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NTIS 바로가기Journal of micromechanics and microengineering.: structures, devices, and systems, v.16 no.9, 2006년, pp.1841 - 1846
Rao, Vempati Srinivasa (Institute of Microelectronics, 11 Science Park Road, Science Park II, 117685, Singapore) , Kripesh, Vaidyanathan (Institute of Microelectronics, 11 Science Park Road, Science Park II, 117685, Singapore) , Yoon, Seung Wook (Institute of Microelectronics, 11 Science Park Road, Science Park II, 117685, Singapore) , Tay, Andrew A O (Nano)
The development of thick photoresist molds using JSR THB-151N negative tone UV photoresist for the electroplating of interconnects in advanced packaging technologies has been demonstrated. Two different thick photoresist molds 65 and 130 µm high with aspect ratios of up to 2.6 have been fabrica...
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2001 Fundamentals of Microsystems Packaging Tummala R R
1999 51 22 J. Met. Frear D R
1999 76 Proc. APACK Goodman T Elenius P
1997 10.1088/0960-1317/7/3/010 7 121 0960-1317 J. Micromech. Microeng. Lorenz H
1997 518 IEEE 10th Annual Int. Workshop on Micro Electro Mechanical Systems Despont M Lorenz H Fahrni N Brugger J Renaud P Vettiger P
2002 10.1088/0960-1317/12/4/303 12 368 0960-1317 J. Micromech. Microeng. Conradie E H
2002 10.1088/0960-1317/12/4/317 12 444 0960-1317 J. Micromech. Microeng. Brunet M
Kukharenka, E., Kraft, M.. Realization of electroplating molds with thick positive SPR 220-7 photoresist. Journal of materials science. Materials in electronics, vol.14, no.5, 319-322.
1999 10.1088/0960-1317/9/2/001 9 105 0960-1317 J. Micromech. Microeng. Roth S
Löchel, B., Maciossek, A., König, M., Quenzer, H.J., Huber, H.-L.. Galvanoplated 3D structures for micro systems. Microelectronic engineering, vol.23, no.1, 455-459.
Engelmann, G., Reichl, H.. High depth to width aspect ratios in thick positive photoresist layers using near UV lithography. Microelectronic engineering, vol.17, no.1, 303-306.
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