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[해외논문] Development of SnAg-based lead free solders in electronics packaging

Microelectronics reliability, v.52 no.3, 2012년, pp.559 - 578  

Zhang, L. (School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China) ,  He, C.w. (School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China) ,  Guo, Y.h. ,  Han, J.g. ,  Zhang, Y.w. ,  Wang, X.y.

Abstract AI-Helper 아이콘AI-Helper

Lead free solder alloys for electronic assembly is being driven by environmental and health concerns regarding toxicity of lead and, more importantly, by the perceived economic advantage of marketing ''green'' products. Of the currently available lead free solders, SnAg has the greatest ...

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