초록 ▼

Solid state dual leaf spring transducers are fabricated by batch photolithographic etching techniques from a monocystalline nonmetallic material, such as silicon. Each leaf spring structure includes a leaf spring portion surrounded by a support structure defined by an intervening region of the wafer

Solid state dual leaf spring transducers are fabricated by batch photolithographic etching techniques from a monocystalline nonmetallic material, such as silicon. Each leaf spring structure includes a leaf spring portion surrounded by a support structure defined by an intervening region of the wafer disposed between adjacent leaf spring structures etched into the wafer. A pair of such leaf spring structures with their respective surrounding support structures are joined together in mutually opposed relation to form a composite dual leaf spring transducer structure of the type wherein a pair of leaf spring structures are mechanically coupled together in axially spaced relation along an axis of sensitivity for equal displacement along said axis of sensitivity in response to displacement of either one of the spring structures relative to the support structure. In one embodiment, a third wafer is interposed between the first two opposed wafers, such third wafer having apertures formed therein so that the leaf spring structures are coupled together through the apertures in the third wafer. In another embodiment, conductive capacitive patterns are formed on the leaf spring structures so as to provide a capacitor structure for sensing displacement of the leaf spring structure.

대표청구항 ▼

In a method for fabricating a solid state transducer of the type having a leaf spring structure supported from a support structure in axially spaced relation along an axis of sensitivity, the steps of: forming a leaf spring structure by recessing through a major face of first and second wafer portio

In a method for fabricating a solid state transducer of the type having a leaf spring structure supported from a support structure in axially spaced relation along an axis of sensitivity, the steps of: forming a leaf spring structure by recessing through a major face of first and second wafer portions in accordance with a predetermined leaf spring pattern to define first and second leaf spring structures having deflectable portions supported from respective first and second support structures which allow deflection of said deflectable portions of said leaf spring structures along an axis of sensitivity relative to said support structures in response to a force applied to said leaf spring structures; and joining together said first and second leaf spring structures and said respective first and second support structures in spaced apart relation along an axis of sensitivity so that said first and second leaf spring structures are deflected along the axis of sensitivity by like amounts relative to said respective first and second support structures in response to deflection of either of said first and second spring structures along said axis of sensitivity. The product made by the method of claim 1.