HIGH RESOLUTION ELECTROHYDRODYNAMIC JET PRINTING FOR MANUFACTURING SYSTEMS
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
B41J-002/14
B41J-002/16
출원번호
US-0686304
(2015-04-14)
공개번호
US-0290938
(2015-10-15)
발명자
/ 주소
ROGERS, John A.
PARK, Jang-Ung
FERREIRA, Placid M.
MUKHOPADHYAY, Deepkishore
출원인 / 주소
ROGERS, John A.
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
Provided are high-resolution electrohydrodynamic inkjet (e-jet) printing systems and related methods for printing functional materials on a substrate surface. In an embodiment, a nozzle with an ejection orifice that dispenses a printing fluid faces a surface that is to be printed. The nozzle is elec
Provided are high-resolution electrohydrodynamic inkjet (e-jet) printing systems and related methods for printing functional materials on a substrate surface. In an embodiment, a nozzle with an ejection orifice that dispenses a printing fluid faces a surface that is to be printed. The nozzle is electrically connected to a voltage source that applies an electric charge to the fluid in the nozzle to controllably deposit the printing fluid on the surface. In an aspect, a nozzle that dispenses printing fluid has a small ejection orifice, such as an orifice with an area less than 700 μm2 and is capable of printing nanofeatures or microfeatures. In an embodiment the nozzle is an integrated-electrode nozzle system that is directly connected to an electrode and a counter-electrode. The systems and methods provide printing resolutions that can encompass the sub-micron range.
대표청구항▼
1. A method of depositing a feature onto a substrate surface comprising the steps of: providing an electrohydrodynamic printing system comprising: a nozzle having an ejection orifice for dispensing a printing fluid, wherein said ejection orifice has an ejection area that is less than 700 μm2;a subst
1. A method of depositing a feature onto a substrate surface comprising the steps of: providing an electrohydrodynamic printing system comprising: a nozzle having an ejection orifice for dispensing a printing fluid, wherein said ejection orifice has an ejection area that is less than 700 μm2;a substrate having a surface facing said nozzle;a voltage source for applying an electric charge to said nozzle to cause said printing fluid to be controllably deposited on said substrate surface;providing said printing fluid to said nozzle; andapplying an electrical charge to said printing fluid in said nozzle thereby establishing an electrostatic force capable of ejecting said printing fluid from said nozzle onto said surface to generate a feature on said substrate in a balanced mode that oscillates between a positive and a negative electric potential to reduce a net charge of printing fluid to said substrate compared to printing without oscillation between the positive and negative electric potential, and said method has a print resolution that is between 100 nm and 10 μm. 2. A method of depositing a printing fluid onto a substrate surface comprising the steps of: providing a nozzle containing printing fluid, wherein said nozzle has an ejection orifice area selected from a range that is between 0.12 μm2 and 700 μm2;providing a substrate surface to be printed;placing said substrate in fluid communication with said nozzle, wherein said substrate surface is separated from said nozzle by a separation distance; andapplying an electric charge to said nozzle to establish an electrostatic force to said printing fluid in said nozzle, thereby controllably ejecting said printing fluid from said ejection orifice onto said substrate surface, wherein said applying electric charge is by a balanced mode that oscillates between a positive and a negative electric potential to reduce a net charge of printing fluid to said substrate compared to printing without oscillation between the positive and negative electric potential, and said method has a print resolution that is between 100 nm and 10 μm. 3. The method of claim 2, wherein the electric charge is applied intermittently. 4. (canceled) 5. The method of claim 2, further comprising adding a surfactant to said printing fluid to decrease evaporation and surface tension. 6. The method of claim 2, further comprising coating at least a portion of said ejection orifice outer edge with a hydrophobic material to prevent wicking of printing material to said nozzle outer surface. 7. (canceled) 8. The method of claim 2, wherein said printing fluid deposited on said substrate surface is used in an electronic or biological device. 9. The method of claim 2 further comprising providing a substrate assist feature on said substrate surface prior to or during depositing said feature. 10. The method of claim 9, wherein said substrate assist feature comprises: a three-dimensional relief, recess or relief and recess feature pattern that provides a barrier to flow of printing fluid;a pattern of hydrophobic, hydrophilic or hydrophobic and hydrophilic regions; ora pattern of electric charge on said substrate surface. 11. The method of claim 2, wherein said controllably ejecting printing fluid comprises controlling a printing direction by providing a plurality of individually addressable counter-electrodes integrated with said nozzle to thereby control said printing direction. 12. A method of making an electrohydrodynamic ink jet having a plurality of ink jet nozzles, comprising the steps of: providing a nozzle substrate wafer having a first face and a second face, wherein the substrate is silicon {111} coated with a layer of silicon nitride;pre-etching the nozzle substrate wafer to expose a silicon wafer crystal plane orientation;providing a mask having a nozzle array pattern;depositing a resist layer on the layer of silicon nitride;aligning and contacting the mask with the pre-etched first face of the nozzle substrate wafer;removing the silicon nitride layer in a pattern corresponding to the nozzle array pattern to generate a nozzle array pattern of exposed silicon;etching relief features in the pattern of exposed silicon on the first face;coating the relief features with a membrane, wherein the membrane comprises silicon nitride or silicon dioxide, thereby forming a nozzle membrane;removing the silicon nitride layer from the second face of the substrate wafer; andetching the exposed second face thereby exposing a plurality of nozzle ejection orifices. 13. The method of claim 12, wherein the silicon substrate wafer and the membrane each have an etch rate, and the membrane etch rate is less than the silicon substrate wafer etch rate, thereby providing after etching the exposed second face ejection orifice that protrude from the substrate wafer. 14. The method of claim 12, wherein the number of nozzles is between 100 and 1000. 15. The method of claim 14, wherein the ejection orifice has a dimension that is less than 10 μm. 16. The method of claim 2, wherein the printing fluid comprises a suspension of nanoparticles, microparticles, nanoparticles and microparticles, or biological material. 17. The method of claim 2, wherein the printing fluid comprises biological material selected from the group consisting of cells, proteins, enzymes, DNA, RNA, antibody, and antigen. 18. The method of claim 2, further comprising the step of: generating a feature from said printing fluid on said substrate, wherein said feature is selected from the group consisting of a nanostructure, a microstructure, an electrode, a circuit, a biological material, a resist material and an electric device component. 19. A method of depositing a feature onto a substrate surface comprising the steps of: providing an electrohydrodynamic printing system comprising: a nozzle having: an ejection orifice for dispensing a printing fluid; an inner-facing surface capable of holding a printing fluid; and an outer-facing surface that faces a substrate to be printed, wherein said ejection orifice has an ejection area that is less than 700 μm2;an electrode that coats at least a portion of the inner-facing surface;a counter-electrode connected to said outer-facing surface;a substrate having a surface facing said nozzle; anda voltage source for applying an electric charge to said electrode or counter-electrode to cause printing fluid in said nozzle to be controllably deposited on said substrate surfaceproviding a substrate having a surface facing said nozzle;providing said printing fluid to said nozzle; andapplying an electrical charge to said electrode or counter-electrode, thereby establishing an electrostatic force capable of ejecting said printing fluid from said nozzle onto said surface to generate a feature on said substrate 20. The method of claim 19, wherein said substrate surface is not electrically conductive. 21. The method of claim 19, further comprising the step of providing an inhomogeneous electric field to the counter-electrode, thereby controlling a printing direction and printed fluid placement. 22. The method of claim 19, wherein the counter-electrode comprises a plurality of independently addressable electrodes.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.