21. Proc Asia South Pacific Design Automat Conf Technological exploration of RRAM crossbar array for matrix-vector multiplication gu 2015 106 

  22. Cho, Kyungjun, Kim, Youngwoo, Lee, Hyunsuk, Kim, Heegon, Choi, Sumin, Song, Jinwook, Kim, Subin, Park, Junyong, Lee, Seongsoo, Kim, Joungho. Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface. IEEE transactions on components, packaging, and manufacturing technology, vol.8, no.9, 1658-1671.

  23. Nminibapiel, David M., Veksler, Dmitry, Shrestha, Pragya R., Campbell, Jason P., Ryan, Jason T., Baumgart, Helmut, Cheung, Kin P.. Impact of RRAM Read Fluctuations on the Program-Verify Approach. IEEE electron device letters : a publication of the IEEE Electron Devices Society, vol.38, no.6, 736-739.

  24. 10.1145/2897937.2898010 

  25. Ximeng Guan, Shimeng Yu, Wong, H-S P.. A SPICE Compact Model of Metal Oxide Resistive Switching Memory With Variations. IEEE electron device letters : a publication of the IEEE Electron Devices Society, vol.33, no.10, 1405-1407.

  26. Wang, Qian, Kim, Yongtae, Li, Peng. Neuromorphic Processors with Memristive Synapses : Synaptic Interface and Architectural Exploration. ACM journal on emerging technologies in computing systems, vol.12, no.4, 1-22.

  27. Shafiee, Ali, Nag, Anirban, Muralimanohar, Naveen, Balasubramonian, Rajeev, Strachan, John Paul, Hu, Miao, Williams, R. Stanley, Srikumar, Vivek. ISAAC : a convolutional neural network accelerator with in-situ analog arithmetic in crossbars. Computer architecture news, vol.44, no.3, 14-26.

  28. 10.1145/3218603.3218605 

LOADING...

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 논문

해당 논문의 주제분야에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

관련 콘텐츠

유발과제정보 저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로