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In one embodiment, a semiconductor device includes a first chip including a substrate, a first plug on the substrate, and a first pad on the first plug, and a second chip including a second plug and a second pad under the second plug. The second chip includes an electrode layer electrically connecte

In one embodiment, a semiconductor device includes a first chip including a substrate, a first plug on the substrate, and a first pad on the first plug, and a second chip including a second plug and a second pad under the second plug. The second chip includes an electrode layer electrically connected to the second plug, a charge storage layer provided on a side face of the electrode layer via a first insulator, and a semiconductor layer provided on a side face of the charge storage layer via a second insulator. The first and second pads are bonded with each other, and the first and second plugs are disposed so that at least a portion of the first plug and at least a portion of the second plug do not overlap with each other in a first direction that is perpendicular to a surface of the substrate.

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1. A semiconductor device comprising: a first chip including a substrate, a first plug provided on the substrate, and a first pad provided on the first plug; anda second chip including a second plug and a second pad provided under the second plug,the second chip comprising:an electrode layer electri

1. A semiconductor device comprising: a first chip including a substrate, a first plug provided on the substrate, and a first pad provided on the first plug; anda second chip including a second plug and a second pad provided under the second plug,the second chip comprising:an electrode layer electrically connected to the second plug;a charge storage layer provided on a side face of the electrode layer via a first insulator; anda semiconductor layer provided on a side face of the charge storage layer via a second insulator,whereinthe first pad and the second pad are bonded with each other, andthe first and second plugs are disposed so that at least a portion of the first plug and at least a portion of the second plug do not overlap with each other in a first direction that is perpendicular to a surface of the substrate. 2. The device of claim 1, wherein a thickness of the first plug is equal to or greater than twice as thick as a thickness of the first pad, and a thickness of the second plug is equal to or greater than twice as thick as a thickness of the second pad. 3. The device of claim 1, further comprising: a first interconnect that extends in a first interconnect layer provided under the first plug and is electrically connected to the first plug; anda second interconnect that extends in a second interconnect layer provided on the second plug and is electrically connected to the second plug. 4. The device of claim 3, further comprising a third plug provided on the second pad and disposed so as not to contact each interconnect that extends in the second interconnect layer. 5. The device of claim 4, wherein the first and third plugs are disposed so that at least a portion of the first plug and at least a portion of the third plug do not overlap with each other in the first direction. 6. The device of claim 3, further comprising a fourth plug provided under the first pad and disposed so as not to contact each interconnect that extends in the first interconnect layer. 7. The device of claim 6, wherein the second and fourth plugs are disposed so that at least a portion of the second portion and at least a portion of the fourth plug do not overlap with each other in the first direction. 8. The device of claim 1, wherein the first and second pads contain copper or nickel. 9. The device of claim 1, wherein the first and second pads are electrically connected to each other via a first projecting portion that projects from an upper face of the first pad and/or a second projecting portion that projects from a lower face of the second pad. 10. The device of claim 1, wherein the first plug is electrically connected to a transistor provided below the first plug. 11. The device of claim 1, wherein, in a case where a portion of the first plug and a portion of the second plug overlap with each other in the first direction, an area of an overlapping portion of the first and second plugs is equal to or less than ⅓ of an area of a non-overlapping portion of the first and second plugs. 12. A semiconductor device comprising: a substrate;a first plug provided above the substrate;a first pad provided on the first plug;a second pad provided on the first pad and electrically connected to the first pad; anda second plug provided on the second pad,wherein the first and second plugs are disposed so that the first and second plugs do not overlap with each other in a first direction that is perpendicular to a surface of the substrate. 13. The device of claim 12, wherein a thickness of the first plug is equal to or greater than twice as thick as a thickness of the first pad, and a thickness of the second plug is equal to or greater than twice as thick as a thickness of the second pad. 14. The device of claim 12, further comprising: a first interconnect that extends in a first interconnect layer provided under the first plug and is electrically connected to the first plug; anda second interconnect that extends in a second interconnect layer provided on the second plug and is electrically connected to the second plug. 15. The device of claim 14, further comprising a third plug provided on the second pad and disposed so as not to contact each interconnect that extends in the second interconnect layer. 16. The device of claim 15, wherein the first and third plugs are disposed so that the first and third plugs do not overlap with each other in the first direction. 17. The device of claim 14, further comprising a fourth plug provided under the first pad and disposed so as not to contact each interconnect that extends in the first interconnect layer. 18. The device of claim 17, wherein the second and fourth plugs are disposed so that the second and fourth plugs do not overlap with each other in the first direction. 19. The device of claim 12, wherein the first and second pads contain copper or nickel. 20. The device of claim 12, wherein the first and second pads are electrically connected to each other via a first projecting portion that projects from an upper face of the first pad and/or a second projecting portion that projects from a lower face of the second pad.