최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Circuit world : journal of the Institute of Circuit Technology, technical journal of the Printed Circuit and Interconnection Foundation, v.31 no.4, 2005년, pp.42 - 46
Schroeder, Sabine
Purpose - To provide information about latest product developments to address and take away the fear of whisker formation on pure immersion tin surface finishes on PCBs. Design/methodology/approach - This paper summarises the latest findings on whisker formation of pure tin surface fin...
Arnold, S. (1959), “Growth of metal whiskers on electrical components”, Proceedings of Electrical Components Conference, pp. 7582.
Koonce, S. and Arnold, S. (1952), Growth of Metal Whiskers, Unknown Publisher (only the Letters to the editor at the Bell Telephone Laboratories, Murray Hill, NJ), 8 December.
10.1016/S1359-6454(98)00045-7 Lee, B. and Lee, D. (1998), “Spontaneous growth mechanism of tin whiskers”, Acta Mater, Vol. 46 No. 10, pp. 370114.
10.1108/03056120110367131 Schetty, R. (2000), “Minimization of tin whisker formation for lead free electronics finishing”, Proceedings IPC Works Conference, Miami.
Zhang, Y., Su, C., Fan, C. and Abys, J. (2000), “Understanding whisker phenomenon: the driving force for whisker formation”, Circuitree, January.
Zhang, Y., Breck, G.,Humiec, F.,Murski, K. and Abys, J.A. (1996), “An alternative surface finish for tin/lead solders: pure tin”, Tin SMI'96 Proceedings, San Jose, CA, September.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.