초록 ▼

A device may generate a multi-layer stack of sheets that may be adhered into a slab-shaped preform for thermal drawing. The sheets may include sublayers. Stacking the sub-layered sheets results in accumulation of layers in the final fabricated preform. The stacking process may use mechanical transla

A device may generate a multi-layer stack of sheets that may be adhered into a slab-shaped preform for thermal drawing. The sheets may include sublayers. Stacking the sub-layered sheets results in accumulation of layers in the final fabricated preform. The stacking process may use mechanical translation and conveyance to support placement of the sheets and fabrication of the stack.

대표청구항 ▼

1. A device comprising: an extrusion die including an extrusion output, the extrusion output slit-shaped to produce a film;a preform assembly platform;a translation stage, where motion by the translation stage causes relative motion between the extrusion output and the preform assembly platform; and

1. A device comprising: an extrusion die including an extrusion output, the extrusion output slit-shaped to produce a film;a preform assembly platform;a translation stage, where motion by the translation stage causes relative motion between the extrusion output and the preform assembly platform; andcontroller circuitry communicatively coupled to the translation stage, the controller circuitry configured to send motion commands to the translation stage to position the preform assembly platform such that current film generated by extrusion die is layered on top of previous film generated by the extrusion die to create a preform stack. 2. The device of claim 1, where the extrusion die further includes multiple extrusion inputs coupled to the extrusion output, and the extrusion die includes up to 12 inputs. 3. The device of claim 2 wherein the extrusion die output is coupled to the multiple extrusion inputs by channels that force materials from the multiple extrusion inputs into a single stream for the extrusion output to produce a multi-sublayer film at the extrusion output. 4. The device of claim 2 wherein a subset of the multiple extrusion inputs are each coupled to a single material feed line to produce multiple same-material sublayers within the film. 5. The device of claim 4 wherein the subset includes odd-film-sublayer extrusion inputs. 6. The device of claim 4 wherein a complement set of extrusion inputs are each coupled to another single material feed line, the complement set including the complement set of the subset, where: and the complement set incudes even-film-sublayer extrusion inputs. 7. The device of claim 1 further comprising: a roller fixed in a position relative to the extrusion output, the position selected such that the roller imparts vertical pressure on the film after the film exits the output. 8. The device of claim 1 further comprising a cutter fixed in a position relative to the extrusion output, the cutter communicatively coupled to the controller circuitry where, the controller circuitry is further configured to: determine that the translation stage has reached a layer-end travel point for the preform stack;at the time the translation stage is at the layer-end travel point, send a cut command to cause the cutter to apply a cutting action to the film;optionally, determine a layer-begin point for translation stage; andoptionally, after execution of the cut command, send a motion command to cause the translation stage to move to the layer-begin point. 9. The device of claim 8 wherein the cutter includes an edge cutter, a laser cutter, or a heater. 10. The device of claim 1 further comprising a dust-resistant shield disposed around the preform assembly platform and the extrusion output. 11. The device of claim 1 further comprising an enclosure around the preform assembly platform and the extrusion output, where: the enclosure is dust-resistant and/or moisture resistant;the enclosure includes a heater communicatively coupled to the controller circuitry, the controller circuitry configured to send enclosure commands to cause the heater to hold the enclosure temperature at a layer-adhesion temperature for the preform stack;the enclosure includes a vacuum-sealed-enclosure held at least at low vacuum. 12. The device of claim 1 wherein the extrusion output is between 10 microns and 1,000 microns thick. 13. The device of claim 1 wherein the preform stack includes an optical filter preform stack. 14. The device of claim 1 wherein the extrusion die includes an extrusion die for polymer materials, glass materials, or both. 15. A device comprising: a sheet reservoir;a preform assembly platform;an assembly robotic arm including a sheet grip disposed on the distal end of the robotic arm;a press including a heated press-plate; anda conveyor;controller circuitry communicatively coupled to the robotic arm, the conveyor and the press, the controller circuitry configured to: send pick-and-place commands to the robotic arm to select sheets from the sheet reservoir and build a vertical stack of sheets on the preform assembly platform;after the sending the pick-and-place commands, send conveyance commands to the conveyor to translate the preform assembly to the preform assembly platform to the press; andafter the sending the conveyance commands, send press commands to the press to apply heat and pressure to the vertical stack of sheets. 16. The device of claim 15, where the sheet reservoir includes: multiple bins with each with a different type of sheet, where optionally the bins are ordered in an array;a bin with sheets stacked in a stacking order;a conveyor belt loaded with sheets in a stacking order;a carousel with multiple carriages of sheets; andmultiple tracks each with a different type of sheet. 17-27. (canceled) 28. A method comprising: extruding a film through an extrusion die to an extrusion output;coordinated with the extrusion, translating a preform assembly platform relative to the extrusion output, such that the film falls onto a preform stack on the preform assembly platform, the film forming current layer of the preform stack on top of a previous layer of the preform stack, the previous layer also extruded through the extrusion die. 29. The method of claim 28, further comprising feeding the extrusion die via multiple extrusion inputs, and feeding the extrusion die includes feeding the extrusion die through up to 12 inputs. 30. The method of claim 29 wherein feeding the extrusion die includes feeding the extrusion die via channels that force materials from the multiple extrusion inputs into a single stream for the extrusion output to produce a multi-sublayer film at the extrusion output. 31-34. (canceled) 35. The method of claim 28 further comprises cutting the current layer after covering the previous layer; determining that the previous layer has been covered responsive to the preform assembly platform reaching a layer-end travel point;at the time the translation stage is at the layer-end travel point, causing a cutter to perform the cutting;determining a layer-begin point for the preform assembly platform; andafter the cutting, causing the preform assembly platform to move to the layer-begin point. 36-44. (canceled)