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NTIS 바로가기Microelectronics reliability, v.53 no.9/11, 2013년, pp.1548 - 1552
Lim, J.D. , Susan, Y.S.Y. , Daniel, R.M. , Leong, K.C. , Wong, C.C.
The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With roughe...
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