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NTIS 바로가기IEEE transactions on components, packaging, and manufacturing technology, v.7 no.9, 2017년, pp.1410 - 1418
Sitaraman, Srikrishna (Georgia Inst. of Technol., Atlanta, GA, USA) , Sukumaran, Vijay (Georgia Inst. of Technol., Atlanta, GA, USA) , Pulugurtha, Markondeya Raj (Georgia Inst. of Technol., Atlanta, GA, USA) , Zihan Wu (Georgia Inst. of Technol., Atlanta, GA, USA) , Suzuki, Yuya (Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea) , Youngwoo Kim (Georgia Inst. of Technol., Atlanta, GA, USA) , Sundaram, Venky (Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea) , Joungho Kim (Georgia Inst. of Technol., Atlanta, GA, USA) , Tummala, Rao R.
This paper presents the modeling, design, fabrication, and characterization of an innovative and miniaturized thin-film bandpass filter with coupled spiral structures in ultrathin glass substrates (30-100 mu m). This filter is demonstrated for two applications: 3-D integrated passive devices and emb...
Seunghyun Hwang, Sunghwan Min, Swaminathan, M., Sundaram, V., Tummala, R.. Thin-Film High-Rejection Filter Integration in Low-Loss Organic Substrate. IEEE transactions on components, packaging, and manufacturing technology, vol.1, no.8, 1160-1170.
Diplexer DPX105950DT-6010B1 2014
Proc IEEE 61st Electron Compon Technol Conf (ECTC) Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias sukumaran 2000 583
Sukumaran, Vijay, Kumar, Gokul, Ramachandran, Koushik, Suzuki, Yuya, Demir, Kaya, Sato, Yoichiro, Seki, Toshitake, Sundaram, Venky, Tummala, R. R.. Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon. IEEE transactions on components, packaging, and manufacturing technology, vol.4, no.5, 786-795.
Huang, Chien‐Hsiang, Chen, Chien‐Hsun, Horng, Tzyy‐Sheng. Compact bandpass filter using novel transformer‐based coupled resonators on integrated passive device glass substrate. Microwave and optical technology letters, vol.54, no.1, 257-262.
Proc ECTC 3D IPAC—A new passives and actives concept for ultraminiaturized electronic and bio-electronic functional modules raj 2013 517
Yang, Tao, Tamura, Masaya, Itoh, Tatsuo. Super Compact Low-Temperature Co-Fired Ceramic Bandpass Filters Using the Hybrid Resonator. IEEE transactions on microwave theory and techniques, vol.58, no.11, 2896-2907.
Proc IEEE/MTT-S Int Microw Symp LTCC multi-layer coupled strip-resonator filters zaki 2007 1039
Proc IEEE MTT-S Int Passives partitioning for single package single chip SoC on 32 nm RFCMOS technology kamgaing 2012 1
TUMMALA, R.R., LASKAR, J.. Gigabit wireless: system-on-a-package technology. Proceedings of the IEEE, vol.92, no.2, 376-387.
Xiu Yin Zhang, Xin Dai, Hsuan-Ling Kao, Bai-Hong Wei, Ze Yu Cai, Quan Xue. Compact LTCC Bandpass Filter With Wide Stopband Using Discriminating Coupling. IEEE transactions on components, packaging, and manufacturing technology, vol.4, no.4, 656-663.
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