최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Optics and lasers in engineering, v.46 no.5, 2008년, pp.404 - 409
Wang, X.C. (Singapore Institute of Manufacturing Technology (SIMTech), 71 Nanyang Drive, Singapore 638075, Singapore) , Li, Z.L. , Chen, T. , Lok, B.K. , Low, D.K.Y.
The 355nm DPSS UV laser cutting of electronics printed circuit board (PCB) substrates including FR4, and BT/epoxy-based PCB substrates was investigated. The effects of various laser conditions such as scanning speed, assisting gas, repetition rate, and interval between scans on the heat affected zon...
Meier D, Schmidt SH. PCB laser technology for rigid and flex HDI-via formation, structuring and routing. In: IPC Printed Circuits Expo 2002, ADD-2-1-5.
OnBoard Technol Huske 6 18 2006 Burr and stress-free cutting of flexible printed circuits
OnBoard Technol Lange 2 12 2005 PCB machining and repair via laser
J Mater Process Technol Yung 122 278 2002 10.1016/S0924-0136(01)01177-3 A study of the heat-affected zone in the UV YAG laser drilling of GFRP materials
J Appl Phys Srinivasan 78 4881 1995 10.1063/1.359776 Chemical transformations of the polyimide kapton brought by ultraviolet laser radiation
J Appl Phys Singleton 66 3324 1989 10.1063/1.344128 XeCl laser ablation of polyimide: influence of ambient atmosphere on particulate and gaseous products
Appl Phys Lett Kuper 60 1633 1992 10.1063/1.107223 Ambient gas effects on debris formed during KrF laser ablation of polyimide
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.