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[미국특허] Conductive elastomer connector and method of making same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-013/24
  • H05K-001/04
출원번호 US-0642686 (1975-12-22)
발명자 / 주소
  • Moore John R. (Santa Ana CA)
출원인 / 주소
  • International Telephone and Telegraph Corporation (New York NY 02)
인용정보 피인용 횟수 : 57  인용 특허 : 0

초록

An electrical connector in which conductive rubber rods are mounted in a nonconductive substrate. The rods extend above and below the upper and lower surfaces, respectively, of the substrate for electrically interconnecting conductive traces on a pair of electronic components, such as a display pane

대표청구항

A conductive elastomer connector comprising: a nonconductive planar substrate having generally parallel upper and lower surfaces; a plurality of etched holes extending through said substrate from said upper surface to said lower surface; a conductive elastomer rod retained in each of said holes, sai

이 특허를 인용한 특허 (57) 인용/피인용 타임라인 분석

  1. Chen, Kong-Chen, Apparatus and method for vertically-structured passive components.
  2. Fey Donald (Vestal NY) Legg John T. (Glen Aubrey NY) Pierson Mark V. (Binghamton NY), Automatic extrusion pinning method and apparatus.
  3. Etzel Stephen J. (Woodstock CT) Gottlieb Michael M. (Kraainem BEX), Carrier assembly for mounting a rolled coplanar delay line.
  4. Bartholomew Wesley E. (Layton UT) Tolle Michael C. (Los Angeles CA), Circuit module connection system.
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  7. Sauers, Matthew Carlyle, Consumer electronic device with elastomeric mat.
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  10. Reylek Robert S., Electrical and thermal conducting structure with resilient conducting paths.
  11. Okabayashi Takahiro,JPX ; Yoshizawa Tetsuo,JPX ; Miyazaki Toyohide,JPX ; Kondo Hiroshi,JPX ; Terayama Yoshimi,JPX ; Sakaki Takashi,JPX ; Ikegami Yuichi,JPX ; Kondo Kazuo,JPX ; Tamura Yoichi,JPX ; Nak, Electrical connections using deforming compression.
  12. Takashi Nogami (Tokyo JPX) Masayuki Mitsuhashi (Saitama JPX), Electroconductive rubbery member and elastic connector therewith.
  13. Komaki Shigeki (Nara JPX), Electronic apparatus with a flat panel keyboard unit.
  14. Rolf W. Biernath ; Mark S. Konings ; Robert S. Reylek, Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance.
  15. Takamatsu Toshiaki (Tenri JPX) Funada Fumiaki (Yamatokoriyama JPX) Yasuda Shuhei (Nara JPX) Matsuura Masataka (Tenri JPX), Electronic component with plurality of terminals thereon.
  16. Windschitl David J., Flexible circuit with conductive vias having off-set axes.
  17. Brodsky William Louis ; Kehley Glenn Lee ; Myrto Glenn Edward ; Sherman John Henry, Flexible circuitized interposer with apertured member and method for making same.
  18. Brodsky William Louis ; Kehley Glenn Lee ; Myrto Glenn Edward ; Sherman John Henry, Flexible circuitized interposer with apertured member and method for making same.
  19. Godana, Ken; Erven, Dusty; Foreman, Kevin; Miller, Paul, Flexible electrical connector insert with conductive and non-conductive elastomers.
  20. Godana, Ken; Erven, Dusty; Foreman, Kevin; Miller, Paul, Flexible electrical connector insert with conductive and non-conductive elastomers.
  21. Sado ; Ryoichi ; Tahara ; Kazutoki, Interconnectors.
  22. Smith Graydon E. (13861 18th Ave. SW. Seattle WA 98166) Lewis Barry J. (31511 41st Ave. SW. Federal Way WA 98003), Load-bearing hollow core base panel.
  23. Belanger ; Jr. Thomas Dudley ; Trublowski John ; Bejster Joseph Valentine ; Hughson ; Jr. Douglas, Method and apparatus for providing planar and non-planar compliant electrical connections between adjacent circuits.
  24. Jebens Robert W. (Skillman NJ) Samuels Gerard (Paoli PA), Method for fabricating a printed circuit board assembly and method for the manufacture thereof.
  25. Schade Reinhart (Olching DEX), Method for making contact with the electrode on the adhesive-coated side of an electrical component and the article made.
  26. Ehrfeld Wolfgang (Karlsruhe DEX) Hagmann Peter (Eggenstein-Leopoldshafen DEX) Mnchmeyer Dietrich (Stutensee-Spck DEX) Becker Erwin W. (Karlsruhe DEX), Method for producing connecting elements for electrically joining microelectronic components.
  27. Taneko, Noriaki; Takagi, Tsuyoshi; Takii, Shukichi, Method of fabricating heat dissipating board.
  28. Yokouchi Kishio (Koganei JPX) Ogawa Hiromi (Yokohama JPX) Yokoyama Hiromitsu (Yokohama JPX) Kamehara Nobuo (Machida JPX) Niwa Koichi (Tama JPX) Murakawa Kyohei (Yokohama JPX), Method of forming a ceramic circuit substrate.
  29. Iijima Makoto,JPX ; Wakabayashi Tetsushi,JPX ; Hamano Toshio,JPX ; Minamizawa Masaharu,JPX ; Takenaka Masashi,JPX ; Yamashita Taturou,JPX ; Mizukoshi Masataka,JPX, Method of forming an assembly board with insulator filled through holes.
  30. Hayakawa, Masao; Maeda, Takamichi; Oda, Mituwo, Method of making a through-hole connector.
  31. Alonso Oscar (Westminster CA), Method of making conductive elastomer connector.
  32. Ohnishi Masanori (Katano JPX), Method of manufacturing a hybrid framework consisting of metallic plate and projection made of synthetic resin.
  33. Kamijo Yoshimi (Furukawa JPX) Kato Yoshinori (Furukawa JPX) Ikarashi Masami (Furukawa JPX), Method of manufacturing film-covered terminal.
  34. Yoshizawa Tetsuo (Yokohama JPX) Terayama Yoshimi (Odawara JPX) Kondo Hiroshi (Yokohama JPX) Sakaki Takashi (Tokyo JPX) Haga Shunichi (Yokohama JPX) Ichida Yasuteru (Machida JPX) Konishi Masaki (Ebina, Method of producing electrical connection members.
  35. Chen, Kong-Chen, Method of using conductive elastomer for electrical contacts in an assembly.
  36. Brodsky,William L., Particle distribution interposer and method of manufacture thereof.
  37. Darrow Russell E. (Endicott NY) Funari Joseph (Vestal NY) Kotrch George S. (Endicott NY) Phillips George C. (Endwell NY), Pinned ceramic substrate.
  38. Beaver Richard N. (Angleton TX) Morris Gregory J. (Lake Jackson TX) Pimlott John R. (Sweeny TX) Dang Hiep D. (Lake Jackson TX), Plastic electrochemical cell terminal unit.
  39. Hann William (325 Ashlawn Dr. Norfolk VA 23505) Bosin Sanford D. (P.O. Box 9371 Norfolk VA 23505) White Cecil (1464 Longdale Dr. Norfolk VA 23513), Plastic laminar digitally indexed dental die system.
  40. Togawa Yoshiaki (Ichihara JPX) Matsumoto Masahito (Ibaraki JPX) Nagata Makoto (Ichihara JPX) Yabe Tohru (Ichihara JPX), Plastic-made reinforced structure.
  41. Cayrol Pierre-Henri (20 ; Avenue Beausejour 77500 Chelles FRX), Printed circuits.
  42. Sauers, Matthew Carlyle, Robust consumer electronic device.
  43. Iijima Makoto,JPX ; Wakabayashi Tetsushi,JPX ; Hamano Toshio,JPX ; Minamizawa Masaharu,JPX ; Takenaka Masashi,JPX ; Yamashita Taturou,JPX ; Mizukoshi Masataka,JPX, Semiconductor device and assembly board having through-holes filled with filling core.
  44. Iijima Makoto,JPX ; Wakabayashi Tetsushi,JPX ; Hamano Toshio,JPX ; Minamizawa Masaharu,JPX ; Takenaka Masashi,JPX ; Yamashita Taturou,JPX ; Mizukoshi Masataka,JPX, Semiconductor device and assembly board having through-holes filled with filling core.
  45. Iijima Makoto,JPX ; Wakabayashi Tetsushi,JPX ; Hamano Toshio,JPX ; Minamizawa Masaharu,JPX ; Takenaka Masashi,JPX ; Yamashita Taturou,JPX ; Mizukoshi Masataka,JPX, Semiconductor device and assembly board having through-holes filled with filling core.
  46. Makoto Iijima JP; Tetsushi Wakabayashi JP; Toshio Hamano JP; Masaharu Minamizawa JP; Masashi Takenaka JP; Taturou Yamashita JP; Masataka Mizukoshi JP; Masaru Nukiwa JP; Takao Akai JP, Semiconductor device and method of forming the same.
  47. Clements Ken (Santa Cruz CA), Semiconductor wafer array with electrically conductive compliant material.
  48. Denkinger Charles (18 ; Rue Henri-Mussard ; (P.O. Box 145) 1211 Geneva 17 CHX), Separating wall.
  49. Anthony Thomas R. (Schenectady NY) Connery Richard J. (Liverpool NY) Hoeschele ; Jr. David F. (Boyertown PA), Silicon-on-sapphire body with conductive paths therethrough.
  50. Nekkanty, Srikant; Tran, Donald T.; Murtagian, Gregorio R., Small form factor sockets and connectors.
  51. Gruber Peter Alfred, Solder anchor decal.
  52. Gruber Peter Alfred (Mohegan Lake NY), Solder anchor decal and method.
  53. Chou, Peter Leekuo; Chien, Stephen; Tai, William, Solid state drive (SSD) assembly method.
  54. Chen, Kong-Chen, Split electrical contacts in an electronic assembly.
  55. Pommer Richard J. (El Toro CA) Chiechi John (Irvine CA), Spring grid array interconnection for active microelectronic elements.
  56. Peterson Robert R. (Hudson MA) Schubert Dale W. (Sudbury MA) Cholakis Peter N. (Hopkinton MA), Tactile sensors for robotic gripper and the like.
  57. Kramer James H. (Akron OH), Vibration isolation pad.

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