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NTIS 바로가기IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, v.34 no.4, 2021년, pp.464 - 474
Lee, Jea Hoon (Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea) , Moon, Il-Chul (Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea) , Oh, Rosy (Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea)
Searching for and comparing similar wafer maps can provide crucial information for root cause analysis in the manufacturing process of integrated circuits. Owing to the high dimensionality and complexity of defect patterns, comparison of similar maps in their entirety is inefficient. This paper prop...
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Jianbo Yu, Xiaolei Lu. Wafer Map Defect Detection and Recognition Using Joint Local and Nonlocal Linear Discriminant Analysis. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.29, no.1, 33-43.
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Tao Yuan, Way Kuo, Suk Joo Bae. Detection of Spatial Defect Patterns Generated in Semiconductor Fabrication Processes. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.24, no.3, 392-403.
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Hwang, Jonghyun, Kim, Heeyoung. Variational Deep Clustering of Wafer Map Patterns. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.33, no.3, 466-475.
Li, Katherine Shu-Min, Liao, Peter Yi-Yu, Cheng, Ken Chau-Cheung, Chen, Leon Li-Yang, Wang, Sying-Jyan, Huang, Andrew Yi-Ann, Chou, Leon, Han, Gus Chang-Hung, Chen, Jwu E., Liang, Hsin-Chung, Hsu, Chung-Lung. Hidden Wafer Scratch Defects Projection for Diagnosis and Quality Enhancement. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.34, no.1, 9-16.
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Park, Seyoung, Jang, Jaeyeon, Kim, Chang Ouk. Discriminative feature learning and cluster-based defect label reconstruction for reducing uncertainty in wafer bin map labels. Journal of intelligent manufacturing, vol.32, no.1, 251-263.
Santos, Tiago, Schrunner, Stefan, Geiger, Bernhard C., Pfeiler, Olivia, Zernig, Anja, Kaestner, Andre, Kern, Roman. Feature Extraction From Analog Wafermaps: A Comparison of Classical Image Processing and a Deep Generative Model. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.32, no.2, 190-198.
Chen, Fei-Long, Liu, Shu-Fan. A neural-network approach to recognize defect spatial pattern in semiconductor fabrication. IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, vol.13, no.3, 366-373.
Hsu, Shao-Chung, Chien, Chen-Fu. Hybrid data mining approach for pattern extraction from wafer bin map to improve yield in semiconductor manufacturing. International journal of production economics, vol.107, no.1, 88-103.
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