이 특허를 인용한 특허 (40)

1. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor, Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper.

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2. Narcus Harold (15 Vesper St. Worcester MA 01602), Bright electroless plating process and plated articles produced thereby.

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3. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

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4. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

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5. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

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6. Reid, Jonathan D.; Webb, Eric G.; Minshall, Edmund B.; Kepten, Avishai; Stowell, R. Marshall; Mayer, Steven T., Capping before barrier-removal IC fabrication method.

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7. Rice James H. (Sylmar CA), Circuit board material and electroplating bath for the production thereof.

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8. McComas C. Edward, Coating compositions containing nickel and boron.

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9. Nakatsugawa Hiroshi (Yokohama JPX), Copper foil for a printed circuit and a method for the production thereof.

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10. Kolics, Artur; Ivanov, Igor, Electroless deposition chemical system limiting strongly adsorbed species.

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11. Park, Heung L.; Webb, Eric G.; Reid, Jonathan D.; Cleary, Timothy Patrick, Electroless layer plating process and apparatus.

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12. Feldstein Nathan (Princeton NJ), Electrolessly metallized product of non-catalytic metal or alloy.

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13. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Electrolessly metallized silver coated article.

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14. Mallory ; Jr. Glenn O. (Los Angeles CA), Electrolessly plated product having a polymetallic catalytic film underlayer.

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15. Hodgens ; II Henry M. (Jupiter FL), Ethylenethiourea wear resistant electroless nickel-boron coating compositions.

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16. Koos, Daniel A.; Mayer, Steven T.; Park, Heung L.; Cleary, Timothy Patrick; Mountsier, Thomas, Fabrication of semiconductor interconnect structure.

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17. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.

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18. Mayer, Steven T.; Koos, Daniel A.; Webb, Eric, Fabrication of semiconductor interconnect structure.

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19. Fakler John ; Rush Michael ; Campbell Scott, Method and composition for amine borane reduction of copper oxide to metallic copper.

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20. Kolics, Artur; Petrov, Nicolai; Ting, Chiu; Ivanov, Igor C., Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation.

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21. Koos,Daniel A.; Mayer,Steven T.; Park,Heung L.; Cleary,Timothy Patrick; Mountsier,Thomas, Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltage.

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22. Satoh Hiroshi (Hyogo JPX) Utsui Yoshihiko (Hyogo JPX) Kitazaki Kuraki (Hyogo JPX) Taniguchi Takashi (Hyogo JPX) Hayashi Kiyoshi (Hyogo JPX), Method for manufacturing a strain detector.

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23. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Method for rendering a non-platable semiconductor substrate platable.

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24. Feldstein Nathan (63 Hemlock Cir. Princeton NJ 08540), Method for rendering non-platable semiconductor substrates platable.

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25. Feldstein Nathan (Princeton NJ), Method for rendering non-platable substrates platable.

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26. Feldstein Nathan (Princeton NJ), Method for rendering non-platable surfaces platable.

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27. Brasch William (Commack NY), Method of improving the adhesion of electroless metal deposits employing colloidal copper activator.

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28. Ishibashi, Yusuke; Konno, Yuya; Watanabe, Yujiro; Yasui, Toyoaki; Tanaka, Kazunari; Kawahara, Kosei; Fuchigami, Yohei; Nishina, Toshio, Method of manufacturing rotary machine, method of plating rotary machine, and rotary machine.

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29. Ehrbar Jean-Paul (La Chaux-de-Fonds CHX) Ganguillet Claude (Neuchatel CHX), Method of preparation of a substrate made of plastic material for its subsequent metallization.

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30. Mallory ; Jr. Glenn O. (Los Angeles CA), Method of preparing substrate surface for electroless plating and products produced thereby.

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31. Mayer, Steven T.; Porter, David W., Modulated metal removal using localized wet etching.

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32. Acosta Raul E. (White Plains NY) Horkans Wilma J. (Ossining NY) Mukherjee Ruby (San Jose CA) Olsen Judith D. (Goldens Bridge NY), Prevention of mechanical and electronic failures in heat-treated structures.

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33. Braun Camille (Saint Nizier du Moucherotte FRX) Danroc Jol (Grenoble FRX) Francois Bernard (Montbonnot FRX) Michel Jean (Biviers FRX), Process for treating a metal oxide powder.

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34. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.

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35. Mayer, Steven T.; Porter, David W., Reduced isotropic etchant material consumption and waste generation.

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36. Mayer, Steven T.; Rea, Mark L.; Hill, Richard S.; Kepten, Avishai; Stowell, R. Marshall; Webb, Eric G., Topography reduction and control by selective accelerator removal.

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37. Frick John P. (Dallas TX), Use of electroless nickel coating to prevent galling of threaded tubular joints.

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38. Mayer, Steven T.; Webb, Eric G.; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

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39. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

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40. Mayer, Steven T.; Webb, Eric; Porter, David W., Wet etching methods for copper removal and planarization in semiconductor processing.

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