이 특허를 인용한 특허 (117)

1. Zarotti Claudio (Via Marco Polo ; 7 20124 Milano ITX), Actuator for producing a displacement movement on a set temperature being reached.

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2. Lamont ; Jr. Lawrence T. (Mountain View CA), Apparatus for thermal treatment of a wafer in an evacuated environment.

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3. Harra David J. (Santa Cruz CA), Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet.

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4. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Apparatus including processor.

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5. Sendker, Nikolai; Holtz, Sebastian, Barrier layer arrangement for tank systems.

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6. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.

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7. Rogers,James H.; Hoffman,Brian, Capacitance sensing for substrate cooling.

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8. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.

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9. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.

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10. Tsuji Mutsuo (Tokyo JPX), Chip carrier.

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11. DasGupta Sumit (Wappingers Falls NY) Graf Matthew C. (Highland NY) Rasmussen Robert A. (LaGrangeville NY) Williams Thomas W. (Boulder CO), Chip partitioning aid (CPA)-A structure for test pattern generation for large logic networks.

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12. McMahon Maurice T. (Poughkeepsie NY), Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packagi.

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13. Chrysler Gregory (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a pist.

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14. Langenwalter Michael (Stockdorf/Gauting DEX) Moehrmann Karl H. (Munich DEX) Prussas Herbert (Reichertshausen DEX) Spaeter Lothar (Annweiler am Trifels DEX), Common housing for two semi-conductor bodies.

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15. Chu Richard C. (Poughkeepsie NY) Hwang Un-pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Conduction cooled module.

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16. Ito Eizi (Komaki JPX), Control apparatus with improved structure for cooling circuit elements.

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17. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps.

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18. Glenn A. Rinne ; Paul A. Magill, Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby.

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19. Hagihara Takashi (Tokyo JPX) Kuramitsu Yuzi (Tokyo JPX), Cooling equipment for an integrated circuit chip.

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20. Feierbach,Gary F., Cooling method for ICS.

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21. Iversen Arthur H. (Saratoga CA), Cooling of large high power semi-conductors.

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22. Iversen Arthur H. (Saratoga CA), Cooling of large semi-conductor devices.

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23. Sano Toshifumi (Tokyo JPX), Cooling structure.

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24. Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX), Cooling structure for heat generating electronic components mounted on a substrate.

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25. Wessely Herrmann (Munich DEX), Cooling subrack for logic cards.

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26. Umezawa, Kazuhiko, Cooling system for IC package.

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27. Agee Keith D. (Torrance CA) Faulkner Fredrik E. (Rolling Hills Estates CA), Cooling system for a sealed enclosure.

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28. Kikuchi Shunichi (Yokohama JPX) Matsunaga Haruyuki (Atsugi JPX) Katsumi Hideo (Sagamihara JPX) Katsuyama Koji (Yokohama JPX), Cooling system for electronic circuit components.

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29. Mine Shinji (Tokyo JPX), Cooling system for three-dimensional IC package.

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30. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.

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31. Umezawa Kazuhiko (Tokyo JPX), Cooling unit.

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32. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.

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33. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert V.; Kerkar, Pramod; Boldarev, Sergey T., Cryotherapy probe.

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34. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert V.; Kerkar,Pramod; Boldarev,Sergey T., Cryotherapy probe.

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35. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Cryotherapy system.

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36. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarov,Sergei, Cryotherapy system.

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37. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.

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38. Wessely Herrmann (Munich DEX), Device for cooling a plurality of integrated modules combined on a flexible printed circuitboard to form logic cards.

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39. Wessely Herrmann (Munich DEX), Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards.

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40. Hsia Liang-Choo (Mastic Beach NY) McAndrew Thomas P. (Macungie PA) Stuebner Fred E. (La Grangeville NY), Elastomeric connectors for electronic packaging and testing.

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41. Jan, Jong Rong; Lu, Tsai Hua; Chiu, Sao Ling; Kung, Ling Chen, Electronic devices including offset conductive bumps.

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42. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers.

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43. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive shunt layers.

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44. Kellam Mark D. ; Berry Michele J., Encapsulated micro-relay modules and methods of fabricating same.

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45. Berg William C. (Stillwater MN), Finned heat exchangers for electronic chips and cooling assembly.

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46. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.

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47. Canney, Brian A.; Karrat, Wally; Lehman, Bret W.; Molloy, Christopher L., Free cooling solution for a containerized data center.

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48. Meeker Robert G. (La Grangeville NY) Scanlon William J. (Hopewell Junction NY) Segal Zvi (Wappingers Falls NY), Gas encapsulated cooling module.

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49. Novak ; Petr ; Pellant ; Michal ; Reichel ; Pavel, Heat sink mechanism hydraulically propelled into contact with semiconductor devices.

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50. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Yakubowski Carl (Hyde Park NY), High conduction flexible fin cooling module.

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51. Watari Toshihiko (Tokyo JPX) Umeta Junzo (Tokyo JPX), High density LSI package for logic circuits.

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52. Morrison Robert A. (Long Beach CA), Hydraulic thermal clamp for electronic modules.

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53. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Information processing device.

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54. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.

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55. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.

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56. King Monroe L. (Austin TX), Ion treatment apparatus.

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57. Rinne Glenn A. ; Mis Joseph Daniel, Key-shaped solder bumps and under bump metallurgy.

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58. Mansuria Mohanlal S. (Wappingers Falls NY) Ostergren Carl D. (Montgomery NY), Leaved thermal cooling module.

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59. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.

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60. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.

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61. Kessler Claus (Berg DEX), Logic card.

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62. Rinne,Glenn A.; Nair,Krishna K., Low temperature methods of bonding components and related structures.

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63. Butt Sheldon H. (Godfrey IL) Mahulikar Deepak (Meriden CT), Metal packages having improved thermal dissipation.

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64. Di Giacomo Giulio ; Drofitz ; Jr. Stephen S. ; Edwards David L. ; Iruvanti Sushumna ; Womac David J., Method for bonding heatsink to multiple-height chip.

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65. King Monroe L. (Austin TX), Method for conducting heat to or from an article being treated under vacuum.

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66. Koopman Nicholas George (Hopewell Junction NY), Method for making conduction-cooled circuit package.

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67. Natsuo Arai JP; Kaoru Katayama JP; Eiichi Kiryuu JP, Method for sealing liquid coolant into module.

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68. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.

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69. Carpenter Charles (Poughkeepsie NY) Fugardi Joseph F. (Wappingers Falls NY) Gregor Lawrence V. (Hopewell Junction NY) Grosewald Peter S. (Putnam Valley NY) Reeber Morton D. (Shrub Oak NY), Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a s.

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70. Koopman Nicholas George (Hopewell Junction NY) Totta Paul Anthony (Poughkeepsie NY), Method of making conduction-cooled circuit package.

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71. Hagihara Takashi (Tokyo JPX) Kuramitsu Yuzi (Tokyo JPX), Method of producing a cooled electronic assembly.

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72. Lamont ; Jr. Lawrence T. (Mountain View CA), Method of thermal treatment of a wafer in an evacuated environment.

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73. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.

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74. Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert; Boldarev, Sergey, Methods and systems for cryogenic cooling.

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75. Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Methods and systems for cryogenic cooling.

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76. Glenn A. Rinne ; Joseph Daniel Mis, Methods for forming integrated redistribution routing conductors and solder bumps.

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77. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Methods of forming electronic structures including conductive shunt layers and related structures.

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78. Nair,Krishna K.; Rinne,Glenn A.; Batchelor,William E., Methods of forming electronic structures including conductive shunt layers and related structures.

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79. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Methods of forming lead free solder bumps.

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80. Rinne, Glenn A., Methods of forming metal layers using multi-layer lift-off patterns.

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81. Mis,J. Daniel, Methods of forming solder bumps on exposed metal pads.

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82. Rinne,Glenn A., Methods of providing solder structures for out plane connections.

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83. Jan,Jong Rong; Lu,Tsai Hua; Chiu,Sao Ling; Kung,Ling Chen, Methods of selectively bumping integrated circuit substrates and related structures.

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84. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.

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85. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.

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86. Nam Sang Sig,KRX ; Kwak Ho Young,KRX ; Kim Jae Hee,KRX, Multi chip module cooling apparatus.

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87. Gupta Omkarnath R. (Boca Raton FL), Multi-stud thermal conduction module.

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88. Batchelor, William E.; Rinne, Glenn A., Non-Circular via holes for bumping pads and related structures.

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89. Rinne,Glenn A., Optical structures including liquid bumps and related methods.

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90. Feinberg Irving (Poughkeepsie NY) Langdon Jack L. (Poughkeepsie NY), Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices.

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91. Wilkins, Wendy L.; Gilbert, Barry K.; Kline, Bruce R., Packaging for high power integrated circuits.

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92. Viswanath Ram S. ; Martin Philip R., Pickup chuck with an integral heatsink.

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93. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Printer apparatus.

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94. Druschel William O. (Granite Springs NY) Kostenko Alexander (Hopewell Junction NY) Meinert Rolf G. (Wappingers Falls NY), Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure.

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95. Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Processing device.

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96. Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Processor apparatus.

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97. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.

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98. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.

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99. Naganuma Yoshio (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Ouchi Katsunori (Hitachi JPX) Sato Koji (Hitachi JPX) Yokoyama Hiroshi (Hitachi JPX), Semiconductor cooling module.

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100. Crane Jacob (Woodbridge CT) Johnson Barry C. (Tucson AZ) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Semiconductor package.

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101. Rinne, Glenn A., Solder structures for out of plane connections.

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102. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Solder structures including barrier layers with nickel and/or copper.

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103. Umezawa Kazuhiko (Tokyo JPX), Structure for temperature detection in a package.

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104. Lakios Emmanuel N. (Port Jefferson Station NY) McGraw Michael F. (East Setauket NY), Substrate transport and cooling apparatus and method for same.

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105. Wilkins, Wendy L.; Gilbert, Barry K., System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes a reversible chemical reaction to move heat from the associated electronic device.

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106. Sharon Andre (Arlington MA), Telescoping thermal conduction element for cooling semiconductor devices.

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107. Antonetti Vincent W. (Poughkeepsie NY) Gupta Omkarath R. (Poughkeepsie NY), Temperature equalizing element for a conduction cooling module.

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108. Nakajima Tadakatsu (Ibaraki JPX) Nakayama Wataru (Kashiwa JPX) Oohashi Shigeo (Ibaraki JPX) Kuwabara Heikichi (Ibaraki JPX) Daikoku Takahiro (Usiku JPX), Thermal conduction device.

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109. Ostergren Carl D. (Montgomery NY) Paivanas ; deceased John A. (late of Williamsville NY by Sophia Paivanas ; executor), Thermal conduction disc-chip cooling enhancement means.

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110. Chu Richard C. (Poughkeepsie NY), Thermal conduction module.

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111. Meagher Ralph E. (Vicksburg MI) Ostergren Carl D. (Montgomery NY), Thermal conduction piston for semiconductor packages.

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112. Kolman Frank ; Brownell Michael, Thermal grease insertion and retention.

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113. Simons Robert E. (Poughkeepsie NY), Thermal interface adapter for a conduction cooling module.

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114. Risca Mihai S., Thermal interface member.

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115. David L. Edwards ; Glenn G. Daves ; Shaji Farooq ; Sushumna Iruvanti ; Frank L. Pompeo, Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.

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116. Edwards David L. ; Daves Glenn G. ; Farooq Shaji ; Iruvanti Sushumna ; Pompeo Frank L., Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof.

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117. Ross,Daniel T.; Gooch,Donn D.; Chang,Simon, Thermal transfer device.

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