Some embodiments provide a novel surface-mount technology (SMT) printed circuit board (PCB) assembly. The SMT PCB assembly includes at least a pair of adjacent conductive pads with a small gap between them. During the development phase of the SMT PCB assembly, the small gap between the adjacent cond
Some embodiments provide a novel surface-mount technology (SMT) printed circuit board (PCB) assembly. The SMT PCB assembly includes at least a pair of adjacent conductive pads with a small gap between them. During the development phase of the SMT PCB assembly, the small gap between the adjacent conductive pads, as well as some of the adjacent portions of the conductive pads, are covered with solder mask. An SMT component (e.g., a zero-ohm resistor) may then be mounted to the SMT PCB assembly through the exposed portions of the conductive pads. During the production phase, however, the solder mask is revised to cover the far sides of the conductive pads, which results in the adjacent portions of the conductive pads being exposed. As such, a solder jumper can easily be created during the production phase by connecting the two conductive pads using solder paste.
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1. A surface-mount technology (SMT) printed circuit board (PCB) comprising: at least two adjacent conductive pads, wherein a first portion of each conductive pad is covered by a solder mask to expose a second different portion of the conductive pad to be used as a landing pad for an SMT component. 2
1. A surface-mount technology (SMT) printed circuit board (PCB) comprising: at least two adjacent conductive pads, wherein a first portion of each conductive pad is covered by a solder mask to expose a second different portion of the conductive pad to be used as a landing pad for an SMT component. 2. The SMT PCB of claim 1, wherein the solder mask is a first solder mask, wherein the second portion of each conductive pad is subsequently covered by a second solder mask to expose the first portion of the conductive pad. 3. The SMT PCB of claim 2, wherein the first solder mask is used during a development phase while the second solder mask is used during a production phase. 4. The SMT PCB of claim 1, wherein the first portion of each conductive pad is adjacent an edge of the other conductive pad. 5. The SMT PCB of claim 1, wherein the second portion of each conductive pad is located on a far side of the conductive pad in relation to the other conductive pad. 6. The SMT PCB of claim 1, wherein the SMT component is a zero-ohm resistor. 7. The SMT PCB of claim 1, wherein the first portions of the conductive pads are exposed to apply solder paste on the first portions and to create a solder jumper. 8. The SMT PCB of claim 7, wherein the solder jumper replaces the SMT component. 9. The SMT PCB of claim 18, wherein the SMT component is soldered to the second portions of the conductive pads to conduct design tests. 10. The SMT PCB of claim 19, wherein the first portions of the conductive pads extend under a body of the SMT component. 11. The SMT PCB of claim 1, wherein the adjacent conductive pads are separated by a gap having a width between 0.003″ and 0.010″. 12. The SMT PCB of claim 1, wherein an edge of each conductive pad comprises a tab portion that extends toward the other conductive pad. 13. The SMT PCB of claim 12, wherein the tab portions are offset from one another in a transverse direction. 14. The SMT PCB of claim 1, wherein an edge of each conductive pad comprises a set of interlocking fingers extending toward the other conductive pad. 15. The SMT PCB of claim 1, wherein the adjacent conductive pads are separated by a gap having an offset configuration, the offset configuration comprising a first portion that extends in a transverse direction, a second portion that extends in the transverse direction and that is offset from the first portion by an offset distance, and a third portion that extends perpendicularly to the first and second portions and connects adjacent ends of the first and second portions. 16. The SMT PCB of claim 15, further comprising a solder jumper bridging the gap between the first and second conductive pads. 17. A method for implementing a solder jumper on a surface-mount technology (SMT) printed circuit board (PCB), the method comprising: receiving a PCB having a plurality of conductive pads for mounting a plurality of SMT components to the PCB;applying a first solder mask on the PCB such that a first portion of each conductive pad in a pair of adjacent conductive pads is covered by the first solder mask to expose a second portion of each conductive pad in the pair of adjacent conductive pads;mounting an SMT component to the PCB through the pair of adjacent conductive pads in order to perform design tests; andapplying a second solder mask on the PCB after removing the SMT component, wherein the second solder mask covers the second portion of each conductive pad in the pair of adjacent conductive pads to expose the first portion of each conductive pad in the pair of adjacent conductive pads. 18. The method of claim 17, further comprising implementing a solder jumper by connecting the first exposed portions of the pair of adjacent conductive pads using solder. 19. The SMT PCB of claim 17, wherein the first portion of each conductive pad in the pair of adjacent conductive pads is adjacent an edge of the other conductive pad in the pair of adjacent conductive pads. 20. The SMT PCB of claim 17, wherein the second portion of each conductive pad in the pair of adjacent conductive pads is located on a far side of each conductive pad in relation to the other conductive pad in the pair of adjacent conductive pads. 21. The SMT PCB of claim 17, wherein the SMT component is a zero-ohm resistor, wherein the solder jumper subsequently replaces the zero-ohm resistor. 22. The SMT PCB of claim 17, wherein an edge of each conductive pad in the pair of conductive pads comprises a tab portion that extends toward the other conductive pad in the pair of conductive pads. 23. The SMT PCB of claim 17, wherein an edge of each conductive pad in the pair of conductive pads comprises a set of interlocking fingers extending toward the other conductive pad in the pair of conductive pads. 24. A surface-mount technology (SMT) printed circuit board (PCB) assembly, comprising: at least one solder jumper comprising a pair of conductive pads and solder connecting the conductive pads, wherein a portion of each conductive pad is covered by solder mask. 25. The SMT PCB assembly of claim 24, wherein the solder jumper replaces a resistor that was mounted to the SMT PCB assembly. 26. The SMT PCB assembly of claim 25, wherein the resistor comprises a zero-ohm resistor. 27. The SMT PCB assembly of claim 24, wherein the portion of each conductive pad that is covered by the solder mask was previously exposed for performing design tests. 28. The SMT PCB assembly of claim 24, wherein the solder mask is a first solder mask, wherein the currently exposed portion of each conductive pad was previously covered by a second solder mask for performing the design tests. 29. The SMT PCB assembly of claim 24, wherein an edge of each conductive pad comprises a tab portion that extends toward the other conductive pad. 30. The SMT PCB assembly of claim 29, wherein the tab portions are offset from one another in a transverse direction. 31. The SMT PCB assembly of claim 24, wherein an edge of each conductive pad comprises a set of interlocking fingers extending toward the other conductive pad. 32. The SMT PCB assembly of claim 24, wherein the conductive pads are separated by a gap having an offset configuration, the offset configuration comprising a first portion that extends in a transverse direction, a second portion that extends in the transverse direction and that is offset from the first portion by an offset distance, and a third portion that extends perpendicularly to the first and second portions and connects adjacent ends of the first and second portions. 33. The SMT PCB assembly of claim 24, wherein the conductive pads are separated by a gap having a width between 0.003″ and 0.010″.
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