이 특허를 인용한 특허 (34)

1. Byrd, Phillip E., Apparatus to prevent damage to probe card.

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2. Byrd,Phillip E., Apparatus to prevent damage to probe card.

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3. Bertin Claude Louis ; Hedberg Erik Leigh ; Sullivan Timothy Dooling ; Tonti William Robert, Chip thermal protection device.

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4. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.

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5. Uhland,Scott A.; Polito,Benjamin F.; Maloney,John M.; Sheppard, Jr.,Norman F.; Herman,Stephen J.; Yomtov,Barry Y., Controlled release device and method using electrothermal ablation.

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6. Santini, Jr.,John T.; Sheppard, Jr.,Norman F.; Young,Chung Chang; Langer,Robert S., Device for the controlled exposure of reservoir-based sensors.

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7. Bertin, Claude L.; Hedberg, Erik L.; Levy, Max G.; Sullivan, Timothy D.; Tonti, William R., Electronic fuse structure and method of manufacturing.

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8. Roberts Joseph A., Environmentally desirable method of manufacturing printed circuits.

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9. Maloney,John M.; Sbiaa,Zouhair; Santini, Jr.,John T.; Sheppard, Jr.,Norman F.; Uhland,Scott A., Fabrication methods and structures for micro-reservoir devices.

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10. Jackson, Warren B.; Taussig, Carl Philip; Perlov, Craig, Flexible hybrid memory element.

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11. Roberts Joseph A., Forming die for manufacturing printed circuits.

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12. Gambino, Jeffrey P.; Lee, Tom C.; Petrunich, Kevin G.; Thomas, David C., Fuse structure having crack stop void, method for forming and programming same, and design structure.

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13. Werner Wolfgang,DEX ; Muller Karlheinz,DEX ; Pohle Holger,DEX, Fusible link in an integrated semiconductor circuit and a memory cell of a semiconductor component.

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14. Werner Wolfgang,DEX ; Muller Karlheinz,DEX ; Pohle Holger,DEX, Fusible link in an integrated semiconductor circuit and process for producing the fusible link.

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15. Uhland,Scott A.; Polito,Benjamin F.; Herman,Stephen J.; Santini, Jr.,John T.; Maloney,John M., Hermetically sealed microchip reservoir devices.

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16. Nicolay Hugh C. (Melbourne Village FL), Integrated circuit fuse.

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17. Murphy Davis W. (Hudson NH) Bonnette Dennis A. (Hudson NH) Stearns Thomas H. (Nashua NH), Laminated conductive material, multiple conductor cables and methods of manufacturing such cables.

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18. Santini, Jr., John T.; Herman, Stephen J., Medical device for sensing glucose.

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19. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Young, Chung Chang; Langer, Robert S., Medical device with reservoir-based sensors.

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20. Brintzinger Axel C. ; Kiewra Edward W. ; Narayan Chandrasekhar ; Radens Carl J., Metal wire fuse structure with cavity.

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21. Brintzinger, Axel C.; Kiewra, Edward W.; Narayan, Chandrasekhar; Radens, Carl J., Metal wire fuse structure with cavity.

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22. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for making reservoir-based sensor device.

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23. Santini, Jr., John T.; Sheppard, Jr., Norman F.; Langer, Robert S.; Young, Chung Chang, Method for operating a reservoir-based sensor device.

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24. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of actuating implanted medical device.

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25. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Göpferich, Achim, Method of controlled drug delivery from implant device.

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26. Ramachandra Govardhan (Sunnyvale CA) Bhatt Kiran M. (Milpitas CA), Method of making improved metal silicide fuse for integrated circuit structure.

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27. Roberts Joseph A. (Grafton NH), Method of manufacturing printed circuits.

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28. Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F., Method of opening reservoir of containment device.

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29. Landolf David, Method of producing circuit board.

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30. Byrd, Phillip E., Method to prevent damage to probe card.

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31. Byrd,Phillip E., Method to prevent damage to probe card.

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32. Byrd,Phillip E., Method to prevent damage to probe card.

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33. Taussig, Carl; Elder, Richard, Techniques for addressing cross-point diode memory arrays.

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34. Pikulski Joseph L. (Westlake CA) Lam Juan F. (Agoura Hills CA), Wire diamond lattice structure for phased array side lobe suppression and fabrication method.

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