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Hermetic seals for insulating-casing structures 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/06
출원번호 US-0478141 (1974-06-10)
발명자 / 주소
  • Frink Russell E. (Forest Hills PA)
출원인 / 주소
  • Westinghouse Electric Corporation (Pittsburgh PA 02)
인용정보 피인용 횟수 : 54  인용 특허 : 0

초록

Improved hermetic seals for casing structures, particularly applicable for insulating-casing structures utilized in connection with gas-type piston-flow circuit-interrupters, are provided including end metallic closure-plate members, which are hermetically sealed in a gas-tight manner to the ends of

대표청구항

In combination, a porcelain casing having a sand band on the inner surface thereof adjacent one end thereof, said porcelain casing additionally having a platinum band on the outer surface thereof adjacent the end thereof, a metallic adapter-ring cemented internally of said hollow porcelain casing to

이 특허를 인용한 특허 (54)

  1. Kowalik ; Peter M. ; Milianowicz ; Stanislaw A., Circuit breaker apparatus with static pressure lock.
  2. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo ; Thomsen Scott V., Coated article including a DLC inclusive layer(s) and a layer(s) deposited using siloxane gas, and corresponding method.
  3. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps.
  4. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby.
  5. Jan, Jong Rong; Lu, Tsai Hua; Chiu, Sao Ling; Kung, Ling Chen, Electronic devices including offset conductive bumps.
  6. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers.
  7. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive shunt layers.
  8. Kellam Mark D. ; Berry Michele J., Encapsulated micro-relay modules and methods of fabricating same.
  9. Keiichi Tsuzura JP; Kazuhiko Takahashi JP; Junzo Kida JP; Minoru Yabuki JP, Gas insulated switchgear with flange-spacer assembly.
  10. Tsuzura Keiichi,JPX ; Takahashi Kazuhiko,JPX ; Kida Junzo,JPX ; Yabuki Minoru,JPX, Gas insulated switchgear with flange-spacer assembly.
  11. Bestel E. Fred ; Stoving Paul Newcomb, Grading ring insert assembly.
  12. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
  13. Veerasamy Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
  14. Veerasamy, Vijayen S., Highly tetrahedral amorphous carbon coating on glass.
  15. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo ; Thomsen Scott V., Hydrophobic coating including DLC and/or FAS on substrate.
  16. Vijayen S. Veerasamy, Hydrophobic coating including DLC on substrate.
  17. Veerasamy Vijayen S. ; Petrmichl Rudolph Hugo, Hydrophobic coating with DLC & FAS on substrate.
  18. Rinne Glenn A. ; Mis Joseph Daniel, Key-shaped solder bumps and under bump metallurgy.
  19. Rinne,Glenn A.; Nair,Krishna K., Low temperature methods of bonding components and related structures.
  20. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Low-E coating system including protective DLC.
  21. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl, Method of depositing DLC inclusive coating on substrate.
  22. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Method of deposition DLC inclusive layer(s) using hydrocarbon and/or siloxane gas(es).
  23. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo, Method of ion beam milling a glass substrate prior to depositing a coating system thereon, and corresponding system for carrying out the same.
  24. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl, Method of ion beam milling substrate prior to depositing diamond like carbon layer thereon.
  25. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo, Method of making a coated article including DLC and FAS.
  26. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo; Thomsen, Scott V., Method of making coated article including DLC inclusive layer over low-E coating.
  27. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Method of making coated article including diamond-like carbon (DLC) and FAS.
  28. Veerasamy, Vijayen S., Method of making coated article including layer(s) of diamond-like carbon which may be hydrophobic.
  29. Veerasamy, Vijayen S., Method of making coating article including carbon coating on glass.
  30. Veerasamy,Vijayen S., Method of making heat treatable coated article with diamond-like carbon (DLC) inclusive layer.
  31. Veerasamy, Vijayen S., Method of making heat treatable coated article with protective layer.
  32. Glenn A. Rinne ; Joseph Daniel Mis, Methods for forming integrated redistribution routing conductors and solder bumps.
  33. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Methods of forming electronic structures including conductive shunt layers and related structures.
  34. Nair,Krishna K.; Rinne,Glenn A.; Batchelor,William E., Methods of forming electronic structures including conductive shunt layers and related structures.
  35. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Methods of forming lead free solder bumps.
  36. Rinne, Glenn A., Methods of forming metal layers using multi-layer lift-off patterns.
  37. Mis,J. Daniel, Methods of forming solder bumps on exposed metal pads.
  38. Rinne,Glenn A., Methods of providing solder structures for out plane connections.
  39. Jan,Jong Rong; Lu,Tsai Hua; Chiu,Sao Ling; Kung,Ling Chen, Methods of selectively bumping integrated circuit substrates and related structures.
  40. Batchelor, William E.; Rinne, Glenn A., Non-Circular via holes for bumping pads and related structures.
  41. Rinne,Glenn A., Optical structures including liquid bumps and related methods.
  42. Vijayen S. Veerasamy, Peripheral seal for vacuum IG window unit.
  43. Krausse ; III George J. (Fort Collins CO), Semiconductor packaging with ground plane conductor arrangement.
  44. Veerasamy, Vijayen S.; Petrmichl, Rudolph Hugo; Thomsen, Scott V., Solar management coating system including protective DLC.
  45. Vijayen S. Veerasamy ; Rudolph Hugo Petrmichl ; Scott V. Thomsen, Solar management coating system including protective DLC.
  46. Rinne, Glenn A., Solder structures for out of plane connections.
  47. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Solder structures including barrier layers with nickel and/or copper.
  48. Veerasamy, Vijayen S., Techniques for low temperature direct graphene growth on glass.
  49. Wang, Yei-Ping (Mimi) H.; Thomsen, Scott V., Vacuum IG window unit with edge seal at least partially diffused at temper and completed via microwave curing, and corresponding method of making the same.
  50. Wang, Yei-Ping H.; Longobardo, Anthony V., Vacuum IG window unit with edge seal at least partially diffused at temper and completed via microwave curing, and corresponding method of making the same.
  51. Aggas, Steven L., Vacuum IG window unit with peripheral seal at least partially diffused at temper.
  52. Steven L. Aggas, Vacuum IG window unit with peripheral seal at least partially diffused at temper.
  53. Veerasamy, Vijayen S.; Bracamonte, Martin D., Vacuum insulating glass (VIG) unit with metallic peripheral edge seal and/or methods of making the same.
  54. Veerasamy, Vijayen S.; Tucker, Patricia; Bracamonte, Martin D., Vacuum insulating glass (VIG) unit with metallic peripheral edge seal and/or methods of making the same.
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