IPC분류정보
국가/구분 |
United States(US) Patent
공개
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0355888
(2006-02-17)
|
공개번호 |
US-0185474
(2006-08-24)
|
우선권정보 |
JP-JP2005-41712(2005-02-18) |
발명자
/ 주소 |
- Yamada,Tomoya
- Hirata,Koji
|
출원인 / 주소 |
- Yamada,Tomoya
- Hirata,Koji
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
0 |
초록
▼
A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the
A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 μm and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
대표청구항
▼
1. A copper powder containing 10-20,000 ppm of Sn. 2. A copper powder containing 100-2,000 ppm of Sn. 3. A copper powder according to claim 1, whose average particle diameter DM is 0.1-2 μm. 4. A copper powder according to claim 1, whose average particle diameter DM is 0.1-2 μm
1. A copper powder containing 10-20,000 ppm of Sn. 2. A copper powder containing 100-2,000 ppm of Sn. 3. A copper powder according to claim 1, whose average particle diameter DM is 0.1-2 μm. 4. A copper powder according to claim 1, whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. 5. A copper powder according to claim 1, obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions. 6. A copper powder according to claim 1, obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1, 000 ppm of Sn. 7. A copper powder suitable for use as filler in a conductive paste, containing 10-20,000 ppm of Sn, whose average particle diameter DM is 0.1-2 μm and the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. 8. A copper powder according to claim 2, whose average particle diameter DM is 0.1-2 μm. 9. A copper powder according to claim 2, whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. 10. A copper powder according to claim 3, whose average particle diameter DM is 0.1-2 μm and wherein the particle diameter of at least 80% of all particles is in the range of 0.5 DM-1.5 DM. 11. A copper powder according to claim 2, obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions. 12. A copper powder according to claim 3, obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions. 13. A copper powder according to claim 4, obtained by precipitating copper metal by reduction of Cu ions in the presence of Sn ions. 14. A copper powder according to claim 2, obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1, 000 ppm of Sn. 15. A copper powder according to claim 3, obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1, 000 ppm of Sn. 16. A copper powder according to claim 4, obtained by precipitating copper metal by reduction of cuprous oxide containing 10-1, 000 ppm of Sn.
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