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A heat resistant heat-curable polymer composition obtained by reacting, between 50°C. and 350°C., (a) an oligomer having the average general formula: [Figure] in which x represents a number from 0.1 to about 2, R represents a divalent hydrocarbon radical with 1 to 8 carbon atoms, which is derived fr

A heat resistant heat-curable polymer composition obtained by reacting, between 50°C. and 350°C., (a) an oligomer having the average general formula: [Figure] in which x represents a number from 0.1 to about 2, R represents a divalent hydrocarbon radical with 1 to 8 carbon atoms, which is derived from an aldehyde or a ketone of the general formula: O=R in which the oxygen atom is bonded to a carbon atom of the radical R, and D represents a divalent organic radical possessing 2 to 24 carbon atoms, the free valencies of which are on adjacent carbon atoms and which is derived from an internal anhydride of the general formula: [Figure] at least 60% of the D radicals in the oligomer containing a polymerizable carbon-carbon double-bond, with (b) a polyamine of the general formula: Q(NH2)y IN WHICH Y REPRESENTS AN INTEGER AT LEAST EQUAL TO 2 AND Q represents an organic radical of valency y, the relative amounts being such that the oligomer supplies 1.1 to 50 D radicals containing a polymerizable carbon-carbon double bond per －NH2 group supplied by the polyamine is provided. The properties of the composition can be improved by incorporating therein, during the preparation, an aromatic compound possessing 2 to 4 benzene rings, which does not sublime at atmospheric pressure up to 250°C, and which has a boiling point above 250°C. and/or an aromatic tri- or tetra-carboxylic acid anhydride and/or an unsaturated polyester and/or a monomer containing at least one polymerizable CH2=C< group. Prepolymers of the oligomer and polyamine can also be used for curing epoxy resins.

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A process for curing a 1,2-epoxy resin which comprises mixing the epoxy resin with a curing amount of a prepolymer composition, said composition being prepared by heating (a) an oligomer having the average general formula: [Figure] (I) in which x represents a number from 0.1 to about 2, R represents

A process for curing a 1,2-epoxy resin which comprises mixing the epoxy resin with a curing amount of a prepolymer composition, said composition being prepared by heating (a) an oligomer having the average general formula: [Figure] (I) in which x represents a number from 0.1 to about 2, R represents a divalent hydrocarbon radical with 1 to 8 carbon atoms, which is derived from an aldehyde or a ketone of the general formula: O =R (II) in which the oxygen atom is bonded to a carbon atom of the radical R, and T represents a divalent organic radical possessing 2 to 24 carbon atoms, the free valencies of which are on adjacent carbon atoms and which is derived from an internal anhydride of the general formula: [Figure] (III) at least 60% of the T radicals in the oligomer containing a polymerisable carbon-carbon double bond, the remaining T radicals, if any, being alkylene, cycloalkylene, phenylene or naphthylene radicals with (b) a polyamine of the general formula: Q(NH2)y in which y represents an integer at least equal to 2 and Q represents: a divalent organic radical E selected from the group consisting of a linear or branched alkylene radical with less than 13 carbon atoms, a phenylene radical, a cyclohexylene radical, a phenylene radical substituted by a methyl radical, a cyclohexylene radical substituted by a methyl radical, radicals of the formulae: [Figure] wherein n represents an integer from 1 to 3, a radical consisting of a plurality of phenylene, cyclohexylene, phenylene substituted by methyl or cyclohexylene substituted by methyl, radicals connected to one another by a simple valency bond or by －O－or －S－, an alkylene group with 1 to 3 carbon atoms, －CO－, －SO2－, －CONH－, －COO－, －P(O)R1－, －CONH－X－NHCO－, [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] wherein R1 represents a hydrogen atom, an alkyl radical with 1 to 4 carbon atoms, a phenyl radical or a cyclohexyl radical, and X represents an alkylene radical with less than 13 carbon atoms, and a 2- to 4-valent radical of the formula: [Figure] in which x represents a number from 0.1 to 2, the relative amounts being such that the oligomer supplies 1.1 to 50 T radicals containing a polymerisable carbon-carbon double bond per －NH2 group supplied by the polyamine at a temperature from about 80°C. to about 200°C. until a homogeneous liquid or paste-like mixture is obtained, and the mixture of prepolymer and epoxy resin is then cured by subsequent heating at between 150°C. and 300°C.