최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Information and Communication Technology, Electronics and Microelectronics (MIPRO), 2017 40th International Convention on, 2017 May, 2017년, pp.154 - 156
Tsai, P.S. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) , Chen, J.H. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) , Wang, R.D. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) , Liu, C.S. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) , Ku, Harry (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
Laser grooving process is crucial to thin chip strength. Much of paper has been put on the mechanism of laser grooving, but only few investigations were taken for chip strength enhancement. In this paper, thin chip (less than 100um chip thickness) is adopted, and the experiment of laser grooving pro...
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