PPTC DEVICE HAVING LOW MELTING TEMPERATURE POLYMER BODY
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IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H01H-085/06
C08L-023/06
H02H-009/02
C08L-023/16
C08K-003/14
출원번호
US-0138611
(2018-09-21)
공개번호
US-0096621
(2019-03-28)
발명자
/ 주소
Chen, Jianhua
Tsang, Chun Kwan
출원인 / 주소
Chen, Jianhua
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body. The PPTC body may comprise a polymer matrix and a conductive filler, wherein the fuse device has a trip temperature of less than 12
A fuse device may include a PPTC body; a first electrode, disposed on a first side of the PPTC body; and a second electrode, disposed on a second side of the PPTC body. The PPTC body may comprise a polymer matrix and a conductive filler, wherein the fuse device has a trip temperature of less than 120° C.
대표청구항▼
1. A fuse device, comprising: a PPTC body;a first electrode, disposed on a first side of the PPTC body; anda second electrode, disposed on a second side of the PPTC body;wherein the PPTC body comprises a polymer matrix and a conductive filler,wherein the polymer matrix comprises a polymer having a m
1. A fuse device, comprising: a PPTC body;a first electrode, disposed on a first side of the PPTC body; anda second electrode, disposed on a second side of the PPTC body;wherein the PPTC body comprises a polymer matrix and a conductive filler,wherein the polymer matrix comprises a polymer having a melting temperature of less than 150° C. 2. The fuse device of claim 1, wherein the polymer matrix comprises a fluoropolymer having a melting temperature less than 150° C. 3. The fuse device of claim 2, wherein the polymer matrix comprises one or more polymers, wherein the one or more polymers comprises a volume fraction of the PPTC body of 35% to 75%, wherein the conductive filler comprises a volume fraction of 25% to 65%, and wherein a volume resistivity of the conductive filler is less than 500 μΩ-cm. 4. The fuse device of claim 2, wherein a hold current density of the PPTC body at 25° C. 0.05 to 0.4 A/mm2. 5. The fuse device of claim 1, wherein the polymer matrix comprises a crystalline polyolefin polymer, a polyolefin copolymer, or a combination of a crystalline polyolefin polymer and a polyolefin copolymer, the polymer matrix having a melting point less than 120° C. 6. The fuse device of claim 5, wherein the polymer matrix comprises a volume fraction of the PPTC body of 35% to 75%, wherein the conductive filler comprises a volume fraction of 25% to 65%, and wherein the volume resistivity of the conductive filler is less than 500 μ-cm. 7. The fuse device of claim 5, wherein a hold current density of the PPTC body at 25 C 0.05 to 0.4 A/mm2. 8. The fuse device of claim 1, comprising a single layer surface mount device. 9. The fuse device of claim 1, comprising a double layer surface mount device. 10. A fuse device, comprising: a PPTC body;a first electrode, disposed on a first side of the PPTC body;a second electrode, disposed on a second side of the PPTC body; andwherein the PPTC body comprises a polymer matrix and a conductive filler,wherein the polymer matrix comprises a low temperature PVDF material having a melting temperature in a range between 90° C. and 110° C. 11. The fuse device of claim 10, wherein a hold current density of the PPTC body at 25° C. 0.05 to 0.4 A/mm2. 12. The fuse device of claim 10, wherein the polymer matrix comprises a volume fraction of the PPTC body of 35% to 75%, wherein the conductive filler comprises a volume fraction of 25% to 65%, and wherein a volume resistivity of the conductive filler is less than 500 13. The fuse device of claim 10, comprising a trip temperature of 120 C or less. 14. The fuse device of claim 10, comprising a tungsten carbide filler. 15. A fuse device, comprising: a PPTC body;a first electrode, disposed on a first side of the PPTC body;a second electrode, disposed on a second side of the PPTC body; andwherein the PPTC body comprises a polymer matrix and a conductive filler,wherein the polymer matrix comprises a linear low-density polyethylene material, having a melting temperature is a range of 100° C. 16. The fuse device of claim 15, comprising a trip temperature of 90° C. 17. The fuse device of claim 15, comprising a tungsten carbide filler.
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