초록 ▼

Electrical lead wire connection to a tape electrode is disclosed. Such electrodes are used for transmitting electrical signals through skin. The tape electrode includes a porous substrate material carrying a conductive layer comprised of finely divided silver metal suspended in a “dry”adhesive. An e

Electrical lead wire connection to a tape electrode is disclosed. Such electrodes are used for transmitting electrical signals through skin. The tape electrode includes a porous substrate material carrying a conductive layer comprised of finely divided silver metal suspended in a “dry”adhesive. An electrical lead wire is connected to the conductive layer of the tape electrode by a flat cover member having the same conductive layer on both sides thereof as is carried by the substrate of the tape electrode. One of the conductive layers of the cover member secures the lead wire to the conductive layer of the tape electrode. The other conductive layer of the cover member intimately contacts the skin along with the conductive layer of the tape electrode to provide for good electrical contact therewith when the tape electrode is applied thereto. The adhesive is normally “dry”and is activated at the time of application by a suitable solvent.

대표청구항 ▼

A tape electrode for adhesion to the skin, comprising: a porous substrate; a layer of conductive material and an adhesive matrix carried on one side of said substrate; lead means contacting said conductive layer for connecting said conductive layer to an electrical apparatus; and cover means of a su

A tape electrode for adhesion to the skin, comprising: a porous substrate; a layer of conductive material and an adhesive matrix carried on one side of said substrate; lead means contacting said conductive layer for connecting said conductive layer to an electrical apparatus; and cover means of a substantially flat shape and having two sides, at least one of which is coated with conductive material, said cover means being positioned on said conductive material layer of said substrate so that said lead means is between said cover means and said layer of conductive material on said substrate with the coated side of the cover means member disposed away from the lead means.