Transistor Outline (TO) Can Optical Transceiver
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
G02B-006/42
G02B-006/42
G02B-006/42
G02B-006/42
H04B-010/40
G02B-006/42
출원번호
US-0497427
(2017-04-26)
공개번호
US-0315313
(2017-11-02)
발명자
/ 주소
Cheng, Ning
출원인 / 주소
Cheng, Ning
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
An optical transceiver comprises a transmitter and a receiver housed in a transistor outline (TO) can. The receiver comprises a first submount comprising at least one waveguide, a photodiode coupled to the first submount and the at least one waveguide, and a transimpedance amplifier (TIA) coupled to
An optical transceiver comprises a transmitter and a receiver housed in a transistor outline (TO) can. The receiver comprises a first submount comprising at least one waveguide, a photodiode coupled to the first submount and the at least one waveguide, and a transimpedance amplifier (TIA) coupled to the first submount and the at least one waveguide, wherein the at least one waveguide couples the photodiode to the TIA, wherein the at least one waveguide is positioned on the first submount in between the photodiode and the TIA.
대표청구항▼
1. An optical transceiver comprising: a transistor outline (TO)-can; anda receiver housed inside the TO-can, with the receiver comprising: a first submount comprising at least one first waveguide;a photodiode coupled to the at least one first waveguide; anda transimpedance amplifier (TIA) coupled to
1. An optical transceiver comprising: a transistor outline (TO)-can; anda receiver housed inside the TO-can, with the receiver comprising: a first submount comprising at least one first waveguide;a photodiode coupled to the at least one first waveguide; anda transimpedance amplifier (TIA) coupled to the first submount and the at least one first waveguide,wherein the at least one first waveguide couples the photodiode to the TIA, andwherein the at least one first waveguide is positioned on the first submount in between the photodiode and the TIA. 2. The optical transceiver of claim 1, wherein the photodiode and the TIA are flip-chip bonded to the first submount. 3. The optical transceiver of claim 1, wherein a contact point on the photodiode is coupled to a first contact point on the at least one first waveguide, and wherein a contact point on the TIA is coupled to a second contact point on the at least one first waveguide. 4. The optical transceiver of claim 1, further comprising: a transmitter housed inside the TO-can, with the transmitter comprising: a second submount comprising at least one second waveguide;a bonding wire; anda laser diode coupled to the at least one second waveguide,wherein the at least one second waveguide couples the bonding wire to the laser diode. 5. The optical transceiver of claim 4, wherein the laser diode is flip-chip bonded to the second submount. 6. The optical transceiver of claim 5, wherein the TO-can comprises a TO-header and a TO-cap coupled to the TO header, and wherein the second submount passes through the TO-header of the TO-can. 7. The optical transceiver of claim 1, wherein the TO-can comprises: a TO-header; anda TO-cap coupled to the TO-header. 8. The optical transceiver of claim 1, wherein the first submount comprises a second waveguide, wherein the second waveguide couples to a bonding wire, and wherein the bonding wire couples to an input/output (I/O) pin of the optical transceiver. 9. The optical transceiver of claim 1, wherein a ground plane is formed on the first submount around the at least one first waveguide and an isolation layer surrounding the at least one first waveguide. 10. The optical transceiver of claim 1, further comprising: a wavelength-division multiplexing (WDM) filter interposed between the receiver and the transmitter; anda lens transmitting light between an interior and an exterior of the optical transceiver. 11. An optical transceiver comprising: a receiver comprising: a transimpedance amplifier (TIA);a photodiode; anda first submount comprising at least one first waveguide, wherein the at least one first waveguide is configured to couple the TIA and the photodiode; anda transmitter comprising: a laser diode;an input/output (I/O) pin; anda second submount comprising at least one second waveguide, wherein the at least one second waveguide couples to a bonding wire, and wherein the bonding wire couples to the I/O pin. 12. The optical transceiver of claim 11, further comprising a transistor outline (TO)-can housing the transmitter and the receiver. 13. The optical transceiver of claim 11, further comprising a TO-header, wherein the transmitter and the receiver are positioned on the TO-header. 14. The optical transceiver of claim 11, wherein the photodiode and the TIA are flip-chip bonded to the first submount, wherein a contact point on the photodiode is bonded to a first contact point on the at least one first waveguide, and wherein a contact point on the TIA is bonded to a second contact point on the at least one first waveguide. 15. The optical transceiver of claim 11, wherein the laser diode is flip-chip bonded to the second submount, and wherein a contact point on the laser diode is bonded to a contact point on the at least one second waveguide. 16. The optical transceiver of claim 11, wherein a ground plane is formed on the first submount around the at least one first waveguide and an isolation layer surrounding the at least one first waveguide. 17. The optical transceiver of claim 11, wherein a ground plane is formed on the second submount around the at least one second waveguide and an isolation layer surrounding the at least one second waveguide. 18. A method implemented in a transistor outline (TO)-can, the method comprising: receiving, by a lens, a first light from outside the TO-can;filtering, by a filter, the first light;converting, by a back-illuminated photodiode, the first light into a current; andpassing, by the back-illuminated photodiode via a waveguide, the current to a transimpedance amplifier (TIA), wherein the waveguide is positioned on a first submount, and wherein the first submount is positioned in between the back-illuminated photodiode and a TO-header of the TO-can. 19. The method of claim 18, further comprising: converting, by the TIA, the current to a voltage; andcommunicating the voltage to an input/output (I/O) pin via a bonding wire. 20. The method of claim 18, further comprising: receiving, by a laser diode and via a second waveguide, instructions to emit a second light;emitting, by the laser diode, the second light;filtering, by the filter, the second light; anddirecting, by the lens, the second light outside the TO-can.
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