초록 ▼

Refractory materials with high sintering temperatures are made suitable for use as low temperature setting dry vibration cements, ramming cements, gunning cements, and the like by incorporation therein of up to 4% boric acid and a low temperature softening glass or frit. The lower temperature soften

Refractory materials with high sintering temperatures are made suitable for use as low temperature setting dry vibration cements, ramming cements, gunning cements, and the like by incorporation therein of up to 4% boric acid and a low temperature softening glass or frit. The lower temperature softening frit is finely ground and uniformly mixed with a refractory grain or aggregate. When the mixture is subjected to a temperature as low as 350°C, the frit softens and bonds the refractory grain into a monolithic structure which retains its integrity up to and through the elevated temperatures at which the refractory grains sinter and other high-temperature ceramic bonds form.

대표청구항 ▼

A low temperature setting dry refractory cement raw batch mix comprising from 95 to 99.5% by weight of a refractory grain selected from the group consisting of aluminum oxide, magnesium oxide, silicon carbide, mullite, spinel, and mixtures thereof, and a low temperature setting bond which is a boros

A low temperature setting dry refractory cement raw batch mix comprising from 95 to 99.5% by weight of a refractory grain selected from the group consisting of aluminum oxide, magnesium oxide, silicon carbide, mullite, spinel, and mixtures thereof, and a low temperature setting bond which is a borosilicate glass having an average particle size of approximately 10 microns, said bond being composed, on a weight basis, of 1 to 65% silicon oxide, 5 to 35% boron oxide, 0 to 25% aluminum oxide, 0 to 25% sodium oxide, 0 to 8% potassium oxide, 0 to 15% calcium oxide, 0 to 4% boric acid, 0 to 10% zinc oxide, 0 to 35% lead oxide, 0 to 45% phosphorous pentoxide, 0 to 15% zirconium oxide, 0 to 10% titanium oxide, and 0 to 20% of an inorganic fluorine compound, said bond having a softening range between approximately 350°to 800°C.