METHOD AND APPARATUS FOR DIRECT MEASUREMENT OF CHUCKING FORCE ON AN ELECTROSTATIC CHUCK
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
G01L-001/04
H01L-021/683
G01L-001/16
출원번호
16566409
(2019-09-10)
공개번호
20200103294
(2020-04-02)
발명자
/ 주소
Potter, Charles G.
Boyd, JR., Wendell Glenn
Raj, Govinda
Hirahara, Robert
출원인 / 주소
Potter, Charles G.
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
Embodiments disclosed herein include a method of measuring the chucking force of an electrostatic chuck. In an embodiment, the method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to
Embodiments disclosed herein include a method of measuring the chucking force of an electrostatic chuck. In an embodiment, the method comprises placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors, and applying a chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck, and processing a plurality of wafers on the electrostatic chuck. In an embodiment, the method further comprises placing the sensor wafer onto the electrostatic chuck, and applying the chucking voltage to the electrostatic chuck. In an embodiment, the method further comprises measuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck.
대표청구항▼
1. A method of measuring the chucking force of an electrostatic chuck, comprising: placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors;applying a chucking voltage to the electrostatic chuck;measuring the chucking force with the plur
1. A method of measuring the chucking force of an electrostatic chuck, comprising: placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises a plurality of pressure sensors;applying a chucking voltage to the electrostatic chuck;measuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck;processing a plurality of wafers on the electrostatic chuck;placing the sensor wafer onto the electrostatic chuck;applying the chucking voltage to the electrostatic chuck; andmeasuring the chucking force with the plurality of pressure sensors to determine a second chucking force profile of the electrostatic chuck. 2. The method of claim 1, further comprising: comparing the first chucking force profile with the second chucking force profile. 3. The method of claim 1, wherein the chucking voltage is a range of voltages. 4. The method of claim 1, wherein the pressure sensors are embedded in the sensor wafer. 5. The method of claim 4, wherein the sensor wafer comprises a bottom substrate and a top substrate, and wherein the pressure sensors are positioned between the bottom substrate and the top substrate. 6. The method of claim 5, wherein a cavity is formed between the bottom substrate and the top substrate. 7. The method of claim 5, wherein the pressure sensors are spring gauge sensors. 8. The method of claim 5, wherein the first substrate and the second substrate are silicon substrates. 9. The method of claim 1, further comprising: comparing the first chucking profile to a chucking profile of a second electrostatic chuck. 10. The method of claim 1, wherein the plurality of sensors are arranged across a surface of the sensor wafer. 11. A sensor wafer, comprising: a first substrate;a second substrate over the first substrate, wherein surfaces of the first substrate and the second substrate define a cavity between the first substrate and the second substrate; anda plurality of pressure sensors in the cavity. 12. The sensor wafer of claim 11, wherein the sensors are spring gauge sensors. 13. The sensor wafer of claim 11, wherein the sensors are electrically coupled to a computing module embedded in one of the first or second substrate. 14. The sensor wafer of claim 13, wherein the sensors are electrically coupled to the first substrate and the second substrate. 15. The sensor wafer of claim 13, wherein the sensors are electrically coupled to one of the first substrate and the second substrate. 16. The sensor wafer of claim 13, wherein the computing module further comprises a battery. 17. The sensor wafer of claim 16, wherein the computing module further comprises a wireless communication interface. 18. A method of measuring the chucking force of an electrostatic chuck, comprising: placing a sensor wafer onto the electrostatic chuck, wherein the sensor wafer comprises: a first substrate;a second substrate over the first substrate, wherein surfaces of the first substrate and the second substrate define a cavity between the first substrate and the second substrate; anda plurality of pressure sensors in the cavity;applying a chucking voltage to the electrostatic chuck; andmeasuring the chucking force with the plurality of pressure sensors to determine a first chucking force profile of the electrostatic chuck. 19. The method of claim 18, wherein the plurality of sensors are placed within a cavity formed between the first substrate and the second substrate. 20. The method of claim 19, wherein the cavity is hermetically sealed.
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