[논문]Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing

Kim, Mi-Song; Hong, Won Sik; Kim, Myeongin

doi:10.5781/jwj.2021.39.4.3

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing 원문보기

Journal of welding and joining = 대한용접·접합학회지, v.39 no.4, 2021년, pp.359 - 367

Kim, Mi-Song , Hong, Won Sik , Kim, Myeongin

Abstract ▼ AI-Helper

In this study, thermo-compression(TC) and vacuum reflow(VR) bonding processes of fine pitch interconnection were optimized using Type 7 Sn-3.0Ag-0.5Cu solder paste. A chip with Cu pillar Sn-2.5Ag bumps and BT substrate with ENEPIG surface finish were used, and the thickness and the aperture ratio of the metal mask were 30 ㎛/50 ㎛ and 70%/100%, respectively. As a result of optimizing the printing process, a metal mask with a thickness of 30 ㎛ and an aperture ratio of 100% was selected. As a result of the TC and VR bonding processes optimization, Cu6Sn5 and (Cu,Ni)6Sn5 IMC layers were formed on the top and bottom of the solder joint, respectively. In the conventional TC process sample, the thickness of the solder was measured to be 4.1 ㎛, and the IMC thickness ratio was calculated to be 40%. Also, in the TC and VR process samples with solder paste, the thickness of the solder was measured to be 6.5 ㎛ and 10.3 ㎛, respectively, and the ratio of the IMC thickness was calculated to be about 32% and 43%. It was expected that it would be beneficial to reliability by reducing the occurrence and propagation of cracks in the solder joint due to the effect of lowering the IMC thickness ratio as the volume of the solder becomes larger than that of the conventional TC process.

참고문헌 (11)

Fine Pitch Surface Mount Technology Ahn 30 1995
유세훈, 이창우. 3D 전자패키징용 관통실리콘비아의 충진 및 미세피치 접합기술. 大韓溶接·接合學會誌 = Journal of the Korean Welding and Joining Society, vol.27, no.3, 17-22.

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Study of Interconnection Process for Fine Pitch Flip Chip Lee 234 2009
Kim, Mi-Song, Kang, Myoung-Seok, Bang, Jung-Hwan, Lee, Chang-Woo, Kim, Mok-Soon, Yoo, Sehoon. Interfacial reactions of fine-pitch Cu/Sn–3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies. Journal of alloys and compounds, vol.616, 394-400.

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Recent Trends of Flip Chip Bonding Technology Choi 100
Kim, Sujong, Hong, Wonsik, Nam, Hyunbin, Kang, Namhyun. Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration. Journal of welding and joining = 대한용접·접합학회지, vol.39, no.1, 89-102.

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Back, Jong-Hoon, Yoo, Sehoon, Han, Deok-Gon, Jung, Seung-Boo, Yoon, Jeong-Won. Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints. Journal of welding and joining = 대한용접·접합학회지, vol.36, no.5, 52-60.

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Ha, S.S., Kim, D.G., Kim, J.W., Yoon, J.W., Joo, J.H., Shin, Y.E., Jung, S.B.. Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method. Microelectronic engineering, vol.84, no.11, 2640-2645.

상세보기
Back, Jong-Hoon, Yoo, Sehoon, Han, Deok-Gon, Jung, Seung-Boo, Yoon, Jeong-Won. Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint. Journal of welding and joining = 대한용접·접합학회지, vol.35, no.6, 51-58.

상세보기
Li, Junhui, Zhang, Yuexin, Zhang, Haoliang, Chen, Zhuo, Zhou, Can, Liu, Xiaohe, Zhu, Wenhui. The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding. Microelectronics reliability, vol.104, 113543-.

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10.1109/ECTC.2016.127

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Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing 원문보기

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