[논문]Selective Deposition of Copper on Self-Assembled Block Copolymer Surfaces via Physical Vapor Deposition

Lee, Sangho; Lee, Wonmoo; Jung, Hee-Tae; Ross, Caroline A.

doi:10.1021/acsami.1c15272

[해외논문] Selective Deposition of Copper on Self-Assembled Block Copolymer Surfaces via Physical Vapor Deposition

ACS applied materials & interfaces, v.13 no.44, 2021년, pp.52931 - 52937

Lee, Sangho (Department of Materials Science and Engineering , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States) , Lee, Wonmoo (Department of Materials Science and Engineering , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States) , Jung, Hee-Tae , Ross, Caroline A.

Abstract ▼ AI-Helper

Block copolymer (BCP) self-assembly produces chemically and topographically patterned surfaces which are used to guide the formation of Cu nanostructures by exploiting differences in the mobility of vapor-deposited species on each microdomain. Cu metal films a few nm thick were deposited on three different BCP surfaces self-assembled from poly(styrene-b-methyl methacrylate) (PS-b-PMMA) and polystyrene-b-poly(2-vinylpyridine) (PS-b-P2VP). For PS-b-PMMA, the effects of chemical heterogeneity dominate over the effects of the 2 nm peak-to-valley topography, and sputtered Cu preferentially wets the PS block. PS-b-P2VP has greater chemical and topographical contrast and shows a wider process window for selective deposition. Cu grown by evaporation has less surface mobility, and shadowing effects are believed to dominate pattern formation. The hierarchical self-assembly process of thin metal films on BCP surfaces provides a route to fabricating heterogeneous metallic nanostructures.[FIG OMISSION]

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