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Grinding tool 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-007/02
출원번호 US-0643347 (1975-12-22)
발명자 / 주소
  • Kruse James A. (22937 Ostronic Drive Woodland Hills CA 91364)
인용정보 피인용 횟수 : 85  인용 특허 : 0

초록

In a rotary tool adapted for grinding under a flowing liquid film, wherein the particles of abrasive are metal-bonded to a rigid supporting surface, the improvement consists of a network in the supporting surface of grooves having constant depth and constant width and traversing said supporting surf

대표청구항

A rotary grinding disk adapted for grinding under a flowing liquid film having a flat top supporting surface to which particles of abrasive are rigidly bonded and a network of grooves of constant depth and width traversing said supporting surface to provide a continuum of centrifugal drainage channe

이 특허를 인용한 특허 (85)

  1. Breder, Kristin; Czerepinski, Jennifer H.; Fremy, Flavien; Louapre, David; Marlin, Samuel S.; Boussant-Roux, Yves; Iyengar, Sujatha, Abrasive article including shaped abrasive particles.
  2. Breder, Kristin; Iyengar, Sujatha; Arcona, Christopher; Gaeta, Anthony C., Abrasive article including shaped abrasive particles.
  3. Iyengar, Sujatha, Abrasive article including shaped abrasive particles.
  4. Wang, Guan; Pujari, Vimal K.; Boussant-Roux, Yves, Abrasive articles including abrasive particles of silicon nitride.
  5. Wang, Guan; Pujari, Vimal K.; Boussant-Roux, Yves, Abrasive articles including abrasive particles of silicon nitride.
  6. Panzarella, Tracy H.; Yener, Doruk O., Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming.
  7. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D.; Brandes, Alan J.; Arcona, Christopher; Bauer, Ralph; Boussant-Roux, Yves; Panzarella, Tracy H., Abrasive particles having complex shapes and methods of forming same.
  8. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D.; Brandes, Alan J.; Arcona, Christopher; Bauer, Ralph; Boussant-Roux, Yves; Panzarella, Tracy H., Abrasive particles having complex shapes and methods of forming same.
  9. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D.; Brandes, Alan J.; Arcona, Christopher; Bauer, Ralph; Boussant-Roux, Yves; Panzarella, Tracy H., Abrasive particles having complex shapes and methods of forming same.
  10. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D.; Brandes, Alan J.; Arcona, Christopher; Bauer, Ralph; Boussant-Roux, Yves; Panzarella, Tracy H., Abrasive particles having complex shapes and methods of forming same.
  11. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D.; Brandes, Alan J.; Arcona, Christopher; Bauer, Ralph; Boussant-Roux, Yves; Panzarella, Tracy H., Abrasive particles having complex shapes and methods of forming same.
  12. Gaeta, Anthony C.; Seth, Anuj; Arcona, Christopher; Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Csillag, Frank J.; Rice, William C.; Ramesh, Satyalakshmi K.; Lafond, Gregory; Wijesooriya, Sidath S.; Lior, Adam D.; Brandes, Alan J.; Parmar, Anil; Braun, Paul; Everts, Darrel K., Abrasive particles having particular shapes and methods of forming such particles.
  13. Kavanaugh, Michael D.; Yener, Doruk O.; Czerepinski, Jennifer H., Abrasive particles having particular shapes and methods of forming such particles.
  14. Kavanaugh, Michael D.; Yener, Doruk O.; Czerepinski, Jennifer H., Abrasive particles having particular shapes and methods of forming such particles.
  15. Seth, Anuj; Everts, Darrell K.; Raman, Vivek Cheruvari Kottieth, Abrasive particles having particular shapes and methods of forming such particles.
  16. Seth, Anuj; Everts, Darrell K.; Raman, Vivek Cheruvari Kottieth, Abrasive particles having particular shapes and methods of forming such particles.
  17. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D., Abrasive particles having particular shapes and methods of forming such particles.
  18. Yener, Doruk O.; Czerepinski, Jennifer H.; Iyengar, Sujatha; Kavanaugh, Michael D., Abrasive particles having particular shapes and methods of forming such particles.
  19. Yener, Doruk O.; Czerepinski, Jennifer H.; Kavanaugh, Michael D.; Marlin, Samuel S.; Breder, Kristin K.; Iyengar, Sujatha, Abrasive particles having particular shapes and methods of forming such particles.
  20. Gaeta, Anthony C.; Seth, Anuj; Herbert, Charles G.; Everts, Darrell K.; Csillag, Frank J.; Labrecque, Julienne; Khatami, Kamran, Abrasive products having fibrillated fibers.
  21. Hagan John, Abrasive tool with knurled surface.
  22. Ramanath Srinivasan ; Kuo Shih Yee ; Williston William H. ; Buljan Sergej-Tomislav, Abrasive tools.
  23. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
  24. Karl M. Robinson ; Michael A. Walker, Belt polishing pad method.
  25. Sung, Chien-Min, CMP pad dressers with hybridized abrasive surface and related methods.
  26. Josseaux, Frederic, Composite shaped abrasive particles and method of forming same.
  27. Yener, Doruk O.; Braun, Paul, Composite shaped abrasive particles and method of forming same.
  28. Zhou, Qunfei; Rao, Qiaobing; Fu, Liang, Disc containing copper for sapphire polishing, and method for preparing discs containing copper facing each other.
  29. Bujnowski, Adam P.; McNeal, Kelley; Pacella, Nan Y.; Rapaka, Srikanth; Rich, Joseph; Sahlin, Katherine M.; Sarangi, Nilanjan; Schoch, Andrew B., Fixed abrasive articles and methods of forming same.
  30. Colet, Celine; Gao, Kuo; Rapaka, Srikanth; Rich, Joseph; Sahlin, Katherine M.; Sarangi, Nilanjan; Schoch, Andrew B., Fixed abrasive articles and methods of forming same.
  31. Meyer, Hans-Robert, For grinding wheel for grinding process.
  32. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  33. Kavanaugh, Michael D., Forming shaped abrasive particles.
  34. Jaskowiak Timothy R. ; Mulroy Grethel K. ; DiGravio Thomas L., Grinding wheel with geometrical pattern.
  35. Jaskowiak Timothy R. ; Mulroy Grethel K. ; DiGravio Thomas L., Grinding wheel with geometrical pattern.
  36. Terada, Yoshiharu, Grinding wheel, a process of manufacturing the grinding wheel and a process of reclaiming the grinding wheel.
  37. Moudry, Raymond Leroy; Ramaswamy, Vishwanath; Hoehn, Joel William; Singh, Albert Enrique, Lapping a workpiece.
  38. Wang, Guan; Boussant-Roux, Yves, Liquid phase sintered silicon carbide abrasive particles.
  39. Wang, Guan; Boussant-Roux, Yves, Liquid phase sintered silicon carbide abrasive particles.
  40. Mahadev,Niraj; Jose,Winston; Dang,Tai, Method and apparatus to produce a GRM lapping plate with fixed diamond using electro-deposition techniques.
  41. Moudry, Raymond Leroy; Baurceanu, Mihaela Ruxandra; Hoehn, Joel William, Method for forming an abrasive lapping plate.
  42. Ramanath Srinivasan ; Kuo Shih Yee ; Williston William H. ; Buljan Sergej-Tomislav, Method for grinding precision components.
  43. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
  44. Moudry, Raymond Leroy; Hoehn, Joel William, Method of patterning a lapping plate, and patterned lapping plates.
  45. Fukao, Takeshi; Nakano, Toshihiro, Method of processing antifriction bearing unit for wheel.
  46. Fukao,Takeshi; Nakano,Toshihiro, Method of processing antifriction bearing unit for wheel.
  47. Fukao,Takeshi; Nakano,Toshihiro, Method of processing antifriction bearing unit for wheel.
  48. Breder, Kristin; Iyengar, Sujatha; Arcona, Christopher, Method of using an abrasive article including shaped abrasive particles.
  49. Sung, Chien-Min, Methods for orienting superabrasive particles on a surface and associated tools.
  50. Deopura, Manish; Vaidya, Hem M.; Roy, Pradip K., Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs.
  51. Deopura, Manish; Vaidya, Hem M.; Roy, Pradip K., Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs.
  52. Griffin, Stephen; Diaz, David; Seitz, Douglas A.; Passeri, Robert; Doyle, Ralph, Modular controlled platen preparation system and method.
  53. Griffin, Stephen; Diaz, David; Seitz, Douglas; Passeri, Robert; Doyle, Ralph R., Modular controlled platen preparation system and method.
  54. Panzarella, Tracy H.; Yener, Doruk O.; Kavanaugh, Michael D.; Brandes, Alan J., Particulate materials and methods of forming same.
  55. Panzarella, Tracy H.; Yener, Doruk O.; Kavanaugh, Michael D.; Brandes, Alan J., Particulate materials and methods of forming same.
  56. Beaucage, Jacey R.; Reiley, Timothy C.; Tzeng, Huey-Ming; Wu, Xiao Z., Pattern-electroplated lapping plates for reduced loads during single slider lapping and process for their fabrication.
  57. Park,Moo yong; Lee,Tae hoon; Koo,Jae eung, Polish pad and chemical mechanical polishing apparatus comprising the same.
  58. Konishi Nobuo,JPX ; Iwashita Mitsuaki,JPX, Polishing apparatus, polishing member.
  59. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
  60. Robinson Karl M. ; Walker Michael A., Polishing pad and system.
  61. Barnett, III, Herb, Polishing pad conditioning method and apparatus.
  62. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
  63. Broido Georges H. G. (Collonges Sous Saleves FRX), Polishing plate.
  64. Kim Myung S. (272 Taft St. Windgap PA 18091), Portable chamfering grinding device.
  65. Itoyama, Kouki; Suzuki, Motofumi, Resin lapping plate and lapping method using the same.
  66. Thomas, Jonathan P.; Beveridge, Keith A.; Olson, Chad James; Osland, David, Scratch removal device and method.
  67. Thomas, Jonathan P.; Beveridge, Keith A.; Olson, Chad James; Osland, David, Scratch removal device and method.
  68. Thomas,Jonathan P.; Beveridge,Keith A.; Olson,Chad James; Osland,David, Scratch removal device and method.
  69. Thomas,Jonathan P.; Beveridge,Keith A.; Olson,Chad James; Osland,David, Scratch removal device and method.
  70. Braun, Paul P.; Yener, Doruk O.; Czerepinski, Jennifer H.; Bauer, Ralph; Subramanian, Krishnamoorthy; Bright, Robin; Seth, Anuj; Lafond, Gregory G., Shaped abrasive particle and method of forming same.
  71. Braun, Paul; Yener, Doruk O.; Czerepinski, Jennifer H.; Bauer, Ralph; Subramanian, Krishnamoorthy; Bright, Robin M.; Seth, Anuj; Lafond, Gregory G., Shaped abrasive particle and method of forming same.
  72. Louapre, David; Salvatore, James A.; Marazano, Alexandra, Shaped abrasive particle fractions and method of forming same.
  73. Yener, Doruk O.; Braun, Paul, Shaped abrasive particle including dopant material and method of forming same.
  74. Josseaux, Frederic; Louapre, David F., Shaped abrasive particles and method of forming same.
  75. Bauer, Ralph; Barnes, Martin; Demers, Rene G.; Skowron, Margaret L., Shaped abrasive particles and methods of forming same.
  76. Bauer, Ralph; Barnes, Martin; Demers, Rene G.; Skowron, Margaret L., Shaped abrasive particles and methods of forming same.
  77. Bauer, Ralph; Barnes, Martin; Demers, Rene G.; Skowron, Margaret L., Shaped abrasive particles and methods of forming same.
  78. Bauer, Ralph; Barnes, Martin; Demers, Rene G.; Skowron, Margaret L., Shaped abrasive particles and methods of forming same.
  79. Stevenson, Adam J.; M'Barki, Amin; Louapre, David; Yener, Doruk O.; Czerepinski, Jennifer H.; Nahas, Nabil, Shaped abrasive particles and methods of forming same.
  80. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  81. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  82. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  83. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  84. Sato Takesi (Ibaraki JPX) Mitsuhashi Kenichi (Ibaraki JPX) Tomita Yoji (Ibaraki JPX) Sasaki Yasuoki (Ibaraki JPX), Surface grinding apparatus.
  85. Holmstrand Allan L. (Bloomington MN), Textured lapping plate and process for its manufacture.
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