이 특허를 인용한 특허 (41)

1. Lindsay Deborah J. (Princeton NJ) Feldstein Nathan (Princeton NJ), Activators for colloidal catalysts in electroless plating processes.

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2. Yamamoto, Hisamitsu; Ishida, Tetsuji, Catalyst application solution, electroless plating method using same, and direct plating method.

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3. Gulla Michael (Sherborn MA) Dutkewych Oleh B. (Harvard MA) Bladon John J. (Wayland MA), Catalytic metal of reduced particle size.

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4. Gulla Michael (Sherborn MA) Dutkewych Oleh B. (Harvard MA) Bladon John J. (Wayland MA), Catalytic metal of reduced particle size.

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5. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Catalytic promoters in electroless plating catalysts added prior to a colloidal nucleation process.

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6. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Catalytic promoters in electroless plating catalysts applied as an emulsion.

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7. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Catalytic promoters in electroless plating catalysts in true solutions.

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8. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Colloidal compositions for electroless deposition.

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9. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product.

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10. Feldstein Nathan (63 Hemlock Cir. Princeton ; NJ 08540), Colloidal dispersions for activating non-conductors prior to electroless plating.

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11. Barker Martyn C. (Henley-on-Thames GB2) Rowlands Edward G. (Reading GB2), Compositions comprising inorganic particles.

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12. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Dispersions for activating non-conductors for electroless plating.

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13. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Dispersions for activating non-conductors for electroless plating.

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14. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Dispersions for activating non-conductors for electroless plating.

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15. Feldstein Nathan (63 Hemlock Circle Princeton NJ 08540), Dispersions for activating non-conductors for electroless plating.

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16. Kolics, Artur; Ivanov, Igor, Electroless deposition chemical system limiting strongly adsorbed species.

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17. Feldstein ; Nathan, Electroless metal deposition and article.

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18. Feldstein Nathan (Kendall Park NJ), Electroless plating.

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19. Feldstein Nathan (Princeton NJ), Electrolessly metallized product of non-catalytic metal or alloy.

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20. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Electrolessly metallized silver coated article.

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21. Hsieh,Han Kun; Wang,Shing Ru; Tung,I Chung, Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints.

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22. Ohta, Tetsuji; Kitamura, Keiko; Watanabe, Mitsuhiro, Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method.

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23. Thomann Thomas G. (Trenton NJ), Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating.

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24. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Method for rendering a non-platable semiconductor substrate platable.

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25. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Method for rendering non-platable semiconductor substrates platable.

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26. Feldstein Nathan (Princeton NJ), Method for rendering non-platable substrates platable.

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27. Feldstein Nathan (Princeton NJ), Method for rendering non-platable surfaces platable.

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28. Mevellec, Vincent, Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method.

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29. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Method of applying dispersions for activating non-conductors for electroless plating and article.

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30. Emerson, John A.; Townsend, Wesley P., Method of forming a tin-cuprous colloidal wetting sensitizer.

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31. Brasch William R. (Nesconset NY), Method of making copper colloid for activating insulating surfaces.

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32. Feldstein ; Nathan, Method of preparation and use of electroless plating catalysts.

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33. Feldstein Nathan (P.O. Box 2027 Princeton NJ 08540), Method of preparation and use of novel electroless plating catalysts.

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34. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Non-noble metal colloidal compositions comprising reaction products for electroless deposition.

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35. Feldstein Nathan (Princeton NJ), Non-precious metal colloidal dispersions for electroless metal deposition.

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36. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Post colloid addition of catalytic promoters to non noble metal principal catalytic compounds in electroless plating cat.

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37. Brasch William R. (Nesconset NY) Favini Carlo (Milan ITX), Preparation of printed circuit boards by selective metallization.

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38. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Pretreatment with complexing agent in process for electroless plating.

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39. Boecker Juergen,DEX ; Butz Michael,DEX ; Frey Alfred,DEX ; Hofmeister Petra,DEX ; Schmidt Hans Dieter,DEX, Process for providing catalytically active platinum metal layers.

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40. Boecker Juergen (Stuttgart DEX) Butz Michael (Jettingen DEX) Frey Alfred (Jettingen DEX) Hofmeister Petra (Rottenburg DEX) Schmidt Hans D. (Ammerbuch DEX), Solution for providing catalytically active platinum metal layers.

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41. DuRose Arthur H. (Pinellas Park FL), Two-step preplate system for polymeric surfaces.

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