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NTIS 바로가기Circuit world : journal of the Institute of Circuit Technology, technical journal of the Printed Circuit and Interconnection Foundation, v.28 no.1, 2002년, pp.29 - 33
Stubbs, D.M. , Pulko, S.H. , Wilkinson, A.J.
Numerical modelling is used to predict the thermal behaviour of embedded passive components in multi‐layer PCBs. A three‐signal layer PCB, containing embedded resistors of dimensions 0.3 6 0.3mm and thickness 0.1μm, is used to generate thermal design rules that can be applied to a w...
Frye, R.C., Yeong, J.Y., Smoth, P.R. and Yicheng, L. (1999), “Integrated spiral transformers”, 1999 International Conference on High Density Packaging and MCMs, pp. 43843.
Liu, D.R., Kennedy, M., Korony, G., Makl, S., Mevissen, J.P., Hock, J.M. and Heistand R. II (1999), “Integrated thin film capacitor arrays”, 1999 International Conference on High Density Packaging and MCMs, pp. 4317.
10.1007/BF02662823 Sarvar, F., Poole, N.J. and Witting, P.A. (1990), “PCB glassfibre laminates: thermal conductivity measurements and their effect on simulation’, Journal of Electronic Materials, Vol. 19, pp. 134550.
10.1108/13565360010332372 Stubbs, D.M., Pulko, S.H., Wilkinson, A.J., Wilson, B., Christiaens, F. and Allaert, K. (2000), “Embedded passive components and PCB size - thermal effects”, Microelectronics International, Vol. 17 No. 2, pp. 710.
Vitriol, W.A., Bates, D.A., Street, R.J. and Hautanimei, W.P. (1999), “Embedded capacitors and resistors within low temperature cofired ceramics on metal (DIPAK) packages for millimetre wave applications”, 1999 International Conference on High Density Packaging and MCMs.
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