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NTIS 바로가기Quality and reliability engineering international, v.7 no.5, 1991년, pp.365 - 370
Klinger, David J.
AbstractFailure mechanisms associated with the effects of humidity on plastic packaged devices are briefly reviewed. Relevant experimental and theoretical work on these failure mechanisms is then considered, pointing to an incomplete understanding as to why relative humidity is the appropriate varia...
RCA Review Gallace L. 249 45 1984 Reliability of plastic‐encapsulated integrated circuits in moisture environments
British Telecommunications Technology Journal Lawson R. W. 95 2 1984 A review of the status of plastic encapsulated semiconductor component reliability
G.Shirley Private communication August1989.
R. B.Comizzoli ‘Corrosion of electronic device metallization’ Proceedings of the Interuniversity Microelectronics Center Summer Course on Reliability Leuven Belgium 7 June1989.
Analysis of Survival Data Cox D. R. 1984
AT&T Reliability Manual Klinger D. J. 1990
D. J.Klinger ‘Failure time and rate constant of degradation: an argument for the inverse relationship’ (submitted toMicroelectonics and Reliability).
M. J.LuValle T. L.WelsherandJ. P.Mitchell ‘A new approach to the extrapolation of accelerated life test data’ Proceedings of the Fifth International Conference on Reliability and Maintainability. European Space Agency Biaritz 1986 pp.620-635 and references contained therein.
Joyce, W. B., Liou, K-Y., Nash, F. R., Bossard, P. R., Hartman, R. L.. Methodology of Accelerated Aging. AT&T technical journal, vol.64, no.3, 717-764.
RCA Review Schnable G. S. 416 40 1979 A survey of corrosion failure mechanisms in microelectronic devices
N.Lycoudes ‘Reliability of plastic microcircuits in moist environments’ Solid State Technology October 53-62 (1978).
N.Lycoudes ‘Pressure temperature humidity bias method and system for corrosion studies of plastic encapsulated integrated circuits’ Proceedings of the 23rd Annual Technical Meeting Institute of Environmental Sciences 1977 p.213.
Berg, H.M., Paulson, W.M.. Chip corrosion in plastic packages. Microelectronics and reliability, vol.20, no.3, 247-263.
Cerofolini, G.F., Rovere, C.. The role of water vapour in the corrosion of microelectronic circuits. Thin solid films, vol.47, no.2, 83-94.
Hakim, E.B.. US Army Panama field test of plastic encapsulated devices. Microelectronics and reliability, vol.17, no.3, 387-392.
Sinnadurai, F.N.. The accelerated ageing of plastic encapsulated semiconductor devices in environments containing a high vapour pressure of water. Microelectronics and reliability, vol.13, no.1, 23-27.
Lelievre, A., Goarin, R.. The influence of climatic conditions on the reliability of electronic components in telephone exchanges. Quality and reliability engineering international, vol.3, no.2, 93-98.
Wada, T., Higuchi, H., Ajiki, T.. Analysis of Corrosion on Aluminum Double‐Layer Metallization. Journal of the Electrochemical Society : JES, vol.133, no.2, 362-366.
Wada, T., Sugimoto, M., Ajiki, T.. Relationship Between Width and Spacing of Aluminum Electrodes and Aluminum Corrosion on Simulated Microelectronic Circuit Patterns. Journal of the Electrochemical Society : JES, vol.134, no.3, 649-653.
T.Wada M.SugimotoandT.Ajiki ‘The electrical characteristics degradation by moisture resistance test on semiconductor devices’ Proceedings of the Sixth International Conference on Reliability and Maintainability European Space Agency Biaritz 1988 pp.414-418.
Wada, T., Kobayashi, Y., Maeda, N., Sugimoto, M., Ajiki, T.. Study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices. Microelectronics and reliability, vol.28, no.5, 813-820.
Iannuzzi, M.. Reliability and Failure Mechanisms of Nonhermetic Aluminum SIC's: Literature Review and Bias Humidity Performance. IEEE transactions on components, hybrids, and manufacturing technology, vol.6, no.2, 181-190.
Iannuzzi, M.. Bias Humidity Performance and Failure Mechanisms of Nonhermetic Aluminum SIC's in an Enviornment Contaminated with Cl2. IEEE transactions on components, hybrids, and manufacturing technology, vol.6, no.2, 191-201.
K.Zachariassen ‘Corrosion of electronics in practical use’ Elektronik Centralen Report 213 Hoersholm Denmark 1988.
Dunn, C. F., McPherson, J. W.. Recent Observations on VLSI Bond Pad Corrosion Kinetics. Journal of the Electrochemical Society : JES, vol.135, no.3, 661-665.
Brunauer, Stephen, Emmett, P. H., Teller, Edward. Adsorption of Gases in Multimolecular Layers. Journal of the American Chemical Society, vol.60, no.2, 309-319.
Physical Chemistry of Surfaces Adamson A. W. 1982
Langmuir, Irving. THE ADSORPTION OF GASES ON PLANE SURFACES OF GLASS, MICA AND PLATINUM.. Journal of the American Chemical Society, vol.40, no.9, 1361-1403.
Awakuni, Y, Calderwood, J H. Water vapour adsorption and surface conductivity in solids. Journal of physics. D, applied physics, vol.5, no.5, 1038-1045.
R. B.Comizzoli ‘Surface conductance of insulators in the presence of water’ Preprint July1990.
Martin, A. D., McLean, K. J.. The effect of adsorbed gases on the surface conductivity of quartz. Journal of applied physics, vol.48, no.7, 2950-2954.
Weick, W.W.. Acceleration Factors for IC Leakage Current in a Steam Environment. IEEE transactions on reliability, vol.r29, no.2, 109-115.
Striny, K., Schelling, A.. Reliability Evaluation of Aluminum-Metallized MOS Dynamic RAM's in Plastic Packages in High Humidity and Temperature Environments. IEEE transactions on components, hybrids, and manufacturing technology, vol.4, no.4, 476-481.
Stroehle, D.. Influence of the Chip Temperature on the Moisture Induced Failure Rate of Plastic Encapsulated Devices. IEEE transactions on components, hybrids, and manufacturing technology, vol.6, no.4, 537-543.
S. J.Charles ‘Moisture related failures in plastic encapsulated integrated circuits’ Report 7801 Australian Telecommunications Commission Research Laboratories Melbourne 1985.
Journal of Electrochemical Society McPherson J. W. 132 1903 Acceleration factors for thin oxide breakdown
VLSI Reliability Sabnis A. G. 1990
VLSI Technology Sze S. M. 1988
D. J.Klinger ‘Comment on “Acceleration factors for thin oxide breakdown”’ (submitted to theJournal of the Electrochemical Society).
J. Vaccaro and H. C. Gorton (eds) RADC Reliability Physics Notebook Battelle Memorial Institute Columbus Ohio RADC Contract AF30(602)‐3504 October1965.
D. J.Klinger ‘On the notion of activation energy in reliability: Arrhenius Eyring and thermodynamics’ Proceedings of the 1991 Reliability and Maintainability Symposium IEEE Orlando Florida 1991.
Chemical Kinetics Weston R. E. 1972
Methods of Thermodynamics Reiss H. 1965
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