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Metal-plated abrasive product and method of manufacturing the product 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/04
출원번호 US-0699591 (1976-06-24)
발명자 / 주소
  • Wiand Richard K. (1773 Washington Birmingham MI 48009)
인용정보 피인용 횟수 : 46  인용 특허 : 0

초록

A new abrasive product using abrasive particles, such as diamond particles, with the abrasive particles being positioned on the products by the use of a special masking technique and with abrasive particles being held in place by deposited metal; and, a new method of manufacturing said product.

대표청구항 ▼

A method of manufacturing an abrasive product comprising, providing a conductive member with a surface thereon for attachment of abrasive particles, maskinG off predetermined desired surface portions on the backing member to thereby leave exposed spaced apart portions on the backing, a significant p

이 특허를 인용한 특허 (46)

  1. Prichard, Paul D.; Moh, Kyung H.; Koskenmaki, David C., Abrasive article with optimally oriented abrasive particles and method of making the same.
    상세보기
  2. Palushaj, Simon; Duda, Jerry, Abrasive pad.
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  3. Wiand Ronald C. (1790 Washington Birmingham MI 48009), Abrasive pads for lens lapping tools.
    상세보기
  4. Palushi,Simon; Goldberg,Howard, Abrasive sanding surface.
    상세보기
  5. deKok Peter T. (74 Peachtree Way Atlanta GA 30305) Tselesin Naum N. (2900 Lookout Pl. Atlanta GA 30305), Abrasive tool and method for making.
    상세보기
  6. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
    상세보기
  7. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
    상세보기
  8. Luedeke,Arthur P., Backup shoe for microfinishing and methods.
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  9. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
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  10. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
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  11. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
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  12. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  13. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  14. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  15. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  16. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  17. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
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  18. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  19. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  20. Liu, Feng Q.; Mavliev, Rashid, Contact assembly and method for electrochemical mechanical processing.
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  21. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan, Contacts for electrochemical processing.
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  22. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
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  24. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh, Edge bead removal by an electro polishing process.
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  25. Takahashi, Tsutomu; Shimomae, Naoki; Hata, Hanako, Electroplated grinding wheel and its production equipment and method.
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  29. Sekiya Shinji (Tokyo JPX), Grinding and/or cutting endless belt.
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  30. Sexton, John S.; Stone, Brian J.; Howes, Trevor D.; Andrew, Colin, Grinding wheel.
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  31. Park, Il-Yong, Hardened skin care instrument.
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  33. Adefris Negus B. ; Erickson Carl P., Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece.
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  34. Wang, Yan; Neo, Siew; Liu, Feng; Tsai, Stan D.; Hu, Yongqi; Duboust, Alain; Manens, Antoine; Wadensweiler, Ralph M.; Mavliev, Rashid; Chen, Liang-Yuh; Olgado, Donald J. K.; Butterfield, Paul D.; Tseng, Ming-Kuei; Chang, Shou-Sung; Sun, Lizhong, Method and apparatus for electrochemical mechanical processing.
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  37. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical polishing.
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  38. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
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  39. Chang,Shou Sung; Tsai,Stan D; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
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  40. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
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  41. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
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  42. Narcus, Harold, Process for the manufacture of abrasive-coated tools.
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  43. Watson, Stanley A.; Powell, David G., Support structure and method of assembling same.
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  44. Stanley A. Watson ; David G. Powell, Two-sided abrasive tool.
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  45. Powell David G. ; Watson Stanley A., Two-sided abrasive tool and method of assembling same.
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  46. Watson Stanley A. ; Powell David G., Two-sided abrasive tool and method of assembling same.
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