An Optical Image Stabilization unit including a wire connecting a housing to a holder module, a bobbin disposed inside the outer blade, a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis, a first coil disposed at a periphery of the bo
An Optical Image Stabilization unit including a wire connecting a housing to a holder module, a bobbin disposed inside the outer blade, a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis, a first coil disposed at a periphery of the bobbin, a magnet moving the bobbin relative to the holder module by interacting with the first coil, a second coil moving the holder module relative to the housing by interacting with the magnet, a first solder portion disposed at a distal end of the wire to couple the wire to the housing, a second solder portion disposed at the other distal end of the wire to couple the wire to the holder module, and a buffer portion disposed at a part of the wire by being distanced from at least one of the first solder portion and the second solder portion to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module.
대표청구항▼
1. An OIS (Optical Image Stabilization) unit, comprising; a wire connecting a housing to a holder module, wherein the housing includes a base and a first substrate, and wherein the holder module includes an outer blade spaced apart from the base, a bobbin disposed inside the outer blade, and a sprin
1. An OIS (Optical Image Stabilization) unit, comprising; a wire connecting a housing to a holder module, wherein the housing includes a base and a first substrate, and wherein the holder module includes an outer blade spaced apart from the base, a bobbin disposed inside the outer blade, and a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis,a first coil disposed at a periphery of the bobbin;a magnet moving the bobbin relative to the holder module by interacting with the first coil;a second coil moving the holder module relative to the housing by interacting with the magnet;a first solder portion disposed at a distal end of the wire to couple the wire to the housing;a second solder portion disposed at the other distal end of the wire to couple the wire to the holder module; anda buffer portion disposed at a part of the wire by being distanced from at least one of the first solder portion and the second solder portion to restrict a movement of the holder module relative to the housing by being coupled to at least one of the housing and the holder module. 2. The OIS unit of claim 1, wherein the first solder portion couples the wire with the first substrate. 3. The OIS unit of claim 1, wherein the wire and the spring member are electrically connected through the second solder portion. 4. The OIS unit of claim 1, wherein the buffer portion couples the wire with the housing. 5. The OIS unit of claim 1, wherein the buffer portion contacts at least one of the first solder portion and the second solder portion. 6. The OIS unit of claim 1, wherein the buffer portion is disposed between the first solder portion and the second solder portion. 7. The OIS unit of claim 6, wherein the buffer portion wraps a part of the wire. 8. The OIS unit of claim 7, wherein the buffer portion completely wraps a part of the wire. 9. The OIS unit of claim 6, wherein the buffer portion is an insulation material. 10. The OIS unit of claim 3, wherein the holder module further includes a second substrate, wherein the second solder portion couples the wire with the second substrate, and wherein the wire is electrically connected to the spring member through the second substrate. 11. The OIS unit of claim 5, wherein the buffer portion is arranged to wrap a part of at least one of the first solder portion and the second solder portion. 12. The OIS unit of claim 5, wherein the buffer portion is arranged to wrap an entire part of at least one of the first solder portion and the second solder portion. 13. The OIS unit of claim 9, wherein the buffer portion is an adhesive material. 14. The OIS unit of claim 1, wherein a current is supplied to the first coil through the first solder portion and the second solder portion. 15. The OIS unit of claim 3, wherein the wire supplies a current to the first coil through the spring member. 16. The OIS unit of claim 1, wherein the first substrate further includes a terminal unit to supply a current to the first coil and the second coil. 17. The OIS unit of claim 16, wherein the terminal unit includes two (2) terminals for auto focusing control and four (4) terminals for OIS driving. 18. The OIS unit of claim 4, wherein the wire and the housing are adhered by the buffer portion. 19. The OIS unit of claim 2, wherein the first solder portion connects a distal end of the wire having passed through a hole of the first substrate to the substrate using a solder. 20. The OIS unit of claim 19, wherein an area of the first substrate corresponding to the first solder portion is opened by a solder resist. 21. The OIS unit of claim 19, wherein the buffer portion and the solder are mutually oppositely arranged relative to the first substrate. 22. The OIS unit of claim 1, wherein at least one of the first solder portion and the second solder portion wraps a distal end of the wire. 23. The OIS unit of claim 1, wherein the buffer portion restricts a movement of holder module relative to the housing when a shock is applied to at least one of the first solder portion and the second solder portion. 24. The OIS unit of claim 1, wherein the buffer portion mitigates a shock when a shock is applied to one of the first solder portion and the second solder portion. 25. The OIS unit of claim 1, wherein the buffer portion mitigates a trembling of at least one of the wire and the holder module when a shock is applied to one of the first solder portion and the second solder portion. 26. A camera module of claim 1, further comprising a third substrate disposed under the base and an image sensor coupled to the third substrate, wherein the holder module corrects a handshake by moving relative to the image sensor. 27. An OIS (Optical Image Stabilization) unit, comprising: a wire connecting a housing and a holder member, wherein the holder module includes an outer blade spaced apart from a base, a bobbin disposed inside the outer blade, and a spring member disposed at the outer blade to support a movement of the bobbin in a direction along an optical axis,a first coil disposed at a periphery of the bobbin;a magnet moving the bobbin relative to the holder module by interacting with the first coil;a second coil moving the holder module relative to the housing by interacting with the magnet;a first solder portion disposed at a distal end of the wire to couple the wire to the housing;a second solder portion disposed at the other distal end of the wire to couple the wire to the holder module; anda buffer portion interposed between the first solder portion and the second solder portion to attach the wire to at least one of the housing and the holder module. 28. The OIS unit of claim 27, wherein the housing further includes a first substrate, wherein the first solder portion couples the wire with the first substrate, and wherein the wire is electrically connected to the spring member through the first substrate. 29. The OIS unit of claim 27, wherein the holder module further includes a second substrate, and wherein the second solder portion couples the wire with the second substrate, and wherein the wire is electrically connected to the spring member through the second substrate. 30. The OIS unit of claim 27, wherein the buffer portion is coupled to the wire and the housing.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.