Choi, Kwang-Seong
(ICT Creative Research Laboratory, ETRI,Daejeon,Korea)
,
Eom, Yong-Sung
(ICT Creative Research Laboratory, ETRI,Daejeon,Korea)
,
Moon, Seok Hwan
(ICT Creative Research Laboratory, ETRI,Daejeon,Korea)
,
Joo, Jiho
(ICT Creative Research Laboratory, ETRI,Daejeon,Korea)
,
Lee, Kwangjoo
(R & D Campus, LG Chem,Daejeon,Korea)
,
Kim, Jung Hak
(R & D Campus, LG Chem,Daejeon,Korea)
,
Kim, Ju hyeon
(R & D Campus, LG Chem,Daejeon,Korea)
Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding pr...
Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding process. Newly developed NCF for LABC was designed to have stability on a hot stage and to show solder wetting and fast curing with no void and optimal fillet during the LABC bonding process. As the laser is used as a heat source, the uniform heat should be provided on each interconnection without any damages on chip or a substrate. 780μ-thick daisy chain top and bottom chips with the minimum pitch of 30^m and bump number of about 27,000 were successfully bonded using the LABC and NCF film.
Laser-Assisted Bonding with Compression (LABC) technology with NCF was proposed to accomplish the productivity and process reliability at the same time. A quartz block as a header was used to deliver a pressure to the devices because of its extremely low absorption of the laser during the bonding process. Newly developed NCF for LABC was designed to have stability on a hot stage and to show solder wetting and fast curing with no void and optimal fillet during the LABC bonding process. As the laser is used as a heat source, the uniform heat should be provided on each interconnection without any damages on chip or a substrate. 780μ-thick daisy chain top and bottom chips with the minimum pitch of 30^m and bump number of about 27,000 were successfully bonded using the LABC and NCF film.
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