최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Microelectronics reliability, v.52 no.3, 2012년, pp.559 - 578
Zhang, L. (School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China) , He, C.w. (School of Mechanical and Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China) , Guo, Y.h. , Han, J.g. , Zhang, Y.w. , Wang, X.y.
Lead free solder alloys for electronic assembly is being driven by environmental and health concerns regarding toxicity of lead and, more importantly, by the perceived economic advantage of marketing ''green'' products. Of the currently available lead free solders, SnAg has the greatest ...
Microelectron Reliab Hayes 49 3 269 2009 10.1016/j.microrel.2008.11.004 Interfacial fracture toughness of Pb-free solders
J Appl Phys Kim 86 12 6746 1999 10.1063/1.371751 Interfacial and wetting behavior in eutectic SnPb solder on Ni/Ti films and Ni foils
Mater Sci Eng R Tu 34 1-2 1 2001 10.1016/S0927-796X(01)00029-8 Tin-lead (SnPb) solder reaction in flip chip technology
J Mater Sci: Mater Electron Zimprich 19 4 383 2008 10.1007/s10854-007-9349-7 Size effects in small scaled lead-free solder joints
J Mater Sci: Mater Electron Zhang 21 1 1 2010 10.1007/s10854-009-0014-1 Development of Sn-Zn lead-free solders bearing alloying elements
Microelectron Reliab Vandevelde 47 2-3 259 2007 10.1016/j.microrel.2006.09.034 Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages
Acta Mater Lee 45 5 1867 1997 10.1016/S1359-6454(96)00325-4 Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
J Appl Phys Chan Y 94 12 7904 2003 10.1063/1.1628387 Effect of 0.5wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization
Mater Sci Eng R Zeng 38 2 55 2002 10.1016/S0927-796X(02)00007-4 Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Acta Mater Kerr 2 15 572 2004 Creep deformation behavior of Sn-3.5Ag solder/Cu couple at small length scale
Modell Simul Mater Sci Eng Zhang 17 7 075014 2009 10.1088/0965-0393/17/7/075014 Determination of Anand parameters for SnAgCuCe solder
Mater Sci Eng R Wu 44 1 1 2004 10.1016/j.mser.2004.01.001 Properties of lead-free solder alloys with rare earth element additions [J]
J Alloy Compd Noh 499 2 154 2010 10.1016/j.jallcom.2010.03.179 Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
J Alloy Compd Xiao 472 1-2 198 2009 10.1016/j.jallcom.2008.04.044 Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint
Mater Sci Eng R Laurila 68 1-2 1 2010 10.1016/j.mser.2009.12.001 Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
J Mater Sci: Mater Electron Zhang 20 8 685 2009 10.1007/s10854-009-9895-2 Effects of rare earths on properties and microstructures of lead-free solder alloys
Chin Sci Bull Shen 51 14 1766 2006 10.1007/s11434-006-2043-y Abnormal growth of Ag3Sn intermetallic compounds in Sn-Ag lead-free solder
Intermetallics Shen 16 9 1142 2008 10.1016/j.intermet.2008.06.016 Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn-Ag solder during solidification
Shen J. Separation and controlling of intermetallic compounds in lead-free Sn-Ag solders. Tianjin University; 2005.
Rare Metal Mater Eng Lin 37 11 1903 2008 Study on void growth in micro-size SnAg solder bump
Microelectron Reliab Wang 49 3 248 2009 10.1016/j.microrel.2008.09.010 Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
Surf Eng Hong 24 5 337 2008 10.1179/174329408X281821 Characterisation of lead free solderability of immersion Sn finfish on PWBs using wetting balance technique
Electron Process Technol Wang 25 2 47 2004 Review of JISZ3198: test method for lead-free solders
Metals Sci Technol Fujimoto 74 12 1249 2004 The latest trends of lead-free issue in electronic device packaging test method and its standardization for evaluation of quality and reliability in lead-free soldering assembly
J Mater Eng Wang 9 5 2008 Study on wettability of Sn-Ag-Cu solder and mechanical properties of soldered joints
Trans China Weldng Inst Wang 28 8 33 2007 Effect of Ag, Al, Ga addition on wettability of Sn-9Zn lead-free solder
J Appl Phys Kim 104 3 033537 2008 10.1063/1.2964118 Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials
J Alloy Compd Yoon 486 1-2 142 2009 10.1016/j.jallcom.2009.06.159 Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints
J Electron Mater Liu 30 5 521 2001 10.1007/s11664-001-0092-1 Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer
Soldering Surf Mount Technol Zhang 22 2 30 2010 10.1108/09540911011036262 Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
Mater Lett Wang 56 6 1039 2002 10.1016/S0167-577X(02)00672-9 Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
J Mater Sci: Mater Electron Zhang 20 12 1193 2009 10.1007/s10854-008-9850-7 Effects of trace amount addition of rare earth on properties and microstructure of Sn-Ag-Cu alloys
J Electron Mater Hao 36 7 766 2007 10.1007/s11664-007-0138-0 Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions
J Alloy Compd Shi 453 1-2 180 2008 10.1016/j.jallcom.2006.11.165 Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Chin J Nonferrous Metals Huang 20 6 1189 2010 Interfacial reactions between Sn-3.5Ag solder and electroless Ni-P during soldering and aging
J Electron Mater Kaban 39 1 70 2010 10.1007/s11664-009-0952-7 Physical properties of Sn96.5Ag3.5-based solders with additions of Bi, Ge, and In
Weld Technol Hu 35 4 46 2006 Effect of adding Bi element on Sn3.5Ag eutectic alloy solder
J Sichuan Univ (Eng Sci Ed) Gong 35 4 49 2003 Effect of Zn on the solderability of the Sn-Ag-Bi solders
Kovove Mater Šebo 43 3 202 2005 Effect of In addition on Sn-Ag solder, its wetting and shear strength of copper joints
Electron Compos Mater Liu 26 6 28 2007 Microstructure and properties of particle reinforced Sn-Ag based lead-free composite solders
J Electron Mater Lee 35 3 494 2006 10.1007/BF02690537 Influence of Ni concentration and Ni3Sn4 nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying
J Electrochem Soc Kim 150 9 577 2003 10.1149/1.1596163 Electrodeposition of near-eutectic SnAg solders for wafer-level packaging
Metall Mater Trans A. Huang 36 6 1439 2005 10.1007/s11661-005-0236-7 Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X(Cu, Bi, In) solders
J Alloy Compd Shalaby 505 1 113 2010 10.1016/j.jallcom.2010.05.179 Effect of rapid solidification on mechanical properties of a lead free Sn-3.5Ag solder
Mater Manuf Process Kamal 21 8 736 2006 10.1080/10426910600727890 Effect of rapid solidification on structure and properties of some lead-free solder alloys
Appl Phys Lett Ramirez 80 3 398 2002 10.1063/1.1435075 Bonding nature of rare-earth-containing lead-free solders
Trans Nonferr Metals Soc China Zhao 17 4 805 2007 10.1016/S1003-6326(07)60178-2 Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
Microelectron Eng Lee 85 7 1577 2008 10.1016/j.mee.2008.03.002 Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
J Electrochem Soc Hsiao 152 9 105 2005 10.1149/1.1954928 Synthesis and characterization of lead-free solders with Sn-3.5Ag-xCu(x=0.2, 0.5, 1.0) alloy nanoparticles by the chemical reduction method
J Electron Mater Lee 33 9 1048 2004 10.1007/s11664-004-0034-9 Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints
J Electron Mater Shen 35 8 1672 2006 10.1007/s11664-006-0216-8 Strengthening effects of ZrO2 nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder
Microelectron Reliab Shen 49 3 223 2009 10.1016/j.microrel.2008.10.004 Research advances in nano-composite solders
Chin J Appl Mech Luo 24 3 429 2007 The cyclic deformation behaviors and constitutive description of 96.5Sn-3.5Ag solder alloy under uniaxially cyclic strain
Jeon YD, Ostmann A, Reichl H, et al. Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electronless Ni-P UBMs. In: Electronic components and technology conference; 2003. p. 1203-8.
Trans China Weld Inst Zhang 29 9 35 2008 Investigation of mechanical property and fracture morphology of lead-free soldered joints of fine pitch devices
Solder Surf Mount Technol He 22 3 4 2010 10.1108/09540911011054136 Effect of Bi on the microstructure and tensile behavior of Sn-3.7Ag solders
Microelectron Reliab Kim 47 7 1113 2007 10.1016/j.microrel.2006.06.012 Properties of low temperature Sn-Ag-Bi-In solder systems
J Electron Mater McCormack 23 7 635 1994 10.1007/BF02653349 New, lead-free solders
Appl Phys Lett McCormack 63 1 15 1993 10.1063/1.109734 New Pb-free solder alloy with superior mechanical properties
Weld Join Yu 8 31 2007 Microstructure evolution and mechanical properties of Sn3.5Ag1.0Zn/Cu joint
Mater Sci Eng, A Meng 237 1 109 1997 10.1016/S0921-5093(97)00096-8 Overview of the effects of impurities and rare earth elements in Al-Li alloys
J Rare Earths Zhu 17 4 290 1999 Study on plastic deformation resistance of Sn-Pb-RE solder
Microelectron Reliab Xie 51 6 1142 2011 10.1016/j.microrel.2011.02.005 Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys
J Electron Mater Lee 37 6 867 2008 10.1007/s11664-008-0396-5 The shear strength and fracture behavior of Sn-Ag-xSb solder joints with Au/Ni-P/Cu UBM
J Mater Sci: Mater Electron Babaghorbani 20 6 571 2009 10.1007/s10854-008-9767-1 Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
J Mater Eng Perform Nai 19 3 335 2010 10.1007/s11665-009-9481-z Using microwave-assisted powder metallurgy route and nano-size reinforcement to develop high-strength solder composites
J Mater Sci: Mater Electron Tai 21 7 702 2010 10.1007/s10854-009-9981-5 Effects of nano-structured particles on microstructure and microhardness of Sn-Ag solder alloy
J Electron Mater Liu 37 6 874 2008 10.1007/s11664-007-0366-3 Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy
Adv Eng Mater Zhong 7 11 1049 2005 10.1002/adem.200500109 High strength lead-free composite solder materials using nano Al2O3 as reinforcement
J Electron Mater Nai 35 7 1518 2006 10.1007/s11664-006-0142-9 Lead-free solder reinforced with multiwalled carbon nanotubes
Sens Actuators, A Villain 99 1-2 194 2002 10.1016/S0924-4247(01)00882-2 Creep behavior of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes
J Electron Mater Han 39 2 223 2010 10.1007/s11664-009-0970-5 Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder
J Electron Mater Chen 33 9 964 2004 10.1007/s11664-004-0023-z Constitutive relations on creep for SnAgCuRE lead-free solder joints
J Electron Mater Wen 30 9 1190 2001 10.1007/s11664-001-0149-1 Constitutive and damage model for a lead-free solder
Trans Nonferr Metals Soc China Zhang 20 3 412 2010 10.1016/S1003-6326(09)60155-2 Creep behavior of SnAgCu solders with rare earth Ce doping
IEEE Trans Compon Packag Technol Pang 28 4 830 2005 10.1109/TCAPT.2005.848587 Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead-free solder alloy
Fatigue Fract Eng Mater Struct Liang 19 11 1404 1996 10.1111/j.1460-2695.1996.tb00175.x A study of fatigue and creep behaviour of four high temperature solders
Rare Metal Mater Eng Zhang 39 3 382 2010 10.1016/S1875-5372(10)60084-7 Thermal fatigue behavior of SnAgCu soldered joints fine pitch devices
Mater Sci Eng, A Dutta 379 1-2 401 2004 10.1016/j.msea.2004.03.023 Impression creep characterization of rapidly cooled Sn-3.5Ag solders
J Mater Res Huang 17 11 2897 2002 10.1557/JMR.2002.0420 Creep behavior of eutectic Sn-Ag lead-free solder alloy
J Alloy Compd Negm 503 1 65 2010 10.1016/j.jallcom.2010.05.007 Influence of the addition of indium on the mechanical creep of Sn-3.5%Ag alloy
J Electron Mater Ochoa 33 12 1596 2004 10.1007/s11664-004-0103-0 Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
J Mater Sci: Mater Electron Kamal 15 14 211 2004 10.1023/B:JMSE.0000012457.77041.c6 The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn-Cd binary alloys
Mater Sci Eng, A Guo 351 1-2 190 2003 10.1016/S0921-5093(02)00853-5 Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
J Electron Mater Shih 34 2 188 2005 10.1007/s11664-005-0232-0 Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints
Jpn J Appl Phys Shin 42 3 1368 2003 10.1143/JJAP.42.1368 Creep deformation of lead-free Sn-3.5Ag-Bi solders
Cryst Res Technol Kamal 44 12 1308 2009 10.1002/crat.200900414 Effect of Bi-content on hardness and micro-creep behavior of Sn-3.5Ag rapidly solidified alloy
J Mater Res Wu 17 12 3146 2002 10.1557/JMR.2002.0455 Improvements of microstructure, wettability, tensile and creep strength of eutectic SnAg alloy by doping with rare-earth elements
Law 2004 Reliability and interfacial reaction of lead-free solder alloys doped with rare earth elements
IEEE Trans Compon Packag Technol Pei 31 3 712 2008 10.1109/TCAPT.2008.922002 Creep and fatigue behavior of SnAg solders with Lanthanum doping
J Electron Packag Pei 130 3 031004 2008 10.1115/1.2957321 Hierarchal modeling of creep behavior of SnAg solder alloys
J Mater Sci: Mater Electron Zhang 21 6 635 2010 10.1007/s10854-009-9969-1 Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging
J Mater Sci: Mater Electron Guo 12 1 27 2001 10.1023/A:1011264527894 Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.Cu non-composite solder joints
JOM - J Miner, Metals Mater Soc Choi 53 6 22 2001 10.1007/s11837-001-0098-4 Creep properties of Sn-Ag solder joints containing intermetallic particles
J Electron Mater Guo 30 9 1222 2001 10.1007/s11664-001-0153-5 Creep properties of eutectic Sn-3.5Ag solder joints reinforced with mechanically incorporated Ni particles
Mater Sci Eng, A Gong 427 1-2 60 2006 10.1016/j.msea.2006.04.034 Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics
Powder Technol Lin 166 1 38 2009 10.1016/j.powtec.2006.02.009 Microstructural development in a rapidly cooled eutectic Sn-3.5%Ag solder reinforced with copper powder
Chen Y. Effect of cerium on property and microstructure for SnAgCu lead free solder. Harbin: Harbin Welding Institute; 2006.
Foundry Technol Xu 30 6 760 2009 Effect of cerium on microstructure and properties of lead-free solder alloy
J Electron Mater Xia 31 6 564 2002 10.1007/s11664-002-0126-3 Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder
J Electron Mater Dudek 35 12 2088 2006 10.1007/s11664-006-0318-3 Microstructure and mechanical behavior of novel rare earth-containing Pb-free solders
Law CML, Wu CML. Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls. In: Proceeding of the sixth IEEE CPMT conference on high density microsystem design and packaging and component failure analysis; 2004.
J Electron Mater Lee 38 10 2148 2009 10.1007/s11664-009-0863-7 Influence of lanthanum additions on the microstructure and microhardness of Sn-3.5Ag solder
Mater Sci Eng Lee 407 1-2 36 2005 10.1016/j.msea.2005.07.049 Reliability of Sn-Ag-Sb lead-free solder joints
Thin Solid Films Chen 462-463 395 2004 10.1016/j.tsf.2004.05.063 Influence of Sb on IMC growth in Sn-Ag-Cu-Sb Pb-free solder joints in reflow process
IEEE Trans Electron Packag Manuf Li 27 1 77 2004 10.1109/TEPM.2004.830507 Reaction of Sn-3.5Ag-0.7Cu-xSb solder with Cu metallization during reflow soldering
Sci Technol Weld Join Lee 10 3 353 2005 10.1179/174329305X40697 Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder
J Electron Mater Gao 36 12 1630 2007 10.1007/s11664-007-0243-0 Intermetallics evolution in Sn-3.5Ag based lead-free solder matrix on an OSP Cu finish
Scripta Mater Song 56 5 413 2007 10.1016/j.scriptamat.2006.10.044 Two-stage nonequilibrium eutectic transformation in a Sn-3.5Ag-3In solder
J Electron Mater He 35 12 2098 2006 10.1007/s11664-006-0319-2 Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
Int Microelectron Packag Soc Tateyama 23 1 131 2000 Effects of Bi content on mechanical properties and bump interconnection reliability of Sn-Ag solder alloys
J Alloy Compd Wan 463 1-2 230 2008 10.1016/j.jallcom.2007.09.070 Effect of the addition of In on the microstructural formation of Sn-Ag-Zn lead-free solder
J Mater Sci: Mater Electron Jiang 20 2 139 2009 10.1007/s10854-008-9666-5 Effect of high-temperature annealing on the microstructural formation of Sn-3.7Ag-0.9Zn-xAl lead-free solder
Microelectron Reliab Kim 47 7 1113 2007 10.1016/j.microrel.2006.06.012 Properties of low temperature Sn-Ag-Bi-In solder systems
Trans Mater Res Soc Jpn Kim 29 5 2005 2004 Effects of composition on microstructure and on the thermal stability of Sn-Ag-In lead-free soldered joints
Trans China Weld Inst Tai 31 4 81 2010 Effects of service conditions on properties of in situ particle-reinforced composite solder joint
J Electron Mater Sigelko 28 11 1184 1999 10.1007/s11664-999-0155-2 Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements
J Mater Sci Technol Shen 22 4 529 2006 Nano ZrO2 particulate-reinforced lead-free solder composite
Mater Sci Technol Kim 21 3 381 2005 10.1179/174328405X27061 Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate
J Mater Res Lee 17 2 291 2002 10.1557/JMR.2002.0042 Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu
Acta Metall Sinica Zhou 46 5 569 2010 10.3724/SP.J.1037.2009.00566 Early interfacial reaction and undercooling solidification behavior of Sn-3.5Ag/Cu system
Mater Sci Technol Yu 13 5 532 2005 The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate
J Appl Phys Alam 98 12 123527 2005 10.1063/1.2149487 Solid-state growth kinetics of Ni3Sn4 at the Sn-3.5Ag solder/Ni interface
Surf Interface Anal Yoon 36 8 963 2004 10.1002/sia.1812 Phase analysis and kinetics of solid-state ageing of Pb-free Sn-3.5Ag solder on electroless Ni-P substrate
J Mater Sci: Mater Electron Ho 18 1-3 155 2007 Interfacial reaction issues for lead-free electronic solders
Electron Process Technol Li 27 5 249 2006 10.1016/j.jmatprotec.2005.10.018 Interfacial reaction between Sn-Ag eutectic lead-free solder ball and Cu pad during Nd: YAG laser reflow
J Appl Phys Alam 94 12 7904 2003 10.1063/1.1628387 Effect of 0.5wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization
Mater Sci Eng, A Kim 371 1-2 267 2004 10.1016/j.msea.2003.12.012 Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints
J Electron Mater Kim 33 10 1182 2004 10.1007/s11664-004-0121-y Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization
Chem Mater Alam 17 9 2223 2005 10.1021/cm0478069 Effect of 0.5wt% Cu in Sn-3.5%Ag solder balls on the solid state interfacial reaction with Au/Ni/Cu bond pads for ball grid array (BGA)
Chem Mater Alam 15 23 4340 2003 10.1021/cm034692c Effect of 0.5wt% Cu in Sn-3.5%Ag solder on the interfacial reaction with Au/Ni metallization
J Electron Mater Sharif 34 1 46 2005 10.1007/s11664-005-0179-1 Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering
J Mater Sci: Mater Electron Gao 21 9 910 2010 10.1007/s10854-009-0017-y Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder
JOM - J Miner Metals Mater Soc Dudek 58 6 57 2006 10.1007/s11837-006-0184-8 Novel rare-earth-containing lead-free with enhanced ductility
J Alloy Compd Ma 334 1-2 224 2002 10.1016/S0925-8388(01)01747-9 Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability
Lee HT, Chen YF, Hong TF, et al. Influence of lanthanum addition on microstructure and properties of Sn3.5Ag solder system. In: International conference on electronic materials and packaging; 2008.
Appl Phys Lett Mavoori 78 19 2976 2001 10.1063/1.1370985 Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials
Metall Mater Trans A. Dudek 41 3 610 2010 10.1007/s11661-009-0146-1 Effect of rare-earth (La, Ce and Y) additions on the microstructure and mechanical behavior of Sn-3.9Ag-0.7Cu solder alloy
J Chin Rare Earth Soc Zhang 27 2 246 2009 Effects of cerium on microstructure and properties of SnAgCu solders
Rare Earth Mater Eng Hao 37 11 1938 2008 Effect of rare earth Er on the microstructure evolution for Sn-3.8Ag-0.7Cu lead-free solder alloy during isothermal aging
Electron Compon Mater Hao 25 2 52 2006 Microstructure evolution of SnAgCu lead-free solders at high temperature aging
Trans China Weld Inst Chen 26 12 69 2005 Influence of cerium on microstructure of Sn-Ag-Cu lead-free solder
Chin J Nonferr Metals Wang 19 4 708 2009 Microstructure and growth behavior of Cu6Sn5 for Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface
J Mater Res Choi 17 1 43 2002 10.1557/JMR.2002.0009 Interfacial microstructure and joint strength of Sn-3.5Ag-X (X=Cu, In, Ni) solder joint
Solder Surf Mount Technol Xu 22 2 13 2010 10.1108/09540911011036244 Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
J Electron Mater Tsai 32 11 1203 2003 10.1007/s11664-003-0012-7 A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
Trans China Weld Inst Yu 29 3 81 2008 Effects of 1.0% Zn or Ni additions on interfacial reaction and growth of intermetallics in Sn-3.5Ag/Cu joint
Mater Sci Eng, A Gao 420 1-2 39 2006 10.1016/j.msea.2006.01.032 Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing
J Alloy Compd Chen 489 2 631 2010 10.1016/j.jallcom.2009.09.135 Microstructural evolution of intermetallic compounds in Sn-3.5Ag-X(X=0, 0.75Ni, 1.0Zn and 1.5In)/Cu solder joints during liquid aging
Mater Mech Eng Li 33 9 21 2009 Effect of Ge on interfacial reaction Sn-3.5Ag alloy/Cu interface
J Electron Mater Anderson 30 9 1050 2001 10.1007/s11664-001-0129-5 Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
Metall Mater Trans A Ghosh 40 10 2369 2009 10.1007/s11661-009-9948-4 Aging characteristics of Sn-Ag eutectic solder alloy with the addition of Cu, In, and Mn
Brandes 1998 Smithells metals reference book
J Electron Mater Xia 37 12 1858 2008 10.1007/s11664-008-0548-7 Effect of Aluminum concentration on the interfacial reactions of Sn-3.0Ag-xAl solders with copper and ENIG metallizations
J Electron Mater He 37 3 288 2008 10.1007/s11664-007-0367-2 Effect of Bi on the interfacial reaction between Sn-3.7Ag-xBi solders and Cu
Chin J Nonferr Metals Zhang 19 10 1782 2009 Microstructures and mechanical properties of Sn-30Bi-0.5Cu low-temperature lead-free solder
Key Eng Mater Lee 261-263 501 2004 10.4028/www.scientific.net/KEM.261-263.501 Effect of Sb addition on microstructure and shear strength of Sn-Ag solder joints
J Electron Mater Lee 38 10 2112 2009 10.1007/s11664-009-0884-2 Microstructural evolution of Sn-Ag-Sb solder with indium additions
Microelectron Reliab Amagai 48 1 1 2008 10.1016/j.microrel.2007.05.004 A study of nanoparticles in Sn-Ag based lead free solder
Acta Mater Compos Sinica Tai 25 5 8 2008 Microstructure evolution and mechanical properties of Sn-Ag based composite solder joints during isothermal aging
J Alloy Compd Zhang 458 1-2 492 2008 10.1016/j.jallcom.2007.04.040 Electromigration of Pb-free solder under a low level of current density
J Mater Sci: Mater Electron Chen 18 1-3 259 2007 Electromigration issues in lead-free solder joints
J Appl Phys Tu 94 9 5451 2003 10.1063/1.1611263 Recent advances on electronmigration in very-large-scale-integration of interconnects
JOM - J Miner Metals Mater Soc Gan 54 6 34 2002 10.1007/BF02701847 Electromigration in solder joints and solder lines
Ebersberger B, Bauer R, Alexa L. Reliability of lead-free SnAg bumps: influence of electromigration and temperature. In: Proceedings of 55th electronic components and technology conference; 2005.
Thin Solid Films Kumar 462-463 413 2004 10.1016/j.tsf.2004.05.042 Effect of electromigration on interfacial reactions between electroless Ni-P and Sn-3.5%Ag solder
J Appl Phys Chao 100 8 084909 2006 10.1063/1.2359135 Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints
Ou SQ, Tu KN. A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines. In: Proceedings of 55th electronic components and technology conference; 2005.
J Appl Phys Yu 102 5 054904 2007 10.1063/1.2777192 First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder
J Appl Phys Hsu 102 2 023715 2007 10.1063/1.2756999 Generalized phenomenological model for the effect of electromigration on interfacial reaction
J Appl Phys Gan 9 6 063514 2005 10.1063/1.1861151 Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples
Microelectron Reliab Chao 49 3 253 2009 10.1016/j.microrel.2009.01.006 Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
J Mater Sci: Mater Electron Chae 18 1-3 247 2007 Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
J Mater Sci Guo 44 20 5595 2009 10.1007/s10853-009-3787-y Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints
Kim DH. Reliability study of SnPb and SnAg solder joints in PBGA packages. The University of Texas at Austin; 2007.
Shawkret 2001 Study on the high temperature reliability of lead-free surface mount solder joints
Trans China Weld Inst Xue 26 10 81 2005 Reliability of CBGA soldered joint under thermal cycling
Int J Fatigue Kanchanomai 24 6 671 2002 10.1016/S0142-1123(01)00186-4 Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63Sn/37Pb
Mater Sci Eng, A Kanchanomai 381 1-2 113 2004 10.1016/j.msea.2004.04.018 Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder
Trans China Weld Inst Gao 29 7 93 2008 Finite element analysis on influencing factors of soldered column reliability in a CCGA device
China Weld Zhang 17 2 37 2008 Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads
JOM - J Miner Metals Mater Soc Gayle 53 6 17 2001 10.1007/s11837-001-0097-5 High temperature lead-free solder for microelectronics
J Electron Mater Kariya 30 9 1184 2001 10.1007/s11664-001-0148-2 Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X(X=Bi or Cu) alloy by strain range partitioning approach
J Electron Mater Kanchanomai 31 5 456 2002 10.1007/s11664-002-0100-0 Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders
J Electron Mater Lee 32 6 523 2003 10.1007/s11664-003-0137-8 Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints
J Electron Mater Kariya 27 7 866 1998 10.1007/s11664-998-0111-6 Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy
J Electron Mater Kariya 27 11 1229 1998 10.1007/s11664-998-0074-7 Mechanical fatigue characteristics of Sn-3.5Ag-X(X=Bi, Cu, Zn and In) solder alloys
J Electron Mater Kariya 28 11 1263 1999 10.1007/s11664-999-0166-z Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
Appl Phys Lett Kim 92 9 092109 2008 10.1063/1.2890072 Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering
J Electron Mater Gao 37 1 45 2008 10.1007/s11664-007-0234-1 Additive effect of kirkendall void formation in Sn-3.5Ag solder joints on common substrates
Pei 2007 Effects of Lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy
J Electron Mater Choi 29 10 1249 2000 10.1007/s11664-000-0020-9 Thermomechanical fatigue behavior of Sn-Ag solder joints
Microelectron Reliab Lee 47 1 118 2007 10.1016/j.microrel.2006.02.001 Effect of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn-Ag based solder joints
J Electron Mater Joo 32 6 541 2003 10.1007/s11664-003-0140-0 Creep rupture of lead-free Sn-3.5Ag-Cu solders
J Electron Mater Arenas 35 7 1530 2006 10.1007/s11664-006-0144-7 Effect of flux on the wetting characteristics of SnAg, SnCu, SnAgBi, and SnAgCu lead-free solders on copper substrates
J Mater Sci Technol Chen 21 3 419 2005 Experimental and finite element method studies of J-lead solder joints reliability
해당 논문의 주제분야에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.