Balu, Elango
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, Malta, NY12020, USA)
,
Tseng, Wei-Tsu
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, Malta, NY12020, USA)
,
Jayez, David
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, Malta, NY12020, USA)
,
Mody, Jay
(Center for Complex Analysis, GLOBALFOUNDRIES, Malta, NY12020, USA)
,
Donegan, Keith
(Advanced Technology Development (ATD), GLOBALFOUNDRIES, Malta, NY12020, USA)
With each new advanced technology node, minimum feature sizes continue to shrink. As a result, the devices become denser and exposure tool's depth of focus decreases — making lithography one of the most crucial modules in the process flow. Hence, the elimination of hot spots triggered by prob...
With each new advanced technology node, minimum feature sizes continue to shrink. As a result, the devices become denser and exposure tool's depth of focus decreases — making lithography one of the most crucial modules in the process flow. Hence, the elimination of hot spots triggered by problematic pattern regions based on optical simulation, by cleaning wafer backside is a critical issue that needs to be addressed to prevent significant yield degradation.
With each new advanced technology node, minimum feature sizes continue to shrink. As a result, the devices become denser and exposure tool's depth of focus decreases — making lithography one of the most crucial modules in the process flow. Hence, the elimination of hot spots triggered by problematic pattern regions based on optical simulation, by cleaning wafer backside is a critical issue that needs to be addressed to prevent significant yield degradation.
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