[논문]A Parallel-Structure Solder Paste Inspection System

Xinyu Wu; Hang Tong; Wing Kwong Chung; Jun Cheng; Yangsheng Xu

doi:10.1109/TMECH.2009.2009638

A Parallel-Structure Solder Paste Inspection System

IEEE/ASME transactions on mechatronics : a joint publication of the IEEE Industrial Electronics Society and the ASME Dynamic Systems and Control Division, v.14 no.5, 2009년, pp.590 - 597

Xinyu Wu (Dept. of Mech.&Autom. Eng., Chinese Univ. of Hong Kong, Hong Kong, China) , Hang Tong (Dept. of Mech.&Autom. Eng., Chinese Univ. of Hong Kong, Hong Kong, China) , Wing Kwong Chung (Dept. of Mech.&Autom. Eng., Chinese Univ. of Hong Kong, Hong Kong, China) , Jun Cheng (Dept. of Mech.&Autom. Eng., Chinese Univ. of Hong Kong, Hong Kong, China) , Yangsheng Xu

Abstract ▼ AI-Helper

In this paper, we present an innovative design of a solder paste inspection system that can be practically integrated into existing solder paste printing machines. Since solder paste inspection systems usually occupy a large vertical space, we designed a mirror box that can redirect the transmission of fringe patterns. In this way, a new parallel-structure solder paste inspection system with a significant reduction in the vertical constraint is developed. We also developed a hybrid weighting algorithm that applies the distance and fringe contrast to acquire the height of solder pastes. Furthermore, we developed an algorithm that generates the 2-D image from the fringe pattern images during the four-step algorithm. It reduces the time required for solder paste inspection compared to traditional approaches that use special lighting systems to create the 2-D image. Based on the results of the height acquisition algorithm, 2-D and 3-D solder paste inspections are performed. Experimental results show that our system can inspect a 20 mm times 20 mm printed circuit board area within 2 s to detect common 2-D and 3-D defects, and the maximum standard deviation for the average height is 3 mum.

참고문헌 (21)

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표제어: PCR

동의어: Packet Collision Rate

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용어 설명: PCR은 세균 특이성이 있는 primer를 이용하여 적은 수의 세균이 있을지라도 쉽게 검출할 수 있는 유용한 방법이며, 이를 이용하여 구강 내 치면세균막이나 타액에서 직접 세균을 검출할 수 있게 되었다[8].

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A Parallel-Structure Solder Paste Inspection System

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