[논문]High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, Dong-Hyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; Cho, Kyungjun; Bae, Bumhee; Ha, Dongho; Bae, Michael; Kim, Joungho

doi:10.1109/tcpmt.2018.2828223

High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

IEEE transactions on components, packaging, and manufacturing technology, v.8 no.12, 2018년, pp.2152 - 2162

Park, Junyong (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Kim, Hyesoo (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Kim, Jonghoon J. (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Kim, Dong-Hyun (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Son, Kyungjune (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Kim, Subin (Korea Advanced Institute of Science and Technology, Terahertz Interconnection and Package Laboratory, Daejeon, South Korea) , Lee, Seongsoo (Korea Advanced Institute of Science and Technology, Terahertz In) , Cho, Kyungjun , Bae, Bumhee , Ha, Dongho , Bae, Michael , Kim, Joungho

Abstract ▼ AI-Helper

This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket for high-bandwidth and high-density package test using a fabricated sample. In addition, this paper also characterizes and verifies the coaxial silicone rubber socket. Because of the proposed coaxial socket's novel coaxial structure, the proposed socket successfully achieves the electrical performance improvement. For verification, we compare the proposed socket and the previous noncoaxial socket in time domain. The proposed socket has greater eye height and eye width in the measured eye diagram than those of the noncoaxial socket. Moreover, the slope in the eye diagram is also improved in the case of the proposed socket. Therefore, the measured eye diagram for the coaxial socket shows the improvement in electrical performances. This paper also characterizes the equivalent RLGC model for the coaxial silicone rubber socket. In order to verify the RLGC model, we compare the insertion losses and eye diagrams from measurement, 3-D electromagnetic simulation, and the proposed RLGC model, respectively. Their insertion losses are comparable up to 20 GHz. Furthermore, the obtained eye diagrams are almost identical at the data rate of 9.6 Gb/s. In conclusion, this paper successfully proposes, verifies, and characterizes a new coaxial silicone rubber socket for the first time.

참고문헌 (28)

Lee, H.-H.S., Chakrabarty, K.. Test Challenges for 3D Integrated Circuits. IEEE design & test of computers, vol.26, no.5, 26-35.

상세보기
10.1109/ETC.1989.36225
10.1109/EMAP.2002.1188824
10.1109/EPTC.2016.7861535
Tunaboylu, Bahadir. Electrical Characterization of Test Sockets With Novel Contactors. IEEE transactions on device and materials reliability : a publication of the IEEE Electron Devices Society and the IEEE Reliability Society, vol.14, no.1, 580-582.

상세보기
10.1109/SMELEC.2008.4770348
10.1109/APMC.2006.4429444
10.1109/MWSYM.2007.380399
Ruey-Bo Sun, Chang-Yi Wen, Ruey-Beei Wu. A New Isolation Structure of Pogo Pins for Crosstalk Reduction in a Test Socket. IEEE transactions on components, packaging, and manufacturing technology, vol.1, no.4, 586-594.

상세보기
Norberg, G., Dejanovic, S., Hesselbom, H.. Very high density interconnect elastomer chip sockets. IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society, vol.29, no.2, 202-210.

상세보기
Capacitance of Parallel Cylinder Conductor 2018
Katti, G., Stucchi, M., De Meyer, K., Dehaene, W.. Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs. IEEE transactions on electron devices, vol.57, no.1, 256-262.

상세보기
Inductance Loop and Partial paul 2010 195
10.1002/9781118166727
IEEE Trans Electromagn Compat Progress review of electromagnetic compatibility analysis technologies for packages, printed circuit boards, and novel interconnects li 2010 10.1109/TEMC.2010.2048755 52 248

상세보기
10.1109/3DIC.2009.5306542
10.1109/ECTC.2007.373906
Introduction to Flip-Chip 2000
IBM J Res Develop Is 3D chip technology the next growth engine for performance improvement? emma 2008 10.1147/JRD.2008.5388561 52 541

상세보기
10.1109/ECTC.2011.5898621
Davis, W.R., Wilson, J., Mick, S., Xu, J., Hua, H., Mineo, C., Sule, A.M., Steer, M., Franzon, P.D.. Demystifying 3D ICs: the pros and cons of going vertical. IEEE design & test of computers, vol.22, no.6, 498-510.

상세보기
10.1109/AGEC.2004.1290858
10.1109/EDAPS.2016.7893124
Liu, Weifeng, Lee, Mikyoung, Pecht, M., Martens, R.. An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses. IEEE transactions on device and materials reliability : a publication of the IEEE Electron Devices Society and the IEEE Reliability Society, vol.3, no.2, 39-43.

상세보기
10.1109/ECTC.2011.5898813
10.1109/EDAPS.2015.7383666
Inductance of Parallel Cylinder Conductor 2018
10.1109/MWSYM.1980.1124303

LOADING...

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 논문명, 저널/프로시딩명, 저자 , 발행년, 권, 호, 시작페이지, 끝페이지, 발행기관 관리번호, 논문명, 대등논문명, 저자 , 저널/프로시딩명, 발행기관, 발행년, 발행언어, 권, 호, 시작페이지, 끝페이지, ISBN, ISSN, 주제분야, 키워드, 초록(한글), 초록(영문), 저자(소속기관)
저장형식	Text(ASCII format) Excel format RefWorks Direct Export RIS format (for Reference Manager, ProCite, EndNote), Scholar's Aids, Mendeley
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Abstract ▼ AI-Helper

참고문헌 (28)

이 논문을 인용한 문헌

연구과제 타임라인

관련 콘텐츠

원문 URL 링크

이 논문과 함께 이용한 콘텐츠

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트

연합인증

High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Abstract ▼ AI-Helper

참고문헌 (28)

이 논문을 인용한 문헌

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

전체(0) 논문(0) 특허(0) 보고서(0)

관련 콘텐츠

원문 URL 링크

이 논문과 함께 이용한 콘텐츠

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

선택된 텍스트