The present invention discloses a VCSEL array that can function in at least two different operational modes. In one operational mode, the VCSEL array functions as a regular-patterned array; and in the other operational mode, the VCSEL array functions as an irregular-patterned array. Thus, the same V
The present invention discloses a VCSEL array that can function in at least two different operational modes. In one operational mode, the VCSEL array functions as a regular-patterned array; and in the other operational mode, the VCSEL array functions as an irregular-patterned array. Thus, the same VCSEL chip may be used as an illumination light source or a structural light method light source for 3D sensing, depending on the selected operational mode.
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1. A Vertical Cavity Surface Emitting Laser (VCSEL) array, comprising: a substrate;a plurality of VCSEL structures formed on the substrate in a regular pattern, each VCSEL structure comprising a first reflector region, an active region, and a second reflector region, wherein the plurality of VCSEL s
1. A Vertical Cavity Surface Emitting Laser (VCSEL) array, comprising: a substrate;a plurality of VCSEL structures formed on the substrate in a regular pattern, each VCSEL structure comprising a first reflector region, an active region, and a second reflector region, wherein the plurality of VCSEL structures can be powered on at the same time;a first metal that electrically connects a selected number but not all of the VCSEL structures so that the selected number of the VCSEL structures form a predetermined irregular pattern of light emitters when only the selected number of the VCSEL structures are powered on; anda second metal that electrically connects at least some of the VCSEL structures which are not electrically connected to the first metal, wherein the first metal and the second metal are electrically insulated from each other. 2. The VCSEL array of claim 1, wherein the regular pattern comprises a plurality of rows and VCSEL structures in each row are spaced apart in equal distance. 3. The VCSEL array of claim 1, wherein the regular pattern comprises a plurality of concentric circles and VCSEL structures in each circle are spaced apart in equal distance. 4. The VCSEL array of claim 1, wherein the predetermined irregular pattern is a random or pseudorandom pattern. 5. The VCSEL array of claim 1 further comprises a different contact for each VCSEL structure. 6. The VCSEL array of claim 5 further comprise an optical component, wherein the first and second metals are deposited on the optical component before the optical component is fixed above the VCSEL structures during a packaging process. 7. The VCSEL array of claim 6, wherein the optical component comprises a plurality of optical lenses or an optical system. 8. The VCSEL array of claim 1, wherein the active region comprises a multiple-quantum-well (MQW) structure, the first reflector region comprises an n-type Distributed Bragg Reflector (DBR), and the second reflector region comprises a p-type DBR. 9. The VCSEL array of claim 1 further comprises a third metal that electrically connects all VCSEL structures which are not electrically connected to the first metal or second metal, wherein the third metal is electrically insulated from the first metal and the second metal. 10. The VCSEL array of claim 1, wherein the first metal and the second metal are portions of a same metal layer. 11. The VCSEL array of claim 1, wherein the first metal comprises a first metal layer and the second metal comprises a second metal layer. 12. A Vertical Cavity Surface Emitting Laser (VCSEL) array, comprising: a submount;a plurality of VCSEL structures formed in a regular pattern, each VCSEL structure comprising a first reflector region, an active region, and a second reflector region, wherein the plurality of VCSEL structures are mounted on the submount via flip-chip method and can be powered on at the same time;a first metal and a second metal that electrically connect anode and cathode terminals of a selected number but not all of the VCSEL structures respectively so that the selected number of the VCSEL structures form a predetermined irregular pattern of light emitters when only the selected number of the VCSEL structures are powered on; anda third metal and a fourth metal that electrically connect anode and cathode terminals of at least some of the VCSEL structures which are not electrically connected to the first and second metals respectively. 13. The VCSEL array of claim 12, wherein the first, second, third, and fourth metals are deposited on the submount before the VCSEL structures are mounted on the submount during a packaging process. 14. The VCSEL array of claim 12, wherein the regular pattern comprises a plurality of rows and VCSEL structures in each row are spaced apart in equal distance. 15. The VCSEL array of claim 12, wherein the irregular pattern comprises a random pattern or pseudorandom pattern. 16. The VCSEL array of claim 12 further comprises a fifth metal and a sixth metal that electrically connects anode and cathode terminals of all VCSEL structures, which are not electrically connected to the first, second, third, or fourth metal, respectively. 17. The VCSEL array of claim 12, wherein the second and fourth metals are portions of the same metal layer. 18. The VCSEL array of claim 12, wherein the first metal and third metal are insulated portions of the same metal layer. 19. The VCSEL array of claim 12, wherein the first metal comprises a first metal layer and the third metal comprises a third metal layer.
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