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NTIS 바로가기Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International, 2014 Oct, 2014년, pp.339 - 341
Hsiang-Chen Hsu (Dept. of Mech. &) , Shih-Jeh Wu (Autom. Eng., I-Shou Univ., Kaohsiung, Taiwan) , Chih-Chiang Fu (Dept. of Mech. &) , Li-Ming Chu (Autom. Eng., I-Shou Univ., Kaohsiung, Taiwan) , Shen-Li Fu (Dept. of Mech. &) , Trong-Tai Nguyen (Autom. Eng., I-Shou Univ., Kaohsiung, Taiwan)
The use of lasers in the field of microelectronics is growing and diversifying as designers look to innovative technologies to enable the ever-increasing sophistication of their products. Lasers are employed in manufacturing processes as varied as semiconductor lithography, wafer dicing, micro-weldi...
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