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NTIS 바로가기IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society, v.32 no.2, 2009년, pp.339 - 346
Kyung-Woon Jang (Mechatron.&Manuf. Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea) , Kyung-Wook Paik
In this paper, the effects of heating rate during anisotropic conductive film (ACF) curing processes on ACF material properties such as thermomechanical and rheological properties were investigated. It was found that as the heating rate increased, the coefficient of thermal expansion (CTE) of the AC...
Properties of Polymers krevelen 1997
Kristiansen, H., Liu, J.. Overview of conductive adhesive interconnection technologies for LCDs. IEEE transactions on components, packaging, and manufacturing technology. a publication of the IEEE Components, Packaging, and Manufacturing Technology Society. Part A, vol.21, no.2, 208-214.
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Woon-Seong Kwon, Kyung-Wook Paik. Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection. IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society, vol.29, no.3, 528-534.
Li, Shanjun, Shen, Jinsong, Chen, Xiangxu, Chen, Rui, Luo, Xiaowen. Studies on relaxation and thermal expansion behavior of polysiloxane-modified epoxy resin. Journal of macromolecular science. Part B : Physics, vol.36, no.3, 357-366.
Nielsen, Lawrence E.. Cross-Linking-Effect on Physical Properties of Polymers. Journal of macromolecular science. Reviews in macromolecular chemistry, vol.3, no.1, 69-103.
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