[논문]Lift-Off Ablation of Metal Thin Films for Micropatterning Using Ultrashort Laser Pulses

Kim, Byunggi; Nam, Han-Ku; Kim, Young-Jin; Kim, Seung-Woo

doi:10.3390/met11101586

[해외논문] Lift-Off Ablation of Metal Thin Films for Micropatterning Using Ultrashort Laser Pulses 원문보기

Metals, v.11 no.10, 2021년, pp.1586 -

Kim, Byunggi (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea) , Nam, Han-Ku (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea) , Kim, Young-Jin (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea) , Kim, Seung-Woo (Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Korea)

Abstract ▼ AI-Helper

Laser ablation of metal thin films draws attention as a fast means of clean micropatterning. In this study, we attempt to remove only the metal thin film layer selectively without leaving thermal damage on the underneath substrate. Specifically, our single-pulse ablation experiment followed by two-temperature analysis explains that selective ablation can be achieved for gold (Au) films of 50-100 nm thickness by the lift-off process induced as a result of vaporization of the titanium (Ti) interlayer with a strong electron-phonon coupling. With increasing the film thickness comparable to the mean free path of electrons (100 nm), the pulse duration has to be taken shorter than 10 ps, as high-temperature electrons generated by the ultrashort pulses transfer heat to the Ti interlayer. We verify the lift-off ablation by implementing millimeters-scale micropatterning of optoelectronic devices without degradation of optical properties.

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[해외논문] Lift-Off Ablation of Metal Thin Films for Micropatterning Using Ultrashort Laser Pulses 원문보기

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[해외논문] Lift-Off Ablation of Metal Thin Films for Micropatterning Using Ultrashort Laser Pulses 원문보기

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