Hu, S.C.
(Department of Energy and Refrigerating Air-Conditioning Engineering, National Taipei University of Technology, 1 Sec. 3, Chung-Hsiao E. Rd. Taipei 106, Taiwan)
,
Wu, J.S.
,
Chan, D.Y.L.
,
Hsu, R.T.C.
,
Lee, J.C.C.
Benchmarking is an important step in implementing energy conservation in a semiconductor fabrication plant (hereafter referred to as ''fab''). A semiconductor cleanroom facility system is complicated, usually comprised of several sub-systems, such as a chilled water system, a make-up system, an exha...
Benchmarking is an important step in implementing energy conservation in a semiconductor fabrication plant (hereafter referred to as ''fab''). A semiconductor cleanroom facility system is complicated, usually comprised of several sub-systems, such as a chilled water system, a make-up system, an exhaust air system, a compressed air system, a process cooling water (PCW) system, a nitrogen system, a vacuum system, and an ultra-pure water (UPW) system. It is a daunting task to allocate energy consumption and determine an optimum benchmark. This study aims to establish the energy benchmark of a typical 8-in. DRAM semiconductor fab through field measurement data. Results of the measured energy consumption index were: chilled water system (including chiller, chilled water pump and cooling tower): 0.257kW/kW (=0.9kW/RT) in summer and 0.245kW/kW (=0.86kW/RT) in winter air recirculation air system: 0.00018kWh/m3 make-up air system: 0.0042kWh/m3 general exhaust air system: 0.0007kWh/m3 solvent exhaust air system: 0.0021kWh/m3 acid exhaust air system: 0.0009kWh/m3 alkaline exhaust air system: 0.0025kWh/m3 nitrogen system: 0.2209kWh/m3 compressed dry air system: 0.2250kWh/m3 process cooling water system: 1.3535kWh/m3 and ultra-pure water system: 9.5502kWh/m3. These data can be used to assess the efficiency of different energy-saving schemes and as a good reference for factory authorities. The PCW system's status before and after implementing energy conservation is discussed.
Benchmarking is an important step in implementing energy conservation in a semiconductor fabrication plant (hereafter referred to as ''fab''). A semiconductor cleanroom facility system is complicated, usually comprised of several sub-systems, such as a chilled water system, a make-up system, an exhaust air system, a compressed air system, a process cooling water (PCW) system, a nitrogen system, a vacuum system, and an ultra-pure water (UPW) system. It is a daunting task to allocate energy consumption and determine an optimum benchmark. This study aims to establish the energy benchmark of a typical 8-in. DRAM semiconductor fab through field measurement data. Results of the measured energy consumption index were: chilled water system (including chiller, chilled water pump and cooling tower): 0.257kW/kW (=0.9kW/RT) in summer and 0.245kW/kW (=0.86kW/RT) in winter air recirculation air system: 0.00018kWh/m3 make-up air system: 0.0042kWh/m3 general exhaust air system: 0.0007kWh/m3 solvent exhaust air system: 0.0021kWh/m3 acid exhaust air system: 0.0009kWh/m3 alkaline exhaust air system: 0.0025kWh/m3 nitrogen system: 0.2209kWh/m3 compressed dry air system: 0.2250kWh/m3 process cooling water system: 1.3535kWh/m3 and ultra-pure water system: 9.5502kWh/m3. These data can be used to assess the efficiency of different energy-saving schemes and as a good reference for factory authorities. The PCW system's status before and after implementing energy conservation is discussed.
Energy Saving Technology and Energy Consumption Calculation Method for Semiconductor Plants, Energy Commission Report, Japan Air Cleaning Association (JACA), November 2001 (in Japanese).
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