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International journal of heat and mass transfer, v.74, 2014년, pp.358 - 367
Yujun, G. , Zhongliang, L. , Guangmeng, Z. , Yanxia, L.
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Improving the thermal conduction ability of thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce chip temperature. In the present work, multi-walled carbon nanotubes (MWCNTs) are used as additives for enhancing the thermal conductivity of the widely-used TI...
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